2D-024-010A-QFN32-C

2D_024_010A Data Sheet 2D_024_010A 24V 10W DC-DC Converter The Helix Semiconductors MuxCapacitor® 2D_024_010A is a member of the MxC® 200 family of monolithic configurable high voltage switch capacitor DC-DC converters targeted for use in both non-isolated and isolated, buck or boost converter applications. The 2D_024_010A supports a seamless interface to transformerless isolated (TL) low voltage PoL regulators to provide highly efficient DC-DC converter solutions with 10V to 28.5V input voltages for regulated or non-regulated PoL solutions. Consisting of two unique capacitive conversion stages, each capable of providing a separate output voltage, the 2D_024_010A can easily be configured to support TL systems with multiple voltage requirements. Intelligent timing & control optimize power delivery efficiency from noload to maximum power. Applications • • • • • • • • • • • • • PoE: Wireless Access Points, Security Cameras, VoIP Phones IoT & IIoT Gateways Electric & Hybrid Automobiles Industrial Controllers, HVAC Telecom, Data Center Functions 24V to 12V Input/Output Voltage o MuxCap™, G=1/2 o Up to 28V Input Voltage o Up to 2 outputs 24V to 48V Input/Output Voltage Up to 10W Output o Pout = Pout2A + Pout2B Idle Operation: Active, No-Load o 1mW Non-Switching o 48mW Switching 24V to 12V peak efficiency of >96% o > 90% Efficiency @ 10W Maximizes PoL regulator efficiency Fault Detection o Output Over Current o Thermal Shutdown Evaluation Boards, Reference Designs o Transformerless Isolation - TL o Unregulated and Regulated Package Options o 32 pin QFN, 5mm x 5mm o Wire Bond Die MuxCap2A&B Efficiency vs Load Current Efficiency (%) • Features 100 95 90 85 0 0.5 1 1.5 ILoad (A) Helix Semiconductors, 2019 All Rights Reserved 1 3.4.19 2D_024_010A Data Sheet Table of Contents 1 2 3 4 5 5.1 5.2 5.3 5.4 5.5 6 7 7.1 7.2 8 Pin Configuration and Description ........................................................................................................ 3 Absolute Maximum Ratings .................................................................................................................. 5 Recommended Operating Conditions................................................................................................... 5 Electrical Specifications......................................................................................................................... 6 Functional Description .......................................................................................................................... 9 MuxCapacitor Voltage Divider .............................................................................................................. 9 Low Drop-Out Voltage Regulator ........................................................................................................ 10 Under-Voltage Lockout and POR ........................................................................................................ 10 Clock Generator .................................................................................................................................. 10 Thermal Shutdown.............................................................................................................................. 10 Reference System Application ............................................................................................................ 11 Package Drawings ............................................................................................................................... 15 QFN32 Package .................................................................................................................................. 16 Wire-bond Die .................................................................................................................................... 16 Ordering Information .......................................................................................................................... 17 Table of Tables Table 1: 2D_024_010A Pin Assignments ...................................................................................................... 3 Table 2: 2D_024_010A Absolute Maximum Ratings .................................................................................... 5 Table 3: 2D_024_010A Recommended Operating Conditions ..................................................................... 5 Table 4: 2D_024_010A Electrical Characteristics.......................................................................................... 6 Table 5: 2D_024_010A Ordering Information ............................................................................................ 17 Table 6: Revision History ............................................................................................................................. 18 Table of Figures Figure 1: 2D_024_010A QFN32 Pinout ......................................................................................................... 3 Figure 2: VOUT2A, VOUT2B Efficiency .......................................................................................................... 7 Figure 3: VOUT vs Frequency Efficiency........................................................................................................ 7 Figure 4: 2D_024_010A Block Diagram ........................................................................................................ 8 Figure 5: 2D_024_010A Functional Block Diagram....................................................................................... 9 Figure 6: 2D_024_010A Application Schematic .......................................................................................... 12 Figure 7: 2D_024_010A QFN32 Package Drawing ...................................................................................... 16 Helix Semiconductors, 2019 All Rights Reserved 2 3.4.19 2D_024_010A Data Sheet 1 Pin Configuration and Description Figure 1: 2D_024_010A QFN32 Pinout Table 1: 2D_024_010A Pin Assignments Pin No. 1 Name VOUT1 3 EN 5 VDD 6 7 GND VOUTLDO 8 VINLDO 11 RT 12 EXTCLKSEL Description MuxCapacitor 1: Output Pin Attach output capacitor from VOUT1 to PGND1. Device Enable: Input Pin, Internal 2MΩ Pull-Down, 60Vmax 0 = Disable, 1 = Enable Pre-Regulator: Output supply voltage pin Attach 0.1µF capacitor from VDD pin to GND GND for internal reference and analog circuitry LDO: 5V Analog Output pin Attach 4.7µF capacitor from VOUTLDO pin to GND LDO: Input supply voltage pin Connect VINLDO pin to VOUT1 Charge Pump Frequency: Input Pin Add external resistor from RT pin to GND. External Clock Sync Enable: Input Pin, Internal 2MΩ Pull-Down, 30Vmax 0 = Internal Clock, 1 = External Clock Helix Semiconductors, 2019 All Rights Reserved 3 3.4.19 2D_024_010A Data Sheet 13 16 17 18 EXTCLK PGND2B CFLY2BB VOUT2B 19 20 24 25 26 CFLY2BT VIN2B PGND2A CFLY2AB VOUTA2 27 28 29 30 31 32 2,4,9,10, 14,15,21, 22,23 CFLY2AT VIN2A PGND1 CFLY1B VIN1 CFLY1T NC Thermal Pad External Clock Sync: Input pin, Internal 2MΩ Pull-Down Power GND MuxCapacitor 2B: Bottom of flying capacitor MuxCapacitor 2B: Output Pin Attach output capacitor from VOUT2B to PGND2B. MuxCapacitor 2B: Top of flying capacitor MuxCapacitor 2B: DC input voltage supply pin Power GND MuxCapacitor 2A: Bottom of flying capacitor MuxCapacitor 2A: Output Pin Attach output capacitor from VOUT2A to PGND2A. MuxCapacitor 2A: Top of flying capacitor MuxCapacitor 2A: DC input voltage supply pin Power GND MuxCapacitor 1: Bottom of flying capacitor MuxCapacitor 1: DC input voltage supply pin MuxCapacitor 1: Top of flying capacitor No Connect Power GND Helix Semiconductors, 2019 All Rights Reserved 4 3.4.19 2D_024_010A Data Sheet 2 Absolute Maximum Ratings The 2D_024_010A can be exposed to the following extremes without permanent damage to device operation. Performance is not guaranteed at these extremes. Continuous operation at these extremes reduces long term reliability. Table 2: 2D_024_010A Absolute Maximum Ratings Pin VIN1, EN VIN2, VIN3 VINLDO EXTCLK VOUTLDO, VDD, EXTCLKSEL, RT GND to PGND ESD Voltage: Human Body Model ESD Voltage: Charge coupled Model ESD Voltage: Machine Model Storage temperature Junction Temperature 3 Min -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -40 -40 Max 62 31 15 30 6 0.3 2 500 200 125 125 Unit V V V V V V kV V V °C °C Recommended Operating Conditions The 2D_024_010A chip is designed to operate within the design limits specified in the Parametric Specifications when the conditions of the following table are not exceeded. Table 3: 2D_024_010A Recommended Operating Conditions Definition Input Voltage Output Power EN EXTCLK EXTCLKSEL, RT Junction Temperature Min 20 0 0 0 0 -40 Helix Semiconductors, 2019 All Rights Reserved 5 Max 57 15 57 29 5.5 125 Unit V W V V V °C 3.4.19 2D_024_010A Data Sheet 4 Electrical Specifications The electrical characteristics of the Helix Semiconductors 2D_024_010A is tested according to the following criteria: Unless otherwise stated, these specifications apply over: 10V < VIN1 < 28.5V, 10V < VIN2A & VIN2B < 28.5V, 4.5V < VOUTLDO < 5.5, Fsw=100kHz, -40·C < TJ < 85͘͘ ·C. Notes: 1. Min and Max values are valid over Operating Conditions, unless otherwise stated. 2. Typ values are valid at typical Operating Conditions and typical process Parameters. 3. Guaranteed by Design. Table 4: 2D_024_010A Electrical Characteristics Symbol Parameter Condition Min Typ Max Unit 0.3 V A mΩ 1 300 V A mΩ 5 V 60V MuxCapacitor Voltage Divider: VIN1/VOUT1 Vout Iout Rsw Output Voltage Output Current Switch Rdson VIN=4V, Po=0W, Note 3. Note 3. 48 600 30V MuxCapacitor Voltage Divider: VIN2A/VOUT2A and VIN2B/VOUT2B Vout Iout Rsw Output Voltage Output Current Switch Rdson VIN=24V, Po=0W, Note 3. Note 3. 12 VOUTLDO VoutLDO Output Voltage Under Voltage Lockout UVVoutS+ UVVoutSEN+ EN1 VOUTLDO Start VOUTLDO Stop Enable On Thresh. Enable Off Thresh. 5V Rising Trip Level 5V Falling Trip Level Enable Rising Trip Level Enable Falling Trip Level 4.4 4.1 1.14 0.95 4.6 4.2 1.2 1.0 4.8 4.3 1.26 1.05 V V V V 95 230 kHz Clock Generator Fsw Switching Frequency RT=402KΩ,95kHz RT=174KΩ, 220kHz Thermal Shutdown TSD Hyst Thermal Shutdown Hysteresis Note 3. Note 3. Helix Semiconductors, 2019 All Rights Reserved 6 145 20 °C °C 3.4.19 2D_024_010A Data Sheet Figure 2: VOUT2A, VOUT2B Efficiency MuxCap2A&B Efficiency vs Load Current 97 96 Efficiency (%) 95 94 93 92 91 90 89 0 0.2 0.4 0.6 0.8 1 1.2 ILoad (A) Figure 3: VOUT vs Frequency Efficiency Efficiency (%) MuxCap2A&B @ 100kHz & 200kHz Efficiency vs Load Current 97.0 96.0 95.0 94.0 93.0 92.0 91.0 90.0 89.0 88.0 87.0 86.0 100kHz 200kHz 0 0.5 1 1.5 2 ILoad (A) Helix Semiconductors, 2019 All Rights Reserved 7 3.4.19 2D_024_010A Data Sheet Figure 4: 2D_024_010A Block Diagram Helix Semiconductors, 2019 All Rights Reserved 8 3.4.19 2D_024_010A Data Sheet 5 Functional Description The Helix Semiconductors 2D_024_010A DC-DC MuxCapacitor IC is an easy to use, highly efficient DC voltage divider. It combines three MuxCapacitor Voltage Dividers to reduce the input voltage allowing the use of lower voltage / lower cost PoL regulators. Figure 5: 2D_024_010A Functional Block Diagram Each MuxCapacitor stage has its own input and output pins allowing for multiple configurations. All three stages can be connected in series for access to intermediate voltage reduction outputs. Or, the MuxCapacitor stages can be wired in parallel for added output current capability and efficiency. 5.1 MuxCapacitor Voltage Divider The 2D_024_010A Muxcapacitor Voltage Dividers (MCVD) divide the DC voltage present at the VIN2A&B pins to reduced voltages at the VOUT2A, and VOUT2B pins which provides the input voltage to an external POL regulator. Also, the input voltage present at VIN1 is doubled at the VOUT1 output. The MCVD is comprised of two stages, each with a gain of ½ and a third stage with a 2x gain. Each MCVD uses an external flying capacitor, an internal switching circuit, and an external hold capacitor. The switching device is configured to operate the corresponding voltage reduction circuit at charging and discharging phases from a two-phase non-overlapping on-chip clock generator. Helix Semiconductors, 2019 All Rights Reserved 9 3.4.19 2D_024_010A Data Sheet Each MuxCapacitor contains over-current protection. The over-current protection automatically resets once the over-current condition clears. This feature is active at startup enhancing the softstart ramp-up at each VOUTx. 5.2 Low Drop-Out Voltage Regulator An integrated 5V LDO provides the supply voltage for the analog circuits. The 5V LDO is powered from the VINLDO pin. The VINLDO supply voltage range is 7-15V. The 5V LDO uses the bandgap output as the reference voltage to generate the desired output voltage. 5.3 Under-Voltage Lockout and POR The integrated under-voltage lockout circuit monitors the voltages at the 5V LDO output, and the Enable pin. It ensures that the MuxCapacitor outputs remain in the off state whenever one of these signals drop below the set thresholds. Normal operation resumes once these signals rise above their thresholds. The Power-On Ready (POR) signal is generated when each signal reaches their valid logic level. When the POR is asserted the Soft-Start sequence starts. All the UVLO comparators except the enable circuit are disabled when enable is low to achieve the ultra-low power dissipation. 5.4 Clock Generator The integrated clock generator’s switching frequency is programmed with an external resistor (402KΩ typical) connected from the RT pin to GND. The MuxCapacitor switching frequency (Fsw) is calculated as: Fsw (kHz) = 38,190 / External RT Resistor (Kohms) This clock signal can be synchronized to an external clock by using the EXTCLK pin. Switching activity at the EXTCLK pin enables the internal synchronizer. When the synchronizer is enabled (EXTCLKSEL = 1), the MuxCapacitor clock will track the EXTCLK pin switching rate. As the EXTCLK pin frequency slows down, the MuxCapacitor clock slows down. The EXTCLK signal is derived from the external POL’s switch drive signal. This allows the MuxCapacitors to save power as the external switcher slows down due to reduced load demand. The MuxCapacitor switching frequency is ¼ the EXTCLK frequency. 5.5 Thermal Shutdown Temperature sensing is included and provides the signal to an over temperature detector. The trip threshold is set to 145͘͘·C. When trip threshold is exceeded, thermal shutdown turns off the MuxCapacitor outputs and resets the internal soft start. Helix Semiconductors, 2019 All Rights Reserved 10 3.4.19 2D_024_010A Data Sheet The restart is automatically initiated when the sensed temperature drops down within the normal operating range. A 20·C hysteresis is incorporated into the thermal shutdown threshold. The thermal shutdown circuit is disabled when enable is low to achieve the ultra-low power dissipation. 6 Reference System Application The 2D_024_010A is typically paired with the 2I_048_10A to implement a transformerless isolated (TL) power supply. The following system diagrams provide 10W TL application schematics. The 2D_024_010A is shown as a simple DC-DC voltage reduction circuit on the secondary side of the safety barrier isolation interface. Two MuxCapacitor stages are wired in parallel to perform a G=1/2 voltage reduction and improved efficiency. The third MuxCapacitor boosts the input voltage for the internal high side gate drivers and can be tapped for 48V power. While the total power drawn from the 2D_024_010A cannot exceed 10W where Pout = Pout2A + Pout2B, each MuxCapacitor cell has a maximum output current. The Iout_max for VOUT1 cannot exceed 0.1A. The Iout_max for VOUT2A and VOUT2B cannot exceed 1A individually. The last two stages are 180o out of phase to reduce ripple. The MuxCapacitor can be reconfigured as a push/pull driver. This configuration is utilized in the 2I_48_010A’s full bridge driver. Additionally, the push/pull configuration is employed to generate a negtive voltage as shown in the MxC 273 schematic. Efficiency and delivered power are dependent on application circuit implementation, capacitor components, RT frequency and thermal management. Consult the factory for additional design information. Helix Semiconductors, 2019 All Rights Reserved 11 3.4.19 2D_024_010A Data Sheet Figure 6: 2D_024_010A Application Schematic MxC 270-EB-C Helix Semiconductors, 2019 All Rights Reserved 12 3.4.19 2D_024_010A Data Sheet MxC 271-EB-C Helix Semiconductors, 2019 All Rights Reserved 13 3.4.19 2D_024_010A Data Sheet MxC 273-EB-C Helix Semiconductors, 2019 All Rights Reserved 14 3.4.19 2D_024_010A Data Sheet MxC 274-EB-C Helix Semiconductors, 2019 All Rights Reserved 15 3.4.19 2D_024_010A Data Sheet 7 Package Drawings The available packages for the 2D_024_010A are shown in the following drawings. 7.1 QFN32 Package The 2D_024_010A is packaged in a 32-pin 5mm x 5mm QFN package as shown below. Figure 7: 2D_024_010A QFN32 Package Drawing 7.2 Wire-bond Die The 2D_024_010A is available in die form. Please contact factory for information regarding die sales. Helix Semiconductors, 2019 All Rights Reserved 16 3.4.19 2D_024_010A Data Sheet 8 Ordering Information Refer to the following table for package option ordering information. Table 5: 2D_024_010A Ordering Information Part Number 2D-024-10A-QFN32-1 2D-024-10A-WD-1 MxC 270-EB-1 MxC 271-EB-1 MxC 273-EB-1 Description 32 pin 5mm x 5mm QFN Wire Bond Die 48V to 12V Unregulated TL Evaluation Board 6V to 6V Unregulated TL Evaluation Board 48V to 5V Regulated TL Evaluation Board Package QFN Die Eval Board Eval Board Eval Board This product is covered by one or more Helix Semiconductors patents. Patent http://www.helixsemiconductors.com/pages/company/trademarksandpatents Helix Semiconductors, 2019 All Rights Reserved 17 3.4.19 2D_024_010A Data Sheet Table 6: Revision History Date 1.30.19 2.2.19 3.4.19 Revision 1 2 3 Description Initial release Miscellaneous edits Patent disclosure, PoE schematic Operational Headquarters Engineering & Design Office 9980 Irvine Center Drive Suite 100 Irvine, CA 92618 5475 Mark Dabling Blvd. Suite 206 Colorado Springs, CO 80918 Information & Sales 719-594-7098 designs@helixsemiconductors.com 949-748-6057 sales@helixsemiconductors.com Technical Support 949-748-7026 support@helixsemiconductors.com Corporate Headquarters 4808 West Utica Ave. Broken Arrow, OK 74011 Helix Semiconductors, 2019 All Rights Reserved 18 3.4.19