TH58BVG2S3HTA00

FAB_BENAND_1405 NAND FLASH MEMORY SLC NAND & BENAND™ Reliability and Performance Toshiba’s advanced Flash Memory technology offers SLC NAND providing best in class endurance and data retention for sensitive or frequently used data in a system. For long lasting products or systems working with extremely high data throughput between the host and the memory, Toshiba SLC is the optimal solution. Toshiba’s new BENAND™ removes the burden of error correction code (ECC) from the host processor by offering ECC embedded in the hardware while keeping the same specification, high reliability and performance as a raw SLC. APPLICATIONS • • • • Industrial Applications Consumer Electronics Multimedia Applications Smart Metering & Intelligent Lighting FEATURES • • SLC NAND 24nm • 1Gbit – 128Gbit • Extended temperature range • TSOP and BGA package BENAND™ 24nm Built in ECC SLC NAND • 1Gbit – 8Gbit • On chip H/W ECC • Same reliability and performance as to raw SLC • Same Hardware interface and package as raw SLC ADVANTAGES • • • • • • BENEFITS Broad line up to cover customers demand for different densities Leading edge 24nm Technology for cost optimization Long data retention or extreme write/erase performance Small package variation for reduced board space With BENAND™ no ECC operation is required on the host side Produced in the world’s largest, leading edge technology flash factory • • • • Optimal storage solution for long lasting storage of significant data or very frequently changed data Reduced BOM cost due to latest 24nm production technology Supports smaller board size e.g. for mobile devices Using Toshiba BENAND™ it is possible to utilize the latest 24nm SLC NAND flash technology even if the existing platform cannot support higher bit ECC. No hardware or software change necessary. SPECIFICATIONS Product / Features Density SLC NAND BENAND™ (SLC+ECC) 1Gbit – 128Gbit 1Gbit – 8Gbit Technology ECC (Error Correction Code) Temperature Package 24nm Required on Host Side Embedded on Memory Chip -40°C to 85°C 0°C to 70°C TSOP and BGA www.toshiba-components.com www.toshiba-components.com SLC NAND – PRODUCT LIST Density 1Gbit 2Gbit 4Gbit 8Gbit 16Gbit 32Gbit 64Gbit 128Gbit Part Number TC58NVG0S3HTA00 TC58NYG0S3HBAI4 TC58NVG0S3HTAI0 TC58NVG0S3HBAI4 TC58NVG1S3HTA00 TC58NYG1S3HBAI4 TC58NVG1S3HTAI0 TC58NVG1S3HBAI4 TH58NVG2S3HTA00 TC58NVG2S0HTA00 TC58NVG2S0HTAI0 TH58NVG2S3HTAI0 TH58NVG2S3HBAI4 TH58NYG2S3HBAI4 TC58NVG2S0HBAI4 TC58NYG2S0HBAI4 TH58NVG3S0HTA00 TH58NVG3S0HBAI4 TH58NYG3S0HBAI4 TH58NVG3S0HTAI0 TH58NVG4S0FTA20 TH58NYG4S0FBAID TH58NVG4S0FTAK0 TH58NVG4S0FBAID TH58NVG5S0FTA20 TH58NVG5S0FTAK0 TH58NVG6H2HTAK0 TH58NVG7H2HTA20 Techn. 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 32nm 32nm 32nm 32nm 32nm 32nm 24nm 24nm Page Size (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (4096+256)x8 bit (4096+256)x8 bit (2048+128)x8 bit (2048+128)x8 bit (2048+128)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+256)x8 bit (4096+232)x8 bit (4096+232)x8 bit (4096+232)x8 bit (4096+232)x8 bit (4096+232)x8 bit (4096+232)x8 bit (8192+1024)x8 bit (8192+1024)x8 bit Vcc 3.3V 1.8V 3.3V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 1.8V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V ECC 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 8bit/512B 4bit/512B 4bit/512B 4bit/512B 4bit/512B 4bit/512B 4bit/512B 24bit/1024B 24bit/1024B Temperature 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C 0°C to 70°C Package 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 63BGA 9x11 63BGA 9x11 63BGA 9x11 63BGA 9x11 48TSOP 12x20 63BGA 9x11 63BGA 9x11 48TSOP 12x20 48TSOP 12x20 63BGA 10x11 48TSOP 12x20 63BGA 10x11 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 48TSOP 12x20 BENANDTM – PRODUCT LIST Density 1Gbit 2Gbit 4Gbit 8Gbit Part Number Techn. Page Size Vcc ECC Temperature Package TC58BVG0S3HTA00 TC58BYG0S3HBAI4 TC58BVG0S3HTAI0 TC58BVG0S3HBAI4 TC58BVG1S3HTA00 TC58BYG1S3HBAI4 TC58BVG1S3HTAI0 TC58BVG1S3HBAI4 TH58BVG2S3HTA00 TC58BVG2S0HTA00 TH58BYG2S3HBAI4 TC58BYG2S0HBAI4 TH58BVG2S3HTAI0 TC58BVG2S0HTAI0 TC58BVG2S0HBAI4 TH58BVG3S0HTA00 TH58BYG3S0HBAI4 TH58BVG3S0HTAI0 TH58BVG3S0HBAI4 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm 24nm (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (2048+64)x8 bit (4096+128)x 8 bit (2048+64)x8 bit (4096+128)x 8 bit (2048+64)x8 bit (4096+128) x 8 bit (4096+128)x 8 bit (4096+128)x 8 bit (4096+128)x 8 bit (4096+128)x 8 bit (4096+128)x 8 bit 3.3V 1.8V 3.3V 3.3V 3.3V 1.8V 3.3V 3.3V 3.3V 3.3V 1.8V 1.8V 3.3V 3.3V 3.3V 3.3V 1.8V 3.3V 3.3V internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC internal ECC 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 48TSOP 12x20 63BGA 9x11 63BGA 9x11 48TSOP 12x20 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 48TSOP 12x20 63BGA 9x11 *Valid  Q22014 BENANDTM – SLC WITH EMBEDDED ECC FOR BOM REDUCTION AND SYSTEM FLEXIBILITY BENAND™ Raw SLC NAND 24nm 8bit ECC Data read from the SLC is already error corrected HOST SYSTEM Main CPU Memory Controller Raw SLC NAND 43nm Data read from the SLC is not error corrected BENAND™ is a trademark of Toshiba Corporation. Copyright 2014 TOSHIBA corporation. Product specifications are all subject to change without notice. Product design specifications and colours are subject to change without notice and may vary from those shown. Errors and omissions excepted. 1bit ECC www.toshiba-components.com