74HC2G126DP,125

74HC2G126; 74HCT2G126 Dual buffer/line driver; 3-state Rev. 5 — 18 December 2013 Product data sheet 1. General description The 74HC2G126; 74HCT2G126 is a dual buffer/line driver with 3-state outputs controlled by the output enable inputs (nOE). Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. 2. Features and benefits  Wide operating voltage from 2.0 V to 6.0 V  Input levels:  For 74HC2G126: CMOS level  For 74HCT2G126: TTL level  Complies with JEDEC standard no. 7A  Symmetrical output impedance  High noise immunity  Low power dissipation  Balanced propagation delays  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Multiple package options  Specified from 40 C to +85 C and 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number 74HC2G126DP Package Temperature range Name Description Version 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; body 3  2  0.5 mm 74HCT2G126DP 74HC2G126DC 74HCT2G126DC 74HC2G126GD 74HCT2G126GD 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 4. Marking Table 2. Marking codes[1] Type number Marking code 74HC2G126DP H26 74HCT2G126DP T26 74HC2G126DC H26 74HCT2G126DC T26 74HC2G126GD H26 74HCT2G126GD T26 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram 2 1 5 7 1Y 1A 2 6 1OE 1 2Y 2A 1 6 EN1 Y A 5 3 3 2OE 7 OE mna947 mna946 Fig 1. Logic symbol Fig 2. mna127 IEC logic symbol Fig 3. Logic diagram (one driver) 6. Pinning information 6.1 Pinning 74HC2G126 74HCT2G126 74HC2G126 74HCT2G126 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 1OE 1 8 VCC 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A 001aak029 Transparent top view 001aad984 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74HC_HCT2G126 Product data sheet Fig 5. Pin configuration SOT996-2 (XSON8) All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 2 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 6.2 Pin description Table 3. Pin description Symbol Pin Description 1OE, 2OE 1, 7 output enable input 1A, 2A 2, 5 data input 1Y, 2Y 6, 3 data output GND 4 ground (0 V) VCC 8 supply voltage 7. Functional description Table 4. Function table[1] Input Output nOE nA nY H L L H H H L X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +7.0 V IIK input clamping current VI < 0.5 V or VI > VCC + 0.5 V [1] - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA IO output current VO = 0.5 V to (VCC + 0.5 V) [1] - 35 mA ICC supply current - 70 mA IGND ground current 70 - mA Tstg storage temperature 65 +150 C - 300 mW total power dissipation Ptot [1] [2] [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K. For XSON8 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 3 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74HC2G126 Min Typ 74HCT2G126 Max Min Typ Unit Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 - VCC V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ Max Min Max VCC = 2.0 V 1.5 1.2 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - V VCC = 2.0 V - 0.8 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 V IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - V IO = 6.0 mA; VCC = 4.5 V 3.84 4.32 - 3.7 - V IO = 7.8 mA; VCC = 6.0 V 5.34 5.81 - 5.2 - V LOW-level output VI = VIH or VIL voltage IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 V IO = 6.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 7.8 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V VI = VCC or GND; VCC = 6.0 V - - 1.0 - 1.0 A - - 5.0 - 10 A 74HC2G126 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL II input leakage current IOZ OFF-state output VI = VIH or VIL; current VO = VCC or GND; VCC = 6.0 V 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 4 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C. Symbol Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions VI = VCC or GND; IO = 0 A; VCC = 6.0 V Min Typ Max Min Max - - 10 - 20 A ICC supply current CI input capacitance - 1.0 - - - pF CO output capacitance - 1.5 - - - pF 74HCT2G126 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - V IO = 6.0 mA 3.84 4.32 - 3.7 - V - 0 0.1 - 0.1 V - 0.16 0.33 - 0.4 V - - 1.0 - 1.0 A VOL LOW-level output VI = VIH or VIL; VCC = 4.5 V voltage IO = 20 A IO = 6.0 mA II input leakage current VI = VCC or GND; VCC = 5.5 V IOZ OFF-state output VI = VIH or VIL; VO = current VCC or GND; VCC = 5.5 V - - 5.0 - 10 ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 10 - 20 A ICC additional supply current per input; VCC = 4.5 V to 5.5 V; VI = VCC  2.1 V; IO = 0 A - - 375 - 410 A CI input capacitance - 1.0 - - - pF CO output capacitance - 1.5 - - - pF 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ[1] Max Min Max VCC = 2.0 V - 35 115 - 135 ns VCC = 4.5 V - 11 23 - 27 ns VCC = 5.0 V; CL = 15 pF - 10 - - - ns VCC = 6.0 V - 8 20 - 23 ns 74HC2G126 tpd propagation delay 74HC_HCT2G126 Product data sheet [2] nA to nY; see Figure 6 All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 5 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8. Symbol Parameter ten enable time Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit Conditions Min Typ[1] Max VCC = 2.0 V - 40 VCC = 4.5 V - 11 - nOE to nY; see Figure 7 VCC = 6.0 V disable time tdis transition time nOE to nY; see Figure 7 power dissipation capacitance 115 - 135 ns 23 - 27 ns 8 20 - 23 ns VCC = 2.0 V - 25 125 - 150 ns VCC = 4.5 V - 12 25 - 30 ns - 10 21 - 26 ns VCC = 2.0 V - 18 75 - 90 ns VCC = 4.5 V - 6 15 - 18 ns - 5 13 - 15 ns output enabled - 11 - - - pF output disabled - 1 - - - pF [2] nY; see Figure 6 VCC = 6.0 V CPD Max [2] VCC = 6.0 V tt Min [2] per buffer; VI = GND to VCC [3] 74HCT2G126 propagation delay tpd [2] nA to nY; see Figure 6 VCC = 4.5 V - 15 30 - 36 ns VCC = 5.0 V; CL = 15 pF - 12 - - - ns - 11 31 - 38 ns ten enable time nOE to nY; see Figure 7; VCC = 4.5 V [2] tdis disable time nOE to nY; see Figure 7; VCC = 4.5 V [2] - 11 35 - 42 ns tt transition time nY; see Figure 6; VCC = 4.5 V [2] - 6 15 - 18 ns CPD power dissipation capacitance per buffer; VI = GND to VCC  1.5 V [3] output enabled - 11 - - - pF output disabled - 1 - - - pF [1] [2] All typical values are measured at Tamb = 25 C. tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL  VCC2  fo) = sum of outputs. 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 6 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 12. Waveforms VI VM nA input GND tPLH tPHL VOH VI 90% VM nY output 10% VOL tTHL tTLH mna948 Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Propagation delay input (nA) to output (nY) and transition time output (nY) VI nOE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna949 Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Table 9. Enable and disable times Measurement points Type Input Output VM VM VX VY 74HC2G126 0.5VCC 0.5VCC VOL + 0.3 V VOH  0.3 V 74HCT2G126 1.3 V 1.3 V VOL + 0.3 V VOH  0.3 V 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 7 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC VCC G VI VO RL S1 open DUT CL RT 001aad983 Test data is given in Table 10. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 8. Table 10. Test circuit for measuring switching times Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74HC2G126 GND to VCC  6 ns 15 pF, 50 pF 1 k open GND VCC 74HCT2G126 GND to 3 V  6 ns 15 pF, 50 pF 1 k open GND VCC 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 8 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Package outline SOT505-2 (TSSOP8) 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 9 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 10. Package outline SOT765-1 (VSSOP8) 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 10 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit(1) mm max nom min A A1 b 0.05 0.35 D E 2.1 3.1 0.5 0.00 0.15 1.9 e e1 0.5 1.5 2.9 L L1 L2 0.5 0.15 0.6 0.3 0.05 0.4 v 0.1 w y 0.05 0.05 y1 0.1 sot996-2_po Outline version References IEC JEDEC JEITA European projection Issue date 07-12-21 12-11-20 SOT996-2 Fig 11. Package outline SOT996-2 (XSON8) 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 11 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT2G126 v.5 20131218 Product data sheet - 74HC_HCT2G126 v.4 Modifications: 74HC_HCT2G126 v.4 Modifications: • For type numbers 74HC2G126GD and 74HCT2G126GD XSON8U has changed to XSON8. 20090924 • Product data sheet - 74HC_HCT2G126 v.3 Table 2: Marking codes table added. 74HC_HCT2G126 v.3 20090507 Product data sheet - 74HC_HCT2G126 v.2 74HC_HCT2G126 v.2 20051215 Product data sheet - 74HC_HCT2G126 v.1 74HC_HCT2G126 v.1 20030303 Product data sheet - - 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 12 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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This document supersedes and replaces all information supplied prior to the publication hereof. 74HC_HCT2G126 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 13 of 15 74HC2G126; 74HCT2G126 NXP Semiconductors Dual buffer/line driver; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74HC_HCT2G126 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 December 2013 © NXP B.V. 2013. All rights reserved. 14 of 15 NXP Semiconductors 74HC2G126; 74HCT2G126 Dual buffer/line driver; 3-state 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 December 2013 Document identifier: 74HC_HCT2G126