TC58NYG1S3HBAI6
MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
2 GBIT (256M 8 BIT) CMOS NAND E2PROM
DESCRIPTION
The TC58NYG1S3HBAI6 is a single 1.8V 2Gbit (2,281,701,376 bits) NAND Electrically Erasable and
Programmable Read-Only Memory (NAND E2PROM) organized as (2048 128) bytes 64 pages 2048 blocks.
The device has two 2176-byte static registers which allow program and read data to be transferred between the
register and the memory cell array in 2176-byte increments. The Erase operation is implemented in a single block
unit (128 Kbytes 8 Kbytes: 2176 bytes 64 pages).
The TC58NYG1S3HBAI6 is a serial-type memory device which utilizes the I/O pins for both address and data
input/output as well as for command inputs. The Erase and Program operations are automatically executed, making
the device most suitable for applications such as solid-state file storage, voice recording, image file memory for still
cameras and other systems which require high-density non-volatile memory data storage.
FEATURES
Organization
Memory cell array
Register
Page size
Block size
x8
2176 128K 8
2176 8
2176 bytes
(128K 8K) bytes
Modes
Read, Reset, Auto Page Program, Auto Block Erase, Status Read, Page Copy,
Multi Page Program, Multi Block Erase, Multi Page Copy, Multi Page Read
Mode control
Serial input/output
Command control
Number of valid blocks
Min 2008 blocks
Max 2048 blocks
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Power supply
VCC 1.7V to 1.95V
Access time
Cell array to register 25 s max
Read Cycle Time
25 ns min (CL=30pF)
Program/Erase time
Auto Page Program
Auto Block Erase
300 s/page typ.
3.5 ms/block typ.
Operating current
Read (25 ns cycle)
Program (avg.)
Erase (avg.)
Standby
30 mA max
30 mA max
30 mA max
50 A max
Package
P-VFBGA67-0608-0.80-001
8 bit ECC for each 512Byte is required.
© 2012-2019 KIOXIA Corporation
(Weight: 0.095 g typ.)
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PIN ASSIGNMENT (TOP VIEW)
1
A
2
3
NC
NC
--------
B
NC
WP
ALE
C
NC
NC
RE
D
NC
E
4
--------
6
7
8
NC
NC
NC
--------
--------
CE
WE RY/BY NC
CLE
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
NC
NC
G
NC
I/O1
NC
NC
NC
VCC
--------
VSS
5
NC
H
NC
NC
I/O2
NC
VCC
I/O6
I/O8
NC
J
NC
VSS
I/O3
I/O4
I/O5
I/O7
VSS
NC
K
NC
NC
NC
NC
NC
NC
PIN NAMES
I/O1 to I/O8
I/O port
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
CE
--------
WE
--------
Write enable
RE
Read enable
CLE
Command latch enable
ALE
Address latch enable
--------
WP
--------
RY / BY
© 2012-2019 KIOXIA Corporation
Chip enable
Write protect
Ready/Busy
VCC
Power supply
VSS
Ground
NC
No Connection
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BLOCK DIAGRAM
VCC VSS
Status register
Address register
I/O1
Column buffer
I/O
Control circuit
to
Column decoder
I/O8
Command register
Data register
Sense amp
Row address buffer
decoder
CE
CLE
ALE
Logic control
--------
WE
Control circuit
--------
RE
--------
WP
Row address decoder
--------
Memory cell array
--------
RY / BY
--------
RY / BY
HV generator
ABSOLUTE MAXIMUM RATINGS
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
SYMBOL
RATING
VALUE
UNIT
VCC
Power Supply Voltage
0.6 to 2.5
V
VIN
Input Voltage
0.6 to 2.5
V
VI/O
Input / Output Voltage
PD
Power Dissipation
TSTG
Storage Temperature
TOPR
Operating Temperature
0.6 to VCC 0.3
( 2.5 V)
V
0.3
W
55 to 125
°C
-40 to 85
°C
Note: Avoid locations where the device may be exposed to water (wet, rain, dew condensation, etc)
CAPACITANCE *(Ta 25°C, f 1 MHz)
SYMBOL
PARAMETER
CONDITION
MIN
MAX
UNIT
CIN
Input
VIN 0 V
10
pF
COUT
Output
VOUT 0 V
10
pF
*
This parameter is periodically sampled and is not tested for every device.
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VALID BLOCKS
SYMBOL
NVB
NOTE:
PARAMETER
Number of Valid Blocks
MIN
TYP.
MAX
UNIT
2008
2048
Blocks
The device occasionally contains unusable blocks. Refer to Application Note (13) toward the end of this document.
The first block (Block 0) is guaranteed to be a valid block at the time of shipment.
The specification for the minimum number of valid blocks is applicable over lifetime.
DC OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN
TYP.
MAX
UNIT
1.7
1.95
V
VCC
Power Supply Voltage
VIH
High Level Input Voltage
VCC x 0.8
VCC 0.3
V
VIL
Low Level Input Voltage
0.3*
VCC x 0.2
V
*
2 V (pulse width lower than 20 ns)
DC CHARACTERISTICS (Ta -40 to 85°C, VCC 1.7 to 1.95V)
SYMBOL
PARAMETER
CONDITION
MIN
TYP.
MAX
UNIT
IIL
Input Leakage Current
VIN 0 V to VCC
10
A
ILO
Output Leakage Current
VOUT 0 V to VCC
10
A
30
mA
--------
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
CE VIL, IOUT 0 mA, tRC 25 ns
ICCO1
Serial Read Current
ICCO2
Programming Current
30
mA
ICCO3
Erasing Current
30
mA
ICCS
Standby Current
CE VCC 0.2 V, WP 0 V/VCC
50
A
VOH
High Level Output Voltage
IOH 0.1 mA
VCC – 0.2
V
VOL
Low Level Output Voltage
IOL 0.1 mA
0.2
V
IOL
-------(RY / BY)
Output Current of RY / BY pin VOL 0.2 V
4
mA
© 2012-2019 KIOXIA Corporation
--------
--------
--------
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AC CHARACTERISTICS AND OPERATING CONDITIONS
(Ta -40 to 85°C, VCC 1.7 to 1.95V)
SYMBOL
MIN
MAX
UNIT
CLE Setup Time
12
ns
CLE Hold Time
5
ns
20
ns
CE Hold Time
5
ns
tWP
Write Pulse Width
12
ns
tALS
ALE Setup Time
12
ns
tALH
ALE Hold Time
5
ns
tDS
Data Setup Time
12
ns
tDH
Data Hold Time
5
ns
tWC
Write Cycle Time
25
ns
10
ns
100
ns
20
ns
tCLS
tCLH
tCS
tCH
tWH
tWW
tRR
PARAMETER
--------
CE Setup Time
--------
--------
WE High Hold Time
--------
--------
WP High to WE Low
--------
Ready to RE Falling Edge
--------
tRW
Ready to WE Falling Edge
20
ns
tRP
Read Pulse Width
12
ns
Read Cycle Time
25
ns
20
ns
25
ns
10
ns
10
ns
25
ns
5
ns
60
ns
20
ns
0
ns
10
ns
0
ns
30
ns
30
ns
60
ns
tRC
tREA
tCEA
tCLR
tAR
tRHOH
tRLOH
tRHZ
tCHZ
tCSD
tREH
tIR
tRHW
tWHC
tWHR
--------
RE Access Time
--------
CE Access Time
--------
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
CLE Low to RE Low
--------
ALE Low to RE Low
--------
RE High to Output Hold Time
--------
RE Low to Output Hold Time
--------
RE High to Output High Impedance
--------
CE High to Output High Impedance
--------
CE High to ALE or CLE Don’t Care
--------
RE High Hold Time
--------
Output-High-Impedance-to-RE Falling Edge
--------
--------
--------
--------
--------
--------
RE High to WE Low
WE High to CE Low
WE High to RE Low
--------
tWB
WE High to Busy
100
ns
tRST
Device Reset Time (Ready/Read/Program/Erase)
5/5/10/500
s
*1: tCLS and tALS can not be shorter than tWP
*2: tCS should be longer than tWP + 8ns.
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AC TEST CONDITIONS
CONDITION
PARAMETER
VCC: 1.7 to 1.95V
VCC 0.2 V, 0.2 V
Input level
Input pulse rise and fall time
3 ns
Input comparison level
VCC / 2
Output data comparison level
VCC / 2
CL (30 pF) 1 TTL
Output load
Note:
--------
Busy to ready time depends on the pull-up resistor tied to the RY / BY pin.
(Refer to Application Note (9) toward the end of this document)
PROGRAMMING / ERASING / READING CHARACTERISTICS
(Ta -40 to 85°C, VCC 1.7 to 1.95V)
SYMBOL
PARAMETER
MIN
TYP.
MAX
UNIT
tPROG
Programming Time
300
700
s
tDCBSYW1
Data Cache Busy Time in Write Cache (following 11h)
10
s
tDCBSYW2
Data Cache Busy Time in Write Cache (following 15h)
700
s
N
Number of Partial Program Cycles in the Same Page
4
tBERASE
Block Erasing Time
3.5
10
ms
tR
Memory Cell Array to Starting Address
25
s
tDCBSYR1
Data Cache Busy in Read Cache (following 31h and 3Fh)
25
s
tDCBSYR2
Data Cache Busy in Page Copy (following 3Ah)
30
s
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
NOTES
(2)
(1)
(1) Refer to Application Note (12) toward the end of this document.
(2) tDCBSYW2 depends on the timing between internal programming time and data in time.
Data Output
When tREH is long, output buffers are disabled by /RE=High, and the hold time of data output depends on
tRHOH (25ns MIN). Under this condition, the waveforms look like Normal Serial Read Mode.
When tREH is short, output buffers are not disabled by /RE=High, and the hold time of data output depends
on tRLOH (5ns MIN). Under this condition, output buffers are disabled by the rising edge of CLE, ALE, /CE or
the falling edge of /WE, and waveforms look like Extended Data Output Mode.
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TIMING DIAGRAMS
Latch Timing Diagram for Command/Address/Data
CLE
ALE
-------CE
Setup Time
Hold Time
--------
WE
tDS
tDH
I/O
: VIH or VIL
Command Input Cycle Timing Diagram
CLE
tCLS
tCLH
tCS
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
tCH
--------
CE
tWP
--------
WE
tALS
tALH
ALE
tDS
tDH
I/O
: VIH or VIL
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Address Input Cycle Timing Diagram
tCLS
tCLH
CLE
tCH
tCS
tWC
tWC
tCH
tCS
--------
CE
tWP
tWH
tWP
tWH
tWP
tWP
tWP
tWH
tWP
--------
WE
tALS
tALH
ALE
tDS
I/O
tDH
tDS
CA0 to 7
tDH
tDS
CA8 to 11
tDH
tDS
PA0 to 7
tDH
tDS
PA8 to 15
tDH
PA16
: VIH or VIL
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Data Input Cycle Timing Diagram
tCLS
tCLH
CLE
tCH
tCS
tCS
tCH
--------
CE
tALS
tALH
tWC
ALE
tWP
tWH
tWP
tWP
--------
WE
tDS
I/O
© 2012-2019 KIOXIA Corporation
tDH
tDS
DIN0
tDH
DIN1
8
tDS
tDH
DIN2175
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Serial Read Cycle Timing Diagram
tRC
--------
CE
tRP
tREH
tRP
tCHZ
tRP
--------
RE
tRHZ
tRHOH
tREA
tREA
tRHZ
tRHZ
tRHOH
tREA
tCEA
tRHOH
tCEA
I/O
tRR
--------
RY / BY
: VIH or VIL
Status Read Cycle Timing Diagram
tCLR
CLE
tCLS
tCLH
tCS
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
CE
tWP
tCH
tCEA
--------
WE
tCHZ
tWHC
tWHR
--------
RE
tDS
tDH
tRHOH
tIR
tREA
I/O
tRHZ
Status
output
70h/71h*
--------
RY / BY
: VIH or VIL
*:
70h/71h represent the hexadecimal number
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Read Cycle Timing Diagram
tCLR
CLE
tCLS
tCLH
tCS
tCH
tCLS
tCS
tCLH
tCH
--------
CE
tWC
--------
WE
tALH tALS
tALH tALS
ALE
tR
--------
tRC
tWB
RE
tDS tDH
I/O
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
CA0
to 7
00h
CA8
to 11
PA0
to 7
PA8
to 15
tDS tDH
PA16
tREA
30h
DOUT
N
DOUT
N1
Data out from
Col. Add. N
Col. Add. N
--------
tCEA
tRR
RY / BY
--------
Read Cycle Timing Diagram: When Interrupted by CE
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
tCLR
CLE
tCLS
tCLH
tCS
tCH
tCLS
tCS
tCLH
tCH
--------
CE
tCSD
tWC
--------
WE
tALH
tALS
tALH
tALS
ALE
tR
--------
tWB
RE
tDS tDH
I/O
tRC
00h
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
CA0
to 7
CA8
to 11
PA0
to 7
PA8
to 15
PA16
tDS tDH
30h
tCHZ
tRHZ
tRR
tCEA
tREA D
OUT
N
tRHOH
DOUT
N1
Data out from
Col. Add. N
Col. Add. N
--------
RY / BY
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Read Cycle with Data Cache Timing Diagram (1/2)
tCLR
CLE
tCLS
tCLH
tCLS
tCH
tCS
tCLH
tCLS
tCH
tCS
tCS
tALH tALS
tRW
tCLR
tCLH
tCLS
tCH
tCLH
tCH
tCS
--------
CE
tWC
--------
WE
tALH tALS
tCEA
tCEA
ALE
tR
tDCBSYR1
tRC
tDCBSYR1
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
tWB
RE
tDS tDH
I/O
00h
tDS tDH tDS tDH tDS tDH tDS tDH tDS tDH
CA0
to 7
CA8
to 11
Column address
N*
PA0
to 7
PA8
to 15
PA16
tWB
tDS tDH
tDS tDH
30h
31h
Page address
M
tWB
tRR
tDS tDH
tREA
DOUT
0
DOUT
1
DOUT
31h
tRR
tREA
DOUT
0
Page address
M1
Page address M
--------
RY / BY
Data out from
Col. Add. 0
* The column address will be reset to 0 by the 31h command input.
Data out from
Col. Add. 0
1
Continues to 1
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Read Cycle with Data Cache Timing Diagram (2/2)
tCLR
CLE
tCLS
tCS
tCLR
tCLH
tCLS
tCH
tCS
tCLR
tCLH
tCLS
tCH
tCS
tCLH
tCH
--------
CE
--------
WE
tCEA
tCEA
tCEA
ALE
tDCBSYR1
tDCBSYR1
tRC
tWB
--------
RE
tRC
tDCBSYR1
tWB
tRC
tWB
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
tDS tDH
I/O DOUT
tRR
tDS tDH
tREA
DOUT
0
31h
DOUT
1
DOUT
tRR
tDS tDH
tREA
DOUT
0
31h
DOUT
1
Page address
M2
Page address M 1
DOUT
3Fh
tRR
tREA
DOUT
0
DOUT
1
DOUT
Page address M x
--------
RY / BY
Data out from
Col. Add. 0
Data out from
Col. Add. 0
1
Continues from 1
Data out from
Col. Add. 0
Make sure to terminate the operation with 3Fh command.
of previous page
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Column Address Change in Read Cycle Timing Diagram (1/2)
tCLR
CLE
tCLS tCLH
tCS
tCLS tCLH
tCH
tCH
tCS
--------
CE
tWC
tCEA
--------
WE
tALH tALS
tALH
tALS
ALE
tRC
tR
tWB
--------
RE
I/O
tDS tDH
tDS tDH
tDS tDH
tDS tDH
tDS tDH
tDS tDH
tDS tDH
00h
CA0
to 7
CA8
to 11
PA0
to 7
PA8
to 15
PA16
30h
Column address
A
Page address
P
tRR
tREA
DOUT DOUT
A
A1
DOUT
AN
Page address
P
--------
RY / BY
Data out from
Column address A
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
1
Continues to 1
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TC58NYG1S3HBAI6
Column Address Change in Read Cycle Timing Diagram (2/2)
tCLR
CLE
tCLS
tCLH
tCS
tCH
tCLS
tCS
tCLH
tCH
--------
CE
tRHW
tCEA
tWC
--------
WE
tALH tALS
tALH
tALS
ALE
tWHR
tRC
--------
RE
tDS tDH
tDS tDH
tDS tDH
tDS tDH
tREA
tIR
DOUT
AN
I/O
05h
CA0
to 7
CA8
to 11
DOUT
B
E0h
DOUT
B1
DOUT
B N’
Page address
P
Column address
B
--------
RY / BY
Data out from
Column address B
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
1
Continues from 1
of previous page
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TC58NYG1S3HBAI6
Data Output Timing Diagram
CLE
tCLS
tCLH
tCS
tCH
--------
CE
--------
WE
tALH
ALE
tRC
tRP
tCHZ
tREH
tRP
tRP
tRHZ
--------
RE
tREA
tCEA
Dout
tRR
tDS tDH
tRLOH
tRLOH
tREA
I/O
tREA
Dout
tRHOH
Dout
Command
tRHOH
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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Auto-Program Operation Timing Diagram
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tALS
tPROG
tALS
tWB
tRW
ALE
--------
RE
I/O
tDS
tDS
tDS tDH
tDS tDH
80h
CA0
to 7
tDH
tDH
CA8
to 11
PA0
to 7
PA8 PA16
to 15
DINN
DIN
N+1
DINM*
10h
70h
Status
output
Column address
N
--------
RY / BY
: Do not input data while data is being output.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
: VIH or VIL
* M: up to 2175
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Auto-Program Operation with Data Cache Timing Diagram (1/3)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tDCBSYW2
tALS
tWB
tALS
ALE
--------
RE
I/O
tDS
tDS tDH
tDS tDH
80h
CA0
to 7
tDS
tDH
CA8
to 11
PA0
to 7
PA8
to 15
PA16
DINN
tDH
DIN
N+1
Column address
N
15h
80h
CA0
to 7
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
1
: Do not input data while data is being output.
Continues to
: VIH or VIL
1
of next page
* M: up to 2175
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Auto-Program Operation with Data Cache Timing Diagram (2/3)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tALS
tDCBSYW2
tALS
tWB
ALE
--------
RE
tDS
tDS tDH
tDS tDH
80h
CA0
to 7
I/O
tDS
tDH
CA8
to 11
PA0
to 7
PA8
to 15
PA16
DINN
tDH
DIN
N+1
Column address
N
15h
80h
CA0
to 7
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Repeat a max of 62 times (in order to program pages 1 to 62 of a block).
1
Continues from
1
of previous page
2
Continues to
2
of next page
: Do not input data while data is being output.
: VIH or VIL
* M: up to 2175
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Auto-Program Operation with Data Cache Timing Diagram (3/3)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tPROG (*1)
tALS
tALS
tWB
ALE
--------
RE
tDS
tDS
tDS tDH
tDS tDH
80h
CA0
to 7
I/O
tDH
tDH
CA8
to 11
PA0
to 7
PA8
to 15
PA16
DINN
DIN
N+1
Column address
N
10h
70h
Status
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
: Do not input data while data is being output.
2
Continues from
: VIH or VIL
2
of previous page
* M: up to 2175
(*1) tPROG: Since the last page’s programming by 10h command is initiated after the previous cache program, the tPROG during cache
programming is given by the following equation.
tPROG tPROG of the last page tPROG of the previous page A
A (command input cycle address input cycle data input cycle time of the last page)
If “A” exceeds the tPROG of previous page, tPROG of the last page is tPROG max.
(Note) Make sure to terminate the operation with 80h-10h command sequence.
If the operation is terminated by 80h-15h command sequence, monitor I/O 6 (Ready / Busy) by issuing the Status Read command (70h)
and make sure the previous page program operation is completed. If the page program operation is completed, issue FFh reset before
the next operation.
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Multi-Page Program Operation with Data Cache Timing Diagram (1/4)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tALS
tDCBSYW1
tALS
tWB
ALE
--------
RE
I/O
tDS
tDS tDH
tDS tDH
80h
CA0
to 7
tDS
tDH
CA8
to 11
Column address
N
PA0
to 7
PA8
to 15
PA16
DINN
tDH
DIN
N+1
Page Address P
District-0
11h
81h
CA0
to 7
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
1
Repeat a max of 63 times (in order to program pages 0 to 62 of a block).
Continues to
1
of next page
: Do not input data while data is being output.
: VIH or VIL
* M: up to 2175
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Multi-Page Program Operation with Data Cache Timing Diagram (2/4)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tDCBSYW2
tALS
tWB
tALS
ALE
--------
RE
tDS
tDS tDH
tDS tDH
81h
CA0
to 7
I/O
tDS
tDH
CA8
to 11
Column address
N
PA0
to 7
PA8
to 15
PA16
DINN
tDH
DIN
N+1
Page Address P
District-1
15h
80h
CA0
to 7
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Repeat a max of 63 times (in order to program pages 0 to 62 of a block).
1
Continues from
1
of previous page
2
Continues to
2
of next page
: Do not input data while data is being output.
: VIH or VIL
* M: up to 2175
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Multi-Page Program Operation with Data Cache Timing Diagram (3/4)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tALS
tDCBSYW1
tALS
tWB
ALE
--------
RE
tDS
I/O
tDS tDH
tDS tDH
80h
CA0
to 7
tDS
tDH
CA8
to 11
PA0
to 7
Column address
N
PA8
to 15
PA16
DINN
Page Address P+n
District-0
tDH
DIN
N+1
11h
81h
CA0
to 7
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
3
2
Continues from
2
of previous page
Continues to
3
of next page
: Do not input data while data is being output.
: VIH or VIL
* M: up to 2175
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Multi-Page Program Operation with Data Cache Timing Diagram (4/4)
tCLS
CLE
tCLS tCLH
tCS
tCS
--------
CE
tCH
--------
WE
tALH
tALH
tALS
tPROG (*1)
tALS
tWB
ALE
--------
RE
tDS
tDS
tDS tDH
tDS tDH
81h
CA0
to 7
I/O
tDH
tDH
CA8
to 11
Column address
N
PA0
to 7
PA8
to 15
PA16
DINN
DIN
N+1
Page Address P+n
District-1
10h
71h
Status
output
DINM*
--------
RY / BY
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
: Do not input data while data is being output.
3
Continues from
: VIH or VIL
3
of previous page
* M: up to 2175
(*1) tPROG: Since the last page’s programming by 10h command is initiated after the previous cache program, the tPROG during cache
programming is given by the following equation.
tPROG tPROG of the last page tPROG of the previous page A
A (command input cycle address input cycle data input cycle time of the last page)
If “A” exceeds the tPROG of previous page, tPROG of the last page is tPROG max.
(Note) Make sure to terminate the operation with 81h-10h command sequence.
If the operation is terminated by 81h-15h command sequence, monitor I/O 6 (Ready / Busy) by issuing the Status Read command (70h)
and make sure the previous page program operation is completed. If the page program operation is completed, issue FFh reset before
the next operation.
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Auto Block Erase Timing Diagram
CLE
tCLS
tCLH
tCS
tCLS
--------
CE
--------
WE
tALH
tALS
tWB
tBERASE
ALE
--------
RE
tDS tDH
I/O
--------
RY / BY
60h
PA0
to 7
PA8
to 15
PA16
Auto Block
Erase Setup
command
D0h
Erase Start
command
Status
output
70h
Busy
Status Read
command
: Do not input data while data is being output.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
: VIH or VIL
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Multi Block Erase Timing Diagram
CLE
tCLS
tCLH
tCS
tCLS
--------
CE
--------
WE
tALH
tALS
tWB
tBERASE
ALE
--------
RE
tDS tDH
I/O
60h
PA0
to 7
PA8
to 15
PA16
D0h
71h
Status
output
--------
RY / BY
Auto Block
Erase Setup
command
Repeat 2 times (District-0,1)
Erase Start
command
Busy
Status Read
command
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
: VIH or VIL
: Do not input data while data is being output.
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ID Read Operation Timing Diagram
tCLS
CLE
tCLS
tCS
tCS
tCH
tCEA
--------
CE
tCH
--------
WE
tALS
tALH
tALH
tAR
ALE
--------
RE
tDH
tDS
I/O
tREA
tREA
tREA
tREA
tREA
90h
00h
98h
AAh
See
Table 5
See
Table 5
See
Table 5
ID Read
command
Address
00
Maker code
Device code
3rd Data
4th Data
5th Data
: VIH or VIL
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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PIN FUNCTIONS
The device is a serial access memory which utilizes time-sharing input of address information.
Command Latch Enable: CLE
The CLE input signal is used to control loading of the operation mode command into the internal command
register. The command is latched into the command register from the I/O port on the rising edge of the WE
signal while CLE is High.
--------
Address Latch Enable: ALE
The ALE signal is used to control loading address information into the internal address register. Address
information is latched into the address register from the I/O port on the rising edge of WE while ALE is High.
--------
--------
Chip Enable: CE
The device goes into a low-power Standby mode when CE goes High while the device is in Ready state.
The CE signal is ignored when the device is in Busy state (RY / BY L), such as during a Program, Erase
or Read operation, and will not enter Standby mode even if the CE input goes High.
--------
--------
--------
--------
--------
Write Enable: WE
The WE signal is used to control the acquisition of data from the I/O port.
--------
--------
Read Enable: RE
The RE signal controls serial data output. Data is available tREA after the falling edge of RE.
The internal column address counter is also incremented (Address = Address + 1) on this falling edge.
--------
--------
I/O Port: I/O1 to 8
The I/O1 to 8 pins are used as a port for transferring address, command and input/output data to and from
the device.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
Write Protect: WP
The WP signal is used to protect the device from accidental programming or erasing. The internal voltage
regulator is reset when WP is Low. This signal is usually used to protect the data during the power-on/off
sequence when input signals are invalid.
--------
--------
--------
Ready/Busy: RY / BY
The RY / BY output signal is used to indicate the operating condition of the device. The RY / BY signal is in
Busy state (RY / BY = L) during the Program, Erase and Read operations and will return to Ready state
(RY / BY = H) after completion of the operation. The output buffer for this signal is an open drain and has to
be pulled up to VCC with an appropriate resistor.
If RY / BY signal is not pulled up to VCC (“Open” state), device operation cannot be guaranteed.
--------
--------
--------
--------
--------
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Schematic Cell Layout and Address Assignment
The Program operation works on page units while the Erase operation works on block units.
I/O1
Data Cache
2048
128
Page Buffer
2048
128
A page consists of 2176 bytes in which 2048 bytes are
used for main memory storage and 128 bytes are for
redundancy or for other uses.
I/O8
1 page 2176 bytes
1 block 2176 bytes 64 pages (128K 8K) bytes
Capacity 2176 bytes 64 pages 2048 blocks
64 Pages1 block
131072
pages
2048 blocks
An address is read in via the I/O port over five
consecutive clock cycles, as shown in Table 1.
8I/O
2176
Table 1. Addressing
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
I/O8
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
CA7
CA6
CA5
CA4
CA3
CA2
CA1
CA0
L
L
L
L
CA11
CA10
CA9
CA8
Third cycle
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Fourth cycle
PA15
PA14
PA13
PA12
PA11
PA10
PA9
PA8
L
L
L
L
L
L
L
PA16
First cycle
Second cycle
Fifth cycle
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CA0 to CA11: Column address
PA0 to PA5: Page address in block
PA6 to PA16: Block address
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Operation Mode: Logic and Command Tables
The operation modes such as Program, Erase, Read and Reset are controlled by command operations
shown in Table 3. Address input, command input and data input/output are controlled by the CLE, ALE, CE,
WE, RE and WP signals, as shown in Table 2.
--------
--------
--------
--------
Table 2. Logic Table
--------
RE
-------*
WP 1
L
H
*
L
L
H
H
L
H
L
H
*
Serial Data Output
L
L
L
H
During Program (Busy)
*
*
*
*
*
H
During Erase (Busy)
*
*
*
*
*
H
*
*
H
*
*
*
*
*
L
H (*2)
H (*2)
*
Program, Erase Inhibit
*
*
*
*
*
L
Standby
*
*
H
*
*
0 V/VCC
--------
CLE
ALE
CE
Command Input
H
L
Data Input
L
Address Input
--------
WE
*
During Read (Busy)
H: VIH, L: VIL, *: VIH or VIL
-------*1: When the WP signal goes Low, Program or Erase is inhibited (Refer to Application Note (10) toward the end of this document).
--------
--------
--------
*2: If CE is Low during Read Busy, WE and RE must be held High to avoid unintended command/address input to the device or read to
the device. Reset or Status Read command can be input during Read Busy.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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Table 3. Command table (HEX)
First Cycle
Second Cycle
Serial Data Input
80
Read
00
30
Column Address Change in Serial Data Output
05
E0
Read with Data Cache
31
Read Start for Last Page in Read Cycle with Data Cache
3F
Auto Page Program
80
10
Column Address Change in Serial Data Input
85
Auto Page Program with Data Cache
80
15
80
11
81
15
81
10
Read for Page Copy (2) with Data Out
00
3A
Auto Program with Data Cache during Page Copy (2)
8C
15
Auto Program for last page during Page Copy (2)
8C
10
Auto Block Erase
60
D0
ID Read
90
Status Read
70
71
FF
Multi Page Program
Status Read for Multi-Page Program or Multi Block Erase
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Reset
Acceptable while Busy
HEX data bit assignment
(Example)
Serial Data Input: 80h
1
0
0
0
0
0
0
8
7
6
5
4
3
2 I/O1
0
Table 4. Read mode operation states
CE
WE
--------
--------
RE
I/O1 to I/O8
Power
L
L
H
L
Data output
Active
L
L
H
H
High impedance
Active
CLE
ALE
Output select
L
Output Deselect
L
--------
H: VIH, L: VIL
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DEVICE OPERATION
Read Mode
Read mode is set when the "00h" and “30h” commands are issued to the Command register. Between the
two commands, a start address for the Read mode needs to be issued. After the initial power on sequence,
“00h” command is latched into the internal command register. Then the Read operation after the power on
sequence is executed by the setting of only five address cycles and “30h” command. The sequence and the
block diagram are shown below (Refer to the timing chart for detail).
CLE
--------
CE
--------
WE
ALE
--------
RE
--------
RY / BY
Column Address M
I/O
Busy
Page Address N
00h
tR
30h
M
M
M+2
Page Address N
Start-address input
Data Cache
M+1
m
Page Buffer
Select page
N
Cell array
A data transfer operation from the cell array to the Data Cache via
-------Page Buffer starts on the rising edge of WE in the 30h command
input cycle (after the address information has been latched). The
device will be in the Busy state during this transfer period.
After the transfer period, the device returns to Ready state. Serial
-------data can be output synchronously with the RE clock from the start
address designated in the address input cycle.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
I/O1 to 8: m 2175
Random Column Address Change in Read Cycle
CLE
--------
CE
--------
WE
ALE
--------
RE
--------
Busy
RY / BY
tR
Col. M
I/O
00h
30h
Col. M
Page N
Select page
N
© 2012-2019 KIOXIA Corporation
M1 M2 M3
Page N
Start from Col. M
Start-address input
M
M
E0h
05h
Col. M’
M’ M’1 M’2 M’3 M’4
Page N
Start from Col. M’
M’
During the serial data output from the Data Cache, the column
address can be changed by inputting a new column address
using the 05h and E0h commands. The data is read out in
serially starting at the new column address. Random Column
Address Change operation can be done multiple times within the
same page.
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Read with Data Cache
The device has a Read with Data Cache that enables the high speed read operation shown below. When the block address changes, this sequence has to be
started from the beginning.
CLE
--------
CE
--------
WE
ALE
--------
RE
--------
RY / BY
1
I/O
00h
30h
Col. M
Data Cache
Page Buffer
tDCBSYR1
tR
31h
Page N
2
0
Column 0
1
2
1
tDCBSYR1
3
2
3
2175
31h
4
0
1
2
3
2175
Page N
1
30h
3Fh
6
Page Address N 1
Page Address N
Page N
0
1
7
2
3
2175
Page Address N 2
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Page N
Page N 2
Page N 1
Page N+1
3
5
4
Cell Array
tDCBSYR1
5
Page N+2
6
7
Page N 1
3
Page N 2
--------
--------
31h & RE clock
31h & RE clock
5
--------
3Fh & RE clock
If the 31h command is issued to the device, the data content of the next page is transferred to the Page Buffer during serial data out from the Data Cache, reducing the tR (Data transfer from memory cell to data
register).
1. Normal read. Data is transferred from Page N to Data Cache through Page Buffer. During this time period, the device outputs Busy state for tR max.
2. After the Ready/Busy signal returns to Ready, 31h command is issued and data is transferred to Data Cache from Page Buffer again. This data transfer takes tDCBSYR1 max and the completion of this time
period can be detected by Ready/Busy signal.
3. Data of Page N 1 is transferred to Page Buffer from cell while the data of Page N in Data Cache can be read out by /RE clock simultaneously.
4. The 31h command makes data of Page N 1 transfer to Data Cache from Page Buffer after the completion of the transfer from cell to Page Buffer. The device outputs Busy state for tDCBSYR1 max.. This Busy
period depends on the combination of the internal data transfer time from cell to Page Buffer and the serial data out time.
5. Data of Page N 2 is transferred to Page Buffer from cell while the data of Page N + 1 in Data Cache can be read out by /RE clock simultaneously.
6. The 3Fh command makes the data of Page N 2 transfer to the Data Cache from the Page Buffer after the completion of the transfer from cell to Page Buffer. The device outputs Busy state for tDCBSYR1 max..
This Busy period depends on the combination of the internal data transfer time from cell to Page Buffer and the serial data out time.
7. Data of Page N 2 in Data Cache can be read out, but since the 3Fh command does not transfer the data from the memory cell to Page Buffer, the device can accept new command input immediately after the
completion of serial data out.
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Multi Page Read Operation
The device has a Multi Page Read operation and Multi Page Read with Data Cache operation.
(1) Multi Page Read without Data Cache
The sequence of command and address input is shown below.
Same page address (PA0 to PA5) within each District has to be selected.
Command
input
(3 cycles)
60
Address input
(3 cycles)
60
Address input
Page Address
PA0 to PA16
(District 0)
A
30
Page Address
PA0 to PA16
(District 1)
tR
A
--------
RY / BY
A
Command
input
(5 cycles)
00
Address input
(2 cycles)
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(District 0)
--------
RY / BY
Data output
B
(District 0)
B
Command
input
(5 cycles)
00
Address input
(2 cycles)
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(District 1)
--------
E0
Column Address
CA0 to CA11
(District 0)
A
B
RY / BY
Address input
Address input
E0
Column Address
CA0 to CA11
(District 1)
Data output
(District 1)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
B
District 0
District 1
Reading
Selected
page
Selected
page
The data transfer operation from the cell array to the Data Cache via Page Buffer starts on the rising edge
-------of WE in the 30h command input cycle (after the 2 Districts’ address information has been latched). The
device will be in the Busy state during this transfer period.
After the transfer period, the device returns to Ready state. Serial data can be output synchronously with
-------the RE clock from the start address designated in the address input cycle.
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(2) Multi Page Read with Data Cache
When the block address changes (increments) this sequence has to be started from the beginning.
The sequence of command and address input is shown below.
Same page address (PA0 to PA5) within each District has to be selected.
Command
input
60
Address input
Address input
60
Page Address
PA0 to PA16
(Page n0 ; District 1)
Page Address
PA0 to PA16
(Page m0 ; District 0)
A
30
tR
A
--------
RY / BY
Command
input
A
--------
RY / BY
A
31
Address input
00
Address input
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(Page m0 ; District 0)
tDCBSYR1
E0
Column Address
CA0 to CA11
(District 0)
Data output
B
(District 0)
B
Command
input
B
Address input
00
Address input
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(Page n0 ; District 1)
--------
RY / BY
E0
Column Address
CA0 to CA11
(District 1)
Data output
C
(District 1)
B
C
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Return to A
Repeat a max of 63 times
Command
input
C
--------
RY / BY
C
3F
Address input
00
Address input
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(Page m63 ; District 0)
tDCBSYR1
E0
Column Address
CA0 to CA11
(District 0)
Data output
D
(District 0)
D
Command
input
D
00
Address input
Address input
05
Column + Page Address
CA0 to CA11, PA0 to PA16
(Page n63 ; District 1)
--------
RY / BY
Column Address
CA0 to CA11
(District 1)
E0
Data output
(District 1)
D
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(3) Notes
(a) Internal addressing in relationto the Districts
To use the Multi Page Read operation, the internal addressing should be considered in relation to the
District.
The device consists of 2 Districts.
Each District consists of 1024 erase blocks.
The allocation rule is as follows:
District 0: Block 0, Block 2, Block 4, Block 6,···, Block 2046
District 1: Block 1, Block 3, Block 5, Block 7,···, Block 2047
(b) Address input restriction for the Multi Page Read operation
There are the following restrictions in using Multi Page Read:
(Restriction)
Maximum one block should be selected from each District.
Same page address (PA0 to PA5) within two Districts has to be selected.
For example:
(60) [District 0, Page Address 0x00000] (60) [District 1, Page Address 0x00040] (30)
(60) [District 0, Page Address 0x00001] (60) [District 1, Page Address 0x00041] (30)
(Acceptance)
There is no order limitation of the District for the address input.
For example, the following operation is accepted:
(60) [District 0] (60) [District 1] (30)
(60) [District 1] (60) [District 0] (30)
It requires no mutual address relation between the selected blocks from each District.
--------
(c) WP signal
-------Make sure WP is held to High when the Multi Page Read operation is performed.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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Auto Page Program Operation
The device carries out an Auto Page Program operation when it receives a "10h" Program command after
the address and data have been input. The sequence of command, address and data input is shown below
(Refer to the detailed timing chart).
CLE
--------
CE
--------
WE
ALE
--------
RE
--------
RY / BY
Din Din Din
80h
I/O
Col. M
Page P
Din
70h
10h
Status
Out
Data
Data input
Program
The data is transferred (programmed) from the Data Cache via the
-------Page Buffer to the selected page on the rising edge of WE following
input of the “10h” command. After programming, the programmed
data is transferred back to the Page Buffer to be automatically
verified by the device. If the programming does not succeed, the
Program/Verify operation is repeated by the device until success is
achieved or until the maximum loop number set in the device is
reached.
Read & verification
Selected
page
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Random Column Address Change in Auto Page Program Operation
The column address can be changed by the 85h command during the data input sequence of the Auto Page
Program operation.
Two address input cycles after the 85h command are recognized as a new column address for the data input.
After the new data is input to the new column address, the 10h command initiates the actual data program into
the selected page automatically. The Random Column Address Change operation can be repeated multiple
times within the same page.
80h
Din
Col. M
Din
Din
Din
85h
Din
Col. M’
Page N
Col. M
Din
Din
Din
10h
70h
Status
Busy
Col. M’
Data input
Program
Read & verification
Selected
page
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Multi Page Program
The device has a Multi Page Program, which enables even higher speed program operation compared to
Auto Page Program. The sequence of command, address and data input is shown below (Refer to the
detailed timing chart).
Although two Districts are programmed simultaneously, Pass/Fail is not available for each page by "70h"
command when the program operation completes. The status bit of I/O 1 is set to “1” when any of the pages
fail. Limitation in addressing with Multi Page Program is shown below.
Multi Page Program
tDCBSYW1
tPROG
--------
RY / BY
”0”
I/O1 to 8
80h
Address & Data Input
CA0 to CA11
PA0 to PA5
PA6
PA7 to PA16
11h
: Valid
: Valid’
: District0’
: Valid’
81h
Note
Address & Data Input
CA0 to CA11
PA0 to PA5
PA6
PA7 to PA16
10h
: Valid
: Valid
: District1
: Valid
70h
I/O1
Pass
”1”
Fail
NOTE: Any command between 11h and 81h is prohibited except 70h and FFh.
80h
11h
81h
10h
Data
Input
District 0
(1024 Block)
Block 0
District 1
(1024 Block)
Block 1
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Block 2
Block 3
Block 2044
Block 2045
Block 2046
Block 2047
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Auto Page Program Operation with Data Cache
The device has an Auto Page Program with Data Cache operation enabling the high speed program operation shown below. When the block address changes,
this sequence has to be started from the beginning.
CLE
--------
CE
--------
WE
ALE
--------
RE
--------
RY / BY
I/O
tDCBSYW2
80h Add Add Add Add Add
Din Din
Page N
Data Cache
Page Buffer
Data for Page N
1
Din
1
15h
70h
80h
Add Add Add Add
Page N 1
Status Output
2
2
tPROG (NOTE)
tDCBSYW2
3
Din Din
Din
15h
3
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
70h
4
80h
4
Din Din
Page N P
Status Output
5
Data for Page N 1
Add Add Add Add Add
Din
5
10h
70h
6
Status Output
Data for Page N P
Data for Page N 1
Data for Page N
3
Cell Array
Page N
5
6
Page N 1
Page N P 1
Page N P
Issuing the 15h command to the device after serial data input initiates the program operation with Data Cache.
1.
2.
3.
4.
5.
6.
Data for Page N is input to Data Cache.
Data is transferred to the Page Buffer by the 15h command. During the transfer the Ready/Busy signal outputs Busy state (tDCBSYW2).
Data is programmed to the selected page while the data for Page N 1 is input to the Data Cache.
By the 15h command, the data in the Data Cache is transferred to the Page Buffer after the programming of Page N is completed. The device outputs Busy state from the 15h command until the Data Cache
becomes empty. The duration of this period depends on timing between the internal programming of Page N and serial data input for Page N 1 (tDCBSYW2).
Data for Page N P is input to the Data Cache while the data of the Page N P 1 is being programmed.
The programming with Data Cache is terminated by the 10h command. When the device becomes Ready state, it shows that the internal programming of the Page N P is completed.
NOTE: Since the last page’s programming by the 10h command is initiated after the previous cache program, the tPROG during cache programming is given by the following:
tPROG tPROG for the last page tPROG of the previous page ( command input cycle address input cycle data input cycle time of the last page)
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Pass/Fail status for each page programmed by the Auto Page Program with Data Cache operation can be detected by the Status Read operation.
I/O1: Pass/Fail of the current page program operation.
I/O2: Pass/Fail of the previous page program operation.
The Pass/Fail status on I/O1 and I/O2 are valid under the following conditions.
Status on I/O1: Page Buffer Ready/Busy is Ready.
The Page Buffer Ready/Busy is output on I/O6 by Status Read operation or RY / BY pin after the 10h command.
Status on I/O2: Data Cache Read/Busy is Ready.
The Data Cache Ready/Busy is output on I/O7 by Status Read operation or RY / BY pin after the 15h command.
--------
--------
Example)
I/O2
=>
Invalid
Page 1
Page 1
Page N 2
Invalid
Page N 1
I/O1
=>
Invalid
Invalid
Page 2
Invalid
Invalid
Page N
80h…15h
70h
Status
Out
Page 1
80h…15h
70h
Status
Out
Page 2
70h
Status
Out
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
80h…15h
70h
Status
Out
Page N 1
80h…10h
70h
Status
Out
70h
Status
Out
Page N
--------
RY / BY pin
Data Cache Busy
Page Buffer Busy
Page 1
Page 2
Page N 1
Page N
If the Page Buffer Busy returns to Ready before the next 80h command input and Status Read is done during this Ready
period, the Status Read provides the Pass/Fail result for Page 2 on I/O1 and the Pass/Fail result for Page1 on I/O2.
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Multi Page Program with Data Cache
The device has a Multi Page Program with Data Cache operation, which enables an even higher speed
program operation compared to Auto Page Program with Data Cache as shown below. When the block
address changes (increments) this sequence has to be started from the beginning.
The sequence of command, address and data input is shown below (Refer to the detailed timing chart).
Data input
command
80
Data input
command
Dummy
Program for multi-page
program
command
11
Address Data input
0 to 2175
input
(District 0)
Program with
Data Cache
command
81
Data input
command
15
Dummy
Program
command
80
11
Address Data input
0 to 2175
input
(District 0)
Address Data input
0 to 2175
input
(District 1)
Data input
command
for multi-page
program
Auto Page
Program
command
81
10
Address Data input
0 to 2175
input
(District1)
--------
RY / BY
After either “15h” or “10h” Program command is input to the device, physical programing starts as follows.
For details about Auto Page Program with Data Cache, refer to “Auto Page Program Operation with Data
Cache”.
District 0
Program
Selected
page
District 1
Read & verification
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
The data is transferred (programmed) from the page buffer to the selected page on the rising edge of
/WE following input of the “15h” or “10h” command. After programming, the programmed data is
transferred back to the register to be automatically verified by the device. If the programming does not
succeed, the Program/Verify operation is repeated by the device until success is achieved or until the
maximum loop number set in the device is reached.
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By starting the above operation from the 1st page of the selected erase blocks, repeating total of 64 times
while incrementing the page address in the blocks, and then inputting the last page data of the blocks, “10h”
command executes the final programming. Make sure to terminate with 81h-10h command sequence.
In this full sequence, the command sequence is following.
80
11
81
15
80
11
81
15
63th
80
11
81
15
64th
80
11
81
10
1st
After the “15h” or “10h” command, the results of the above operation is shown through the “71h” Status
Read command.
10 or15
71
Pass
I/O
Status Read
command
Fail
--------
RY / BY
The 71h command Status description is as below.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
STATUS
OUTPUT
I/O1
Chip Status1 : Pass/Fail
Pass: 0
Fail: 1
I/O2
District 0 Chip Status1 : Pass/Fail
Pass: 0
Fail: 1
I/O3
District 1 Chip Status1 : Pass/Fail
Pass: 0
Fail: 1
I/O4
District 0 Chip Status2 : Pass/Fail
Pass: 0
Fail: 1
I/O5
District 1 Chip Status2 : Pass/Fail
Pass: 0
Fail: 1
I/O6
Ready/Busy
Ready: 1
Busy: 0
I/O7
Data Cache Ready/Busy
Ready: 1
Busy: 0
I/O8
Write Protect
Protect: 0
© 2012-2019 KIOXIA Corporation
I/O1 describes the Pass/Fail condition of
District 0 and 1(OR data of I/O2 and I/O3).
If one of the Districts fails during Multi
Page Program operation, it shows “Fail”.
I/O2 to 5 show the Pass/Fail condition of
each District. For details on “Chip Status1”
and “Chip Status2”, refer to section “Status
Read”.
Not Protect: 1
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Internal addressing in relation to the Districts
To use the Multi Page Program operation, the internal addressing should be considered in relation to the
District.
The device consists of 2 Districts.
Each District consists of 1024 erase blocks.
The allocation rule is as follows:
District 0: Block 0, Block 2, Block 4, Block 6,···, Block 2046
District 1: Block 1, Block 3, Block 5, Block 7,···, Block 2047
Address input restriction for the Multi Page Program with Data Cache operation
There are the following restrictions in using Multi Page Program with Data Cache:
(Restriction)
Maximum one block should be selected from each District.
Same page address (PA0 to PA5) within two Districts has to be selected.
For example:
(80) [District 0, Page Address 0x00000] (11) (81) [District 1, Page Address 0x00040] (15 or 10)
(80) [District 0, Page Address 0x00001] (11) (81) [District 1, Page Address 0x00041] (15 or 10)
(Acceptance)
There is no order limitation of the District for the address input.
For example, the following operation is accepted:
(80) [District 0] (11) (81) [District 1] (15 or 10)
(80) [District 1] (11) (81) [District 0] (15 or 10)
It requires no mutual address relation between the selected blocks from each District.
Operating restriction during the Multi Page Program with Data Cache operation
(Restriction)
The operation must be terminated with “10h” command.
Once the operation has started, no commands other than the commands shown in the timing diagram are
allowed to be input except for Status Read command and Reset command.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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Page Copy (2)
By using Page Copy (2), data in a page can be copied to another page after the data has been read out.
When the block address changes (increments) this sequence has to be started from the beginning.
Command
input
00
2
Address input
Data output
30
Address
CA0 to CA11, PA0 to PA16
(Page N)
--------
RY / BY
3
8C
Col = 0 start
1
Address input
Data input
Address
CA0 to CA11, PA0 to PA16
(Page M)
15
When changing data,
changed data is input.
4
Data for Page N
Data Cache
Page Buffer
3A
Address
CA0 to CA11, PA0 to PA16
(Page N+P1)
tDCBSYW2
tR
1
Address input
00
2
Data for Page N
3
Data for Page M
Data output
5
tDCBSYR2
4
5
A
Col = 0 start
A
Data for Page N + P1
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Cell Array
Page M
Page N + P1
Page N
Page Copy (2) operation is as follows.
1.
2.
3.
4.
5.
Data for Page N is transferred to the Data Cache.
Data for Page N is read out.
Address for Page M is input. If the data needs to be changed, changed data is input.
Data Cache for Page M is transferred to the Page Buffer.
After the Ready state, Data for Page N P1 is output from the Data Cache while the data of Page M is being programmed.
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Command
input
A
8C
6
Address input
Address
CA0 to CA11, PA0 to PA16
(Page M+R1)
--------
RY / BY
Data input
15
Address input
00
When changing data,
changed data is input.
7
3A
Address
CA0 to CA11, PA0 to PA16
(Page N+P2)
Data output
Col = 0 start
8
00
Address input
Address
CA0 to CA11, PA0 to PA16
(Page N+Pn)
3A
Data output
B
Col = 0 start
9
A
B
tDCBSYW2
6
Data for Page M R1
7
Data for Page M R1
8
tDCBSYR2
tDCBSYR2
9
Data for Page N P2
Data for Page N Pn
Data Cache
Page Buffer
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Cell Array
Page M R1
Page M Rn 1
Page M + Rn 1
Page M
Page N Pn
Page N P1
6.
7.
8.
9.
Page N + P2
Address for Page (M R1) is input. If the data needs to be changed, changed data is input.
After programming of page M is completed, Data Cache for Page M R1 is transferred to the Page Buffer.
By the 15h command, the data in the Page Buffer is programmed to Page M R1. Data for Page N P2 is transferred to the Data cache.
The data in the Page Buffer is programmed to Page M Rn 1. Data for Page N Pn is transferred to the Data Cache.
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Command
input
B
10
Address input
8C
Data input
Address
CA0 to CA11, PA0 to PA16
(Page M+Rn)
--------
10
70
Status output
11
B
RY / BY
tPROG (*1)
Data Cache
10
Page Buffer
Data for Page M Rn
11
Data for Page M Rn
Page M + Rn
Page M Rn 1
Cell Array
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
10. Address for Page (M Rn) is input. If the data needs to be changed, changed data is input.
11. By issuing the 10h command, the data in the Page Buffer is programmed to Page M Rn.
(*1) Since the last page’s programming by the 10h command is initiated after the previous cache program, the tPROG here will be expected as the following:
tPROG tPROG of the last page tPROG of the previous page ( command input cycle address input cycle + data output/input cycle time of the last page)
NOTE) This operation needs to be executed within District-0 or District-1.
Data input is required only if previous data output needs to be altered.
If the data has to be changed, locate the desired address with the column and page address input after the 8Ch command, and change only the data that needs be changed.
If the data does not have to be changed, data input cycles are not required.
--------
Make sure WP is held to High when the Page Copy (2) operation is performed.
Also make sure the Page Copy operation is terminated with 8Ch-10h command sequence
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Multi Page Copy (2)
By using Multi Page Copy (2), data in two pages can be copied to other pages after the data has been read out.
When each block address changes (increments) this sequence has to be started from the beginning.
Same page address (PA0 to PA5) within two Districts has to be selected.
Command
input
Address input
60
Address input
60
Address
PA0 to PA16
(Page m0 ; District 0)
30
Address input
00
05
Address
CA0 to CA11, PA0 to PA16
(Page m0)
Address
PA0 to PA16
(Page n0 ; District 1)
Address input
E0
A
Data output
Address
CA0 to CA11
(Col = 0)
A
--------
RY / BY
tR
A
00
Address input
05
Address
CA0 to CA11, PA0 to PA16
(Page n0)
--------
RY / BY
--------
B
C
--------
Address
CA0 to CA11
(Col = 0)
Data output
Address input
8C
Data input
B
11
Address
CA0 to CA11, PA0 to PA16
(Page M0 ; District 0)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
B
tDCBSYW1
8C
Address input
Data input
15
60
Address
CA0 to CA11, PA0 to PA16
(Page N0 ; District 1)
Address input
60
Address
PA0 to PA16
(Page m1 ; District 0)
Address input
00
Address input
05
Address input
E0
Address
PA0 to PA16
(Page n1 ; District 1)
C
tDCBSYR2
Data output
Address
CA0 to CA11
(Col = 0)
00
Address input
Address
CA0 to CA11, PA0 to PA16
(Page n1)
C
© 2012-2019 KIOXIA Corporation
C
3A
tDCBSYW2
Address
CA0 to CA11, PA0 to PA16
(Page m1)
RY / BY
E0
A
B
RY / BY
Address input
46
05
Address input
Address
CA0 to CA11
(Col = 0)
E0
Data output
D
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D
Address input
8C
Data input
11
8C
Address
CA0 to CA11, PA0 to PA16
(Page M1 ; District 0)
--------
RY / BY
Address input
60
--------
Address input
60
--------
Address input
00
05
Address
CA0 to CA11, PA0 to PA16
(Page m63)
Address
PA0 to PA16
(Page n63 ; District 1)
Address input
E0
Data output
00
Address input
05
Address input
E0
F
Data output
Address
CA0 to CA11
(Col = 0)
F
Address
CA0 to CA11
(Col = 0)
tDCBSYR2
Address
CA0 to CA11, PA0 to PA16
(Page n63)
RY / BY
E
tDCBSYW2
3A
E
F
E
15
tDCBSYW1
Address
PA0 to PA16
(Page m63 ; District 0)
RY / BY
Data input
Address
CA0 to CA11, PA0 to PA16
(Page N1 ; District 1)
D
E
Address input
8C
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Address input
Data input
G
11
Address
CA0 to CA11, PA0 to PA16
(Page M63 ; District 0)
F
tDCBSYW1
G
Note)
This operation needs to be executed within each District.
G
8C
Address input
Data input
10
Data input is required only if previous data output needs to be altered.
If the data has to be changed, locate the desired address with the column and page address input
after the 8Ch command, and change only the data that needs be changed.
If the data does not have to be changed, data input cycles are not required.
Address
CA0 to CA11, PA0 to PA16
(Page N63 ; District 1)
--------
RY / BY
G
--------
tPROG (*1)
Make sure WP is held to High when the Multi Page Copy (2) operation is performed.
Also make sure the Multi Page Copy operation is terminated with 8Ch-10h command sequence
(*1) tPROG: Since the last page’s programming by 10h command is initiated after the previous cache program, the tPROG during cache programming is given by the following equation.
tPROG tPROG of the last page tPROG of the previous page-A
A (command input cycle address input cycle data output/input cycle time of the last page)
If “A” exceeds the tPROG of previous page, tPROG of the last page is tPROG max.
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Auto Block Erase
The Auto Block Erase operation starts on the rising edge of WE after the Erase Start command “D0h”
which follows the Erase Setup command “60h”. This two-cycle process for Erase operations acts as an
extra layer of protection from accidental erasure of data due to external noise. The device automatically
executes the Erase and Verify operations.
--------
60
D0
Block Address
input: 3 cycles
70
Status Read
command
Erase Start
command
--------
RY / BY
I/O
Pass
Fail
Busy
Multi Block Erase
The Multi Block Erase operation starts by selecting two block addresses before D0h command as in the
below diagram. The device automatically executes the Erase and Verify operations and the result can be
monitored by checking the status with 71h status read command. For details on 71h status read command,
refer to section “Multi Page Program with Data Cache”.
60
Block Address
input: 3 cycles
District 0
--------
RY / BY
60
D0
71
Status Read
command
Block Address Erase Start
input: 3 cycles command
District 1
I/O
Pass
Fail
Busy
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Internal addressing in relation to the Districts
To use the Multi Block Erase operation, the internal addressing should be considered in relation to the
District.
The device consists of 2 Districts.
Each District consists of 1024 erase blocks.
The allocation rule is as follows:
District 0: Block 0, Block 2, Block 4, Block 6,···, Block 2046
District 1: Block 1, Block 3, Block 5, Block 7,···, Block 2047
Address input restriction for the Multi Block Erase
There are the following restrictions in using Multi Block Erase:
(Restriction)
Maximum one block should be selected from each District.
For example:
(60) [District 0] (60) [District 1] (D0)
(Acceptance)
There is no order limitation of the District for the address input.
For example, the following operation is accepted:
(60) [District 1] (60) [District 0] (D0)
It requires no mutual address relation between the selected blocks from each District.
Make sure to terminate the operation with D0h command. If the operation needs to be terminated before
D0h command input, input the FFh reset command to terminate the operation.
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ID Read
The device contains ID codes which can be used to identify the device type, the manufacturer, and features
of the device. The ID codes can be read out under the following timing conditions:
CLE
tCEA
--------
CE
--------
WE
tAR
ALE
--------
RE
I/O
tREA
90h
00h
98h
AAh
See
table 5
See
table 5
See
table 5
ID Read
command
Address 00
Maker code
Device code
3rd Data
4th Data
5th Data
Table 5. Code table
Description
I/O8
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
Hex Data
1st Data
Maker Code
1
0
0
1
1
0
0
0
98h
2nd Data
Device Code
1
0
1
0
1
0
1
0
AAh
3rd Data
Chip Number, Cell Type
1
0
0
1
0
0
0
0
90h
4th Data
Page Size, Block Size,
I/O Width
0
0
0
1
0
1
0
1
15h
5th Data
District Number
0
1
1
1
0
1
1
0
76h
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
3rd Data
Description
Internal Chip Number
Cell Type
I/O8
I/O6
I/O5
I/O4
I/O3
1
2
4
8
0
0
1
1
2 level cell
4 level cell
8 level cell
16 level cell
Reserved
© 2012-2019 KIOXIA Corporation
I/O7
1
49
0
0
I/O2
I/O1
0
0
1
1
0
1
0
1
0
1
0
1
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4th Data
Description
Page Size
(without redundant area)
1 KB
2 KB
4 KB
8 KB
Block Size
(without redundant area)
64 KB
128 KB
256 KB
512 KB
I/O Width
I/O8
I/O7
I/O6
0
0
1
1
x8
x16
I/O5
I/O4
I/O3
I/O2
I/O1
0
0
1
1
0
1
0
1
I/O2
I/O1
1
0
0
1
0
1
0
1
Reserved
0
0
1
I/O4
I/O3
0
0
1
1
0
1
0
1
5th Data
Description
District Number
I/O8
I/O7
I/O6
I/O5
1 District
2 Districts
4 Districts
8 Districts
Reserved
0
1
1
1
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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Status Read
The device automatically implements the execution and verification of the Program and Erase operations.
The Status Read function is used to monitor the Ready/Busy status of the device, determine the result
(pass /fail) of a Program or Erase operation, and determine whether the device is in Protect mode. The
device status is output via the I/O port using RE after a “70h” command input. The Status Read command
can also be used during a Read operation to monitor the Ready/Busy status.
The resulting information is outlined in Table 6.
--------
Table 6. Status output table
Definition
Page Program
Block Erase
Cache Program
Read
Cache Read
Pass/Fail
Pass/Fail
Invalid
Invalid
Pass/Fail
Invalid
I/O1
Chip Status1
Pass: 0
Fail: 1
I/O2
Chip Status 2
Pass: 0
Fail: 1
I/O3
Not Used
0
0
0
I/O4
Not Used
0
0
0
I/O5
Not Used
0
0
0
I/O6
Page Buffer Ready/Busy
Ready: 1
Busy: 0
Ready/Busy
Ready/Busy
Ready/Busy
I/O7
Data Cache Ready/Busy
Ready: 1
Busy: 0
Ready/Busy
Ready/Busy
Ready/Busy
I/O8
Write Protect
Not Protected :1
Not Protected/Protected
Not Protected/Protected
Not Protected/Protected
Protected: 0
The Pass/Fail status on I/O1 and I/O2 is only valid during a Program/Erase operation when the device is in the Ready state.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Chip Status 1:
During an Auto Page Program or Auto Block Erase operation this bit indicates the Pass/Fail result.
During an Auto Page Program with Data Cache operation, this bit shows the Pass/Fail results of the
current page program operation and therefore this bit is only valid when I/O6 shows the Ready state.
Chip Status 2:
This bit shows the Pass/Fail result of the previous page program operation during Auto Page Program
with Data Cache. This status is valid when I/O7 shows the Ready State.
The status output on I/O6 is the same as that of I/O7 if the command input just before 70h is not 15h or
31h.
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An application example with multiple devices is shown in the figure below.
--------
--------
CE1
CE2
--------
--------
CE3
CEN
--------
CEN+1
CLE
ALE
Device
1
--------
WE
--------
Device
2
Device
3
Device
N
Device
N1
RE
I/O1
to I/O8
-------RY / BY
--------
Busy
RY / BY
CLE
ALE
--------
WE
--------
CE1
--------
CEN
--------
RE
I/O
70h
70h
Status on Device 1
Status on Device N
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
System Design Note:
If the RY / BY pin signals from multiple devices are wired together as shown in the diagram, the Status
Read function can be used to determine the status of each individual device.
--------
Reset
The Reset mode stops all operations. For example, in case of a Program or Erase operation, the
internally generated voltage is discharged to 0 volts and the device enters the Wait state.
Reset during a Cache Program/Page Copy may not just stop the most recent page program but it may
also stop the previous program at a page depending on when the FF reset is input.
The response to a “FFh” Reset command input during the various device operations is as follows:
When a Reset (FFh) command is input during Program operation
80
10
FF
00
Internal
generated voltage
--------
RY / BY
tRST (max 10 s)
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When a Reset (FFh) command is input during Erase operation
D0
FF
00
Internal
generated voltage
--------
RY / BY
tRST (max 500 s)
When a Reset (FFh) command is input during Read operation
00
30
FF
00
--------
RY / BY
tRST (max 5 s)
When a Reset (FFh) command is input during Ready
FF
00
--------
RY / BY
tRST (max 5 s)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
When a Status Read command (70h) is input after a Reset
FF
70
I/O status : Pass/Fail Pass
: Ready/Busy Ready
--------
RY / BY
When two or more Reset commands are input in succession
10
(1)
(2)
(3)
FF
FF
FF
--------
RY / BY
The second
© 2012-2019 KIOXIA Corporation
FF
command is invalid, but the third
53
FF
command is valid.
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APPLICATION NOTES AND COMMENTS
Power-on/off sequence
(1)
The timing sequence shown in the figure below is necessary for the power-on/off sequence.
The device’s internal initialization starts after the power supply reaches an appropriate level during the
power-on sequence. During the initialization the device Ready/Busy signal indicates the Busy state as
shown in the figure below. In this time period, the acceptable commands are FFh or 70h.
The WP signal is useful for protecting against data corruption at power-on/off.
--------
1.7 V
VCC
1.5 V
0 V
--------
--------
≥ 1ms
1.7 V
1.5 V
0.5 V
0.5 V
Don’t
care
Don’t
care
Don’t
care
--------
CE, WE, RE
CLE, ALE
--------
WP
VIH
VIL
VIL
1 ms max
1 ms max
Operation
100 s max
100 s max
Invalid
Invalid
Invalid
--------
RY / BY
(2)
Power-on Reset
The following sequence is necessary because some input signals may not be stable at power-on.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Power on
FF
Reset
(3)
Prohibition of unspecified commands
The operation commands are listed in Table 3. Input of a command other than those specified in Table
3 is prohibited. Stored data may be corrupted if an unknown command is entered during the command
cycle.
(4)
Restriction of commands while in the Busy state
During the Busy state, do not input any command except 70h, 71h and FFh.
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(5)
Acceptable commands after Serial Data Input command “80h”
Once the Serial Data Input command “80h” has been input, do not input any command other than the
Column Address Change in Serial Data Input command “85h”, Auto Page Program command “10h”,
Multi Page Program command “11h”, Auto Page Program with Data Cache Command “15h”, or the
Reset command “FFh”.
80
FF
--------
WE
Address input
--------
RY / BY
If a command other than “85h” , “10h” , “11h” , “15h” or “FFh” is input, the Program operation is not
performed and the device operation is set to the mode that the input command specifies.
80
XX
Mode specified by the command.
10
Programming cannot be executed.
Command other than
“85h”, “10h”, “11h”, “15h” or “FFh”
(6)
Addressing for program operation
Within a block, the pages must be programmed consecutively from the LSB (least significant bit) page
of the block to the MSB (most significant bit) page of the block. Random page address programming is
prohibited.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
From the LSB page to MSB page
DATA IN: Data (1)
e.g.) Random page program (Prohibition)
Data (64)
DATA IN: Data (1)
Data register
Data (64)
Data register
Page 0
(1)
Page 0
(2)
Page 1
(2)
Page 1
(32)
Page 2
(3)
Page 2
(3)
Page 31
(32)
Page 31
(1)
Page 63
(64)
Page 63
(64)
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(7)
Status Read during a Read operation
00
00
Command
30
[A]
70
--------
CE
--------
WE
--------
RY / BY
--------
RE
Address N
Status Read
command input
Status Read
Status output
The device status can be read out by inputting the Status Read command “70h” in Read mode. Once
the device has been set to Status Read mode by a “70h” command, the device will not return to Read
mode unless the Read command “00h” is input during [A]. If the Read command “00h” is input during [A],
Status Read mode is reset, and the device returns to Read mode. In this case, data output starts
automatically from address N and address input is unnecessary
(8)
Auto programming failure
80
10
70
Fail
I/O
80
Address Data
M
input
10
Address Data
N
input
80
10
If the programming result for page address M is Fail, do not try to program
the page to address N in another block without the data input sequence.
Because the previous input data has been lost in the Data Cache, the same
input sequence of 80h command, address and data have to be executed.
M
N
(9)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
--------
RY / BY: termination for the Ready/Busy pin (RY / BY)
--------
A pull-up resistor needs to be used for termination because the RY / BY buffer consists of an open drain
circuit.
Ready
VCC
VCC
VCC
Busy
R
Device
--------
tr
tf
RY / BY
CL
VSS
1.5 s
tr
This data may vary from device to device.
We recommend to use this data as a
reference for selecting a resistor value.
tf
1.0 s
15 ns
10 ns
tf
tr
0.5 s
0
VCC 1.8 V
Ta 25°C
CL 30 pF
5 ns
1 K
2 K
3 K
4 K
R
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(10)
--------
Note regarding the WP signal
--------
The Erase and Program operations are automatically reset when WP goes Low. The operations are
enabled and disabled as follows:
Enable Programming
--------
WE
DIN
80
10
--------
WP
--------
RY / BY
tWW (100 ns MIN)
Disable Programming
--------
WE
DIN
80
10
--------
WP
--------
RY / BY
tWW (100 ns MIN)
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Enable Erasing
--------
WE
DIN
60
D0
--------
WP
--------
RY / BY
tWW (100 ns MIN)
Disable Erasing
--------
WE
DIN
60
D0
--------
WP
--------
RY / BY
tWW (100 ns MIN)
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(11)
When six address cycles are input
Although the device may read in a sixth address, it is ignored inside the chip.
Read operation
CLE
--------
CE
--------
WE
ALE
I/O
00h
30h
Ignored
Address input
--------
RY / BY
Program operation
CLE
--------
CE
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
--------
WE
ALE
I/O
80h
Ignored
Address input
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(12)
Several programming cycles on the same page (Partial Page Program)
Each segment can be programmed individually as follows:
1st programming
Data Pattern 1
2nd programming
All 1 s
Data Pattern 2
All 1 s
All 1 s
4th programming
Result
All 1 s
Data Pattern 1
Data Pattern 2
Data Pattern 4
Data Pattern 4
Number of partial program cycles in the same page must not exceed 4.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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(13)
Invalid blocks (bad blocks)
The device occasionally contains unusable blocks. Therefore, the following issues must be recognized:
Bad Block
Bad Block
Please do not perform an erase operation to bad blocks. It may be
impossible to recover the bad block’s information if the information is
erased.
Check if the device has any bad blocks after installation into the system.
Refer to the test flow for bad block detection. Bad blocks which are
detected by the test flow must be managed as unusable blocks by the
system.
A bad block does not affect the performance of good blocks because it
is isolated from the bit lines by select gates.
The number of valid blocks over the device lifetime is as follows:
Valid (Good) Block Number
MIN
TYP.
MAX
UNIT
2008
2048
Blocks
Bad Block Test Flow
Regarding invalid blocks, bad block mark is in whole pages.
Please read one column of any page in each block. If the data of the column is 00(Hex), define the block as a
bad block.
Start
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Block No 1
Fail
Read Check
Pass
Block No. Block No. 1
No
Bad Block *1
Last Block
Yes
End
*1: No erase operation is allowed to detected bad blocks
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(14)
Failure phenomena for Program, Erase and Read operations
The device may fail during a Program or Erase operation.
The following possible failure modes should be considered when implementing a highly reliable system.
FAILURE MODE
DETECTION AND COUNTERMEASURE SEQUENCE
Block
Erase Failure
Status Read after Erase Block Replacement
Page
Programming Failure
Status Read after Program Block Replacement
Read
Bit Error
Check the ECC status at host controller and take appropriate measures such as rewrite in
consideration of Wear Leveling before uncorrectable ECC error occurs.
ECC:
Error Correction Code. 8 bit correction per 512 Bytes is necessary.
Block Replacement
Program
Error occurs
Buffer
memory
Block A
When an error happens in Block A, try to reprogram the
data into another Block (Block B) by loading from an
external buffer. Then, prevent further system accesses
to Block A (by creating a bad block table or by using
another appropriate scheme).
Block B
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Erase
When an error occurs during an Erase operation, prevent future accesses to this bad block
(by creating a table within the system or by using another appropriate scheme).
(15)
Do not turn off the power before the Write/Erase operation is complete. Avoid using the device when the
battery is low. Power shortage and/or power failure before the Write/Erase operation is complete will
cause loss of data and/or damage to data.
(16)
Please refer to KIOXIA soldering temperature profile for details.
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(17)
Reliability Guidance
This reliability guidance is intended to provide some guidance related to using NAND Flash with 8 bit ECC
for each 512 bytes. NAND Flash memory cells are gradually worn out and the reliability level of memory
cells is degraded by repeating Write and Erase operation of ‘0’ data in each block. For detailed reliability
data, please refer to the reliability note for each product.
Although random bit errors may occur during use, it does not necessarily mean that a block is bad.
Generally, a block should be marked as bad when a program status failure or erase status failure is
detected.
The reliability of NAND Flash memory cells during the actual usage on system level depends on the usage
and environmental conditions. KIOXIA adopts the checker pattern data, 0x55 & 0xAA for alternative
Write/Erase cycles, for the reliability test.
Write/Erase Endurance
Write/Erase endurance failures may occur in a cell, page, or block, and are detected by doing a Status
Read after either an Auto Page Program or Auto Block Erase operation. The cumulative bad block
count will increase along with the number of Write/Erase cycles.
Data Retention
The data in NAND Flash memory may change after a certain amount of storage time. This is due to
charge loss or charge gain. After block erasure and reprogramming, the block may become usable
again.
Data Retention time is generally influenced by the number of Write/Erase cycles and temperature.
Data Retention
[Years]
Here is a graph plotting the relationship between Write/Erase Endurance and Data Retention.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
Write/Erase Endurance [Cycles]
Read Disturb
A Read operation may disturb the data in NAND Flash memory. The data may change due to charge
gain. Usually, bit errors occur on other pages in the block, not the page being read. After a large number
of read cycles (between block erases), a tiny charge may build up and can cause a cell to be soft
programmed to another state. After block erasure and reprogramming, the block may become usable
again. Read Disturb capability is generally influenced by the number of Write/Erase cycles.
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(18)
NAND Management
NAND Management such as Bad Block Management, ECC treatment and Wear Leveling, but not limited
to these treatments, should be recognized and incorporated in the system design.
ECC treatment for read data is mandatory against random bit errors, and host should monitor ECC
status to take appropriate measures such as rewrite in consideration of Wear Leveling before
uncorrectable Error occurs. To realize robust system design generally it is necessary to prevent the
concentration of Write/Erase cycles at the specific blocks by adopting Wear Leveling which manages to
distribute Write/Erase cycles evenly among NAND Flash memory. And also it is necessary to avoid
dummy ‘0’ data write, e.g. ‘0’ data padding, which accelerate block endurance degradation.
Continuous Write and Erase cycling with high percentage of '0' bits in data pattern can lead to faster
block endurance degradation.
Example: NAND cell array with ‘0’ data padding
0 : “0” data cell
1 : “1” data cell
0
0
1
1
0
1
0
1
1
1
0
1
0
0
1
0
0
0
1
0
1
1
0
1
0
1
0
0
1
0
1
0
User data area
1
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Remaining area
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
(a) Accelerate block endurance degradation
by fixed dummy “0” data write
© 2012-2019 KIOXIA Corporation
63
0
0
1
1
0
1
0
1
1
1
0
1
0
0
1
0
0
0
1
0
1
1
0
1
0
1
0
0
1
0
1
0
1
1
0
1
0
1
0
1
User data area
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Remaining area
(b) “1” data for Remaining area
(Recommended)
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Package Dimensions
Unit : mm
0.20 S A
P-VFBGA67-0608-0.80-001
8.00
6.50
0.20 S B
INDEX
4
0.15
0.10 S
0.10 S
1.00 max
0.26 0.04
S
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
S AB
0.46 0.05
A B C D E F G H J K
0.80
0.40
1
2
3
4
5
6
7
8
0.40
0.40
A
0.80
0.08
0.45
B
Weight: 0.095 g (typ.)
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Revision History
Date
2012-04-16
2012-10-15
2013-01-18
2018-12-14
Rev.
0.10
0.20
1.00
1.10
2019-10-01 2.00
Description
Preliminary version
Changed “RESTRICTIONS ON PRODUCT USE”, Corrected typo.
Deleted TENTATIVE/TBD notation. Corrected Typo.
Corrected typo and described some notes.
Removed Soldering Temperature and added note in ABSOLUTE MAXIMUM
RATINGS, and added comments in APPLICATION NOTES AND COMMENTS.
Removed the word “Recommended” from the title of DC OPERATING
CONDITIONS and AC CHARACTERISTICS AND OPERATING CONDITIONS.
Renewed Reliability Guidance and added NAND Management.
Changed “RESTRICTIONS ON PRODUCT USE”.
Rebrand as "KIOXIA"
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
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RESTRICTIONS ON PRODUCT USE
KIOXIA Corporation and its subsidiaries and affiliates are collectively referred to as “KIOXIA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
KIOXIA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from KIOXIA. Even with KIOXIA's written
permission, reproduction is permissible only if reproduction is without alteration/omission.
Though KIOXIA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize
risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property,
including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their
own applications, customers must also refer to and comply with (a) the latest versions of all relevant KIOXIA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in
the "Reliability Information" in KIOXIA Corporation’s website and (b) the instructions for the application with which the Product will be used with
or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining
the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information
contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and
(c) validating all operating parameters for such designs and applications. KIOXIA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT
DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY
HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF
HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for
specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities,
equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for automobiles, trains, ships
and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and
escalators, and devices related to power plant. IF YOU USE PRODUCT FOR UNINTENDED USE, KIOXIA ASSUMES NO LIABILITY FOR
PRODUCT. For details, please contact your KIOXIA sales representative or contact us via our website.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by KIOXIA for any infringement
of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property
right is granted by this document, whether express or implied, by estoppel or otherwise.
Information in this datasheet is preliminary and should not be relied on in undertaking system design.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, KIOXIA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING
WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS
ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION,
INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF
INFORMATION, OR NONINFRINGEMENT.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the
design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass
destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations
including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export
and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and
regulations.
Please contact your KIOXIA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please
use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without
limitation, the EU RoHS Directive. KIOXIA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF
NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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