NDL28PFH-9MET TR

2Gb (x8) - DDR3/DDR3L Synchronous DRAM 256M x 8 bit DDR3/3L Synchronous DRAM Overview The 2Gb Double-Data-Rate-3 (DDR3L) DRAMs is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM. The 2Gb chip is organized as 32Mbit x 8 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin for general applications. The chip is designed to comply with all DDR3L DRAM key features, including full backward compatibility to DDR3. Hereafter the device will be referred to as DDR3L for both part numbers. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion. These devices operate with a single +1.35V -0.067V / +0.1V power supply and are available in BGA packages. Features ⚫ JEDEC ⚫ Power Standard Compliant supplies: VDD & VDDQ = +1.35V ⚫ Programmable ⚫ Additive Latency (AL): 0, CL-1, CL-2 ⚫ Backward compatible to VDD & VDDQ = +1.5V ±0.075V ⚫ Programmable ⚫ Operating temperature range: ⚫ Burst ⚫ Output - Industrial (IT): TC = -40~95°C ⚫ Average ⚫ Supports JEDEC clock jitter specification ⚫ Fully synchronous operation ⚫ Fast clock rate: 800/933MHz ⚫ Differential Clock, CK & CK# ⚫ Bidirectional differential data strobe - DQS & DQS# ⚫8 internal banks for concurrent operation ⚫ 8n-bit prefetch architecture ⚫ Pipelined internal architecture ⚫ Precharge Burst lengths: 4, 8 type: Sequential / Interleave - Extended Test (ET): TC = 0~95°C - Automotive (AT): TC = -40~105°C Mode & Extended Mode registers Driver Impedance Control refresh period - 8192 cycles/64ms (7.8us at -40°C ≦ TC ≦ +85°C) - 8192 cycles/32ms (3.9us at +85°C ≦ TC ≦ +95°C) - 8192 cycles/16ms (1.95us at +95°C ≦ Tc ≦ +105°C) ⚫ Write ⚫ ZQ Leveling Calibration ⚫ Dynamic ⚫ RoHS ⚫ Auto ODT (Rtt_Nom & Rtt_WR) compliant Refresh and Self Refresh ⚫ 78-ball 7.5 x 10.5 x 1.0mm FBGA package - Pb and Halogen Free & active power down DISCLAIMER: All product, product specifications, and data are subject to change without notice to improve reliability, function or design, or otherwise. The information provided herein is correct to the best of Insignis Technology Corporation’s knowledge. No liability for any errors, facts or opinions is accepted. Customers must satisfy themselves as to the suitability of this product for their application. No responsibility for any loss as a result of any person placing reliance on any material contained herein will be accepted. NDL.T28PFRv1.9-2Gb(x8)20200403 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P How to Order Function Density IO Pkg Width Type DDR3L 2Gb x8 FBGA Pkg Size Speed & Latency 7.5x10.5(x1.0) 1600-11-11-11 Option Extended Test INSIGNIS PART NUMBER: NDL28PFR-8KET DDR3L 2Gb x8 FBGA 7.5x10.5(x1.0) 1600-11-11-11 Industrial Temp NDL28PFR-8KIT DDR3L 2Gb x8 FBGA 7.5x10.5(x1.0) 1600-11-11-11 Automotive Temp NDL28PFR-8KAT DDR3L 2Gb x8 FBGA 7.5x10.5(x1.0) 1866-13-13-13 Extended Test NDL28PFR-9MET DDR3L 2Gb x8 FBGA 7.5x10.5(x1.0) 1866-13-13-13 Industrial Temp NDL28PFR-9MIT DDR3L 2Gb x8 FBGA 7.5x10.5(x1.0) 1866-13-13-13 Automotive Temp NDL28PFR-9MAT Visit: http://insignis-tech.com/how-to-buy NDL.T28PFRv1.9-2Gb(x8)20200403 2 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Table 1. Speed Grade Information Speed Grade DDR3L-1600 DDR3L-1866 Clock Frequency 800MHz 933MHz CAS Latency 11 13 tRCD (ns) tRP (ns) 13.75 13.91 13.75 13.91 Figure 1. Ball Assignment (FBGA Top View) 1 2 3 A VSS VDD B VSS C … 7 8 9 NC TDQS# VSS VDD VSSQ DQ0 DM/ TDQS VSSQ VDDQ VDDQ DQ2 DQS DQ1 DQ3 VSSQ D VSSQ DQ6 DQS# VDD VSS VSSQ E VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ F NC VSS RAS# CK VSS NC G ODT VDD CAS# CK# VDD CKE H NC CS# WE# A10/AP ZQ NC J VSS BA0 BA2 NC VREFCA VSS K VDD A3 A0 A12/BC# BA1 VDD L VSS A5 A2 A1 A4 VSS M VDD A7 A9 A11 A6 VDD N VSS RESET# A13 A14 A8 VSS NDL.T28PFRv1.9-2Gb(x8)20200403 3 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Figure 2. Block Diagram Row Decoder DLL CLOCK BUFFER CK CK# CKE 32M x 8 CELL ARRAY (BANK #0) Column Decoder CS# RAS# CAS# WE# 32M x 8 CELL ARRAY (BANK #1) Column Decoder Row Decoder COMMAND DECODER CONTROL SIGNAL GENERATOR Row Decoder RESET# 32M x 8 CELL ARRAY (BANK #2) Column Decoder COLUMN COUNTER MODE REGISTER Row Decoder A10/AP A12/BC# 32M x 8 CELL ARRAY (BANK #3) Column Decoder A0-A9 A11 A13-A14 BA0-BA2 Row Decoder ADDRESS BUFFER 32M x 8 CELL ARRAY (BANK #4) REFRESH COUNTER ZQCL ZQCS ZQ CAL Row Decoder Column Decoder 32M x 8 CELL ARRAY (BANK #5) Column Decoder RZQ DQS DQS# TDQS TDQS# DATA STROBE BUFFER Row Decoder VSSQ DQ Buffer 32M x 8 CELL ARRAY (BANK #6) Column Decoder DQ0 Row Decoder ~ DQ7 ODT NDL.T28PFRv1.9-2Gb(x8)20200403 4 DM 32M x 8 CELL ARRAY (BANK #7) Column Decoder 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Figure 3. State Diagram This simplified State Diagram is intended to provide an overview of the possible state transitions and the commands to control them. In particular, situations involving more than one bank, the enabling or disabling of on-die termination, and some other events are not captured in full detail. MRS,MPR, Write Leveling Self Refresh E Initialization from any RESET state ZQCL MRS ZQ Calibration X Reset Procedure SR Power On SR Power applied ZQCL,ZQCS Idle Refreshing REF PD E PD ACT X ACT = Active PRE = Precharge Active Power Down Precharge Power Down Activating PREA = Precharge All PD X MRS = Mode Register Set PD E REF = Refresh RESET = Start RESET Procedure Bank Activating Read = RD, RDS4, RDS8 Read A = RDA, RDAS4, RDAS8 WRITE RE AD WR ITE A Write A = WRA, WRAS4, WRAS8 TE RI W Write = WR, WRS4, WRS8 READ ZQCL = ZQ Calibration Long ZQCS = ZQ Calibration Short READ Writing A AD RE PDE = Enter Power-down PDX = Exit Power-down SRE = Self-Refresh entry SRX = Self-Refresh exit WRITE A READ A MPR = Multi-Purpose Register A ITE WR RE AD A PR E, PR EA Automatic Sequence Command Sequence PRE, PREA EA PR E, PR Writing Precharging NDL.T28PFRv1.9-2Gb(x8)20200403 Reading WRITE 5 Reading 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Ball Descriptions Table 2. Ball Details Symbol Type Description CK, CK# Input Differential Clock: CK and CK# are driven by the system clock. All SDRAM input signals are sampled on the crossing of positive edge of CK and negative edge of CK#. Output (Read) data is referenced to the crossings of CK and CK# (both directions of crossing). CKE Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CK signal. If CKE goes LOW synchronously with clock, the internal clock is suspended from the next clock cycle and the state of output and burst address is frozen as long as the CKE remains LOW. When all banks are in the idle state, deactivating the clock controls the entry to the Power Down and Self Refresh modes. BA0-BA2 Input Bank Address: BA0-BA2 define to which bank the BankActivate, Read, Write, or Bank Precharge command is being applied. A0-A14 Input Address Inputs: A0-A14 is sampled during row address (A0-A14) for Active commands and the column address (A0-A9) for Read/Write commands to select one location out of the memory array in the respective bank. (A10/AP and A12/BC# have additional functions). The address inputs also provide the op-code during Mode Register Set commands. A10/AP Input Auto-Precharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH: Autoprecharge; LOW: no Autoprecharge). A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). A12/BC# Input Burst Chop: A12/BC# is sampled during Read and Write commands to determine if burst chop (on the fly) will be performed. (HIGH - no burst chop; LOW - burst chopped). CS# Input Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the command decoder. All commands are masked when CS# is sampled HIGH. It is considered part of the command code. RAS# Input Row Address Strobe: The RAS# signal defines the operation commands in conjunction with the CAS# and WE# signals and is latched at the crossing of positive edges of CK and negative edge of CK#. When RAS# and CS# are asserted "LOW" and CAS# is asserted "HIGH" either the BankActivate command or the Precharge command is selected by the WE# signal. When the WE# is asserted "HIGH" the BankActivate command is selected and the bank designated by BA is turned on to the active state. When the WE# is asserted "LOW" the Precharge command is selected and the bank designated by BA is switched to the idle state after the precharge operation. CAS# Input Column Address Strobe: The CAS# signal defines the operation commands in conjunction with the RAS# and WE# signals and is latched at the crossing of positive edges of CK and negative edge of CK#. When RAS# is held "HIGH" and CS# is asserted "LOW" the column access is started by asserting CAS# "LOW". Then, the Read or Write command is selected by asserting WE# “HIGH" or “LOW". WE# Input Write Enable: The WE# signal defines the operation commands in conjunction with the RAS# and CAS# signals and is latched at the crossing of positive edges of CK and negative edge of CK#. The WE# input is used to select the BankActivate or Precharge command and Read or Write command. DQS, Input / DQS# Output Bidirectional Data Strobe: Specifies timing for Input and Output data. Read Data Strobe is edge triggered. Write Data Strobe provides a setup and hold time for data and DM. The data strobes DOS is paired with DQS# to provide differential pair signaling to the system during both reads and writes. TDQS Output TDQS# Termination Data Strobe: When TDQS is enabled, DM is disabled, and the TDQS and TDQS# balls provide termination resistance. NDL.T28PFRv1.9-2Gb(x8)20200403 6 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P DM Input Data Input Mask: Input data is masked when DM is sampled HIGH during a write cycle. DM has an optional use as TDQS on the x8. DQ0-DQ7 Input / Output Data I/O: The DQ0-DQ7 input and output data are synchronized with positive and negative edges of DQS and DQS#. TheI/Os are byte-maskable during Writes. ODT Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3L SDRAM. When enabled, ODT is applied to each DQ, DQS, DQS#, DM/TDQS and TDQS# signal. (When TDQS is enabled via Mode Register A11=1 in MR1) The ODT pin will be ignored if Mode-registers, MR1and MR2, are programmed to disable RTT. RESET# Input Active Low Asynchronous Reset: Reset is active when RESET# is LOW, and inactive when RESET# is HIGH. RESET# must be HIGH during normal operation. RESET# is a CMOS rail to rail signal with DC high and low at 80% and 20% of VDD. VDD Supply Power Supply: +1.35V -0.067V/+0.1V. VSS Supply Ground VDDQ Supply DQ Power: +1.35V -0.067V/+0.1V. VSSQ Supply DQ Ground VREFCA Supply Reference voltage for CA VREFDQ Supply Reference voltage for DQ ZQ Supply Reference pin for ZQ calibration. NC - No Connect: These pins should be left unconnected. NDL.T28PFRv1.9-2Gb(x8)20200403 7 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Operation Mode Truth Table The following tables provide a quick reference of available DDR3L SDRAM commands, including CKE power-down modes and bank-to-bank commands. Table 3. Truth Table (Note (1), (2)) Command State CKEn-1(3) CKEn DM BA0-2 A10/AP A0-9, 11, 13-14 A12/BC# Idle(4) H H X V Single Bank Precharge Any H H X V L V All Banks Precharge Any H H X V H Write (Fixed BL8 or BC4) Active(4) H H X V L Write (BC4, on the fly) Active(4) H H X V Write (BL8, on the fly) Active(4) H H X Active(4) H H Active(4) H Active(4) Read (Fixed BL8 or BC4) BankActivate RAS# CAS# WE# L L H H V L L H L V V L L H L V V L H L L L V L L H L L V L V H L H L L X V H V V L H L L H X V H V L L H L L H H X V H V H L H L L Active(4) H H X V L V V L H L H Read (BC4, on the fly) Active(4) H H X V L V L L H L H Read (BL8, on the fly) Active(4) H H X V L V H L H L H Active(4) H H X V H V V L H L H Active(4) H H X V H V L L H L H Active(4) H H X V H V H L H L H (Extended) Mode Register Set Idle H H X V L L L L No-Operation Any H H X V V V V L H H H Device Deselect Any H H X X X X X H X X X Refresh Idle H H X V V V V L L L H SelfRefresh Entry Idle H L X V V V V L L L H SelfRefresh Exit Idle L H X X X X X H X X X V V V V L H H H Power Down Mode Entry Idle H L X X X X X H X X X V V V V L H H H Power Down Mode Exit Any L H X X X X X H X X X V V V V L H H H Data Input Mask Disable Active H X L X X X X X X X X Active H X H X X X X X X X X ZQ Calibration Long Idle H H X X H X X L H H L ZQ Calibration Short Idle X L H H L Write with Autoprecharge (Fixed BL8 or BC4) Write with Autoprecharge (BC4, on the fly) Write with Autoprecharge (BL8, on the fly) Read with Autoprecharge (Fixed BL8 or BC4) Read with Autoprecharge (BC4, on the fly) Read with Autoprecharge (BL8, on the fly) Data Input Mask Enable(5) Row address CS# OP code H H X X L X Note 1: V=Valid data, X=Don't Care, L=Low level, H=High level Note 2: CKEn signal is input level when commands are provided. Note 3: CKEn-1 signal is input level one clock cycle before the commands are provided. Note 4: These are states of bank designated by BA signal. Note 5: DM can be enabled respectively. NDL.T28PFRv1.9-2Gb(x8)20200403 8 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Functional Description The DDR3L SDRAM is a high-speed dynamic random access memory internally configured as an eight-bank DRAM. The DDR3L SDRAM uses an 8n prefetch architecture to achieve high speed operation. The 8n Prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR3L SDRAM consists of a single 8n-bit wide, four clock data transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write operation to the DDR3L SDRAM are burst oriented, start at a selected location, and continue for a burst length of eight or a ‘chopped’ burst of four in a programmed sequence. Operation begins with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be activated (BA0-BA2 select the bank; A0-A14 select the row). The address bit registered coincident with the Read or Write command are used to select the starting column location for the burst operation, determine if the auto precharge command is to be issued (via A10), and select BC4 or BL8 mode ‘on the fly’ (via A12) if enabled in the mode register. Prior to normal operation, the DDR3L SDRAM must be powered up and initialized in a predefined manner. The following sections provide detailed information covering device reset and initialization, register definition, command descriptions and device operation. Figure 4. Reset and Initialization Sequence at Power-on Ramping Ta Tb Tc Td Te Tf Tg Th Ti Tj Tk CK# CK VDD VDDQ tCKSRX T=200μs T=500μs RESET# Tmin=10ns tIS CKE tDLLK tIS COMMAND Note 1 BA tXPR tMRD tMRD tMRD tMOD MRS MRS MRS MRS MR2 MR3 MR1 MR0 tZQinit ZQCL Note 1 VALID tIS ODT VALID tIS Static LOW in case RTT_Nom is enabled at time Tg, otherwise static HIGH or LOW VALID RTT NOTE 1. From time point "Td" until "Tk " NOP or DES commands must be applied between MRS and ZQCL commands. TIME BREAK NDL.T28PFRv1.9-2Gb(x8)20200403 9 Don't Care 2Gb (x8) DDR3L Synchronous DRAM 256Mx8 – NDL28P & NDT28P Power-up and Initialization The Following sequence is required for POWER UP and Initialization 1. Apply power (RESET# is recommended to be maintained below 0.2 x VDD, all other inputs may be undefined). RESET# needs to be maintained for minimum 200us with stable power. CKE is pulled “Low” anytime before RESET# being de-asserted (min. time 10ns). The power voltage ramp time between 300mV to VDDmin must be no greater than 200ms; and during the ramp, VDD>VDDQ and (VDD-VDDQ)