500CHB821FSLE

CERAMIC CAPACITORS Taping CH Series : dimensions Classic HiQ According to ESA Qualified FEATURES ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS • Low ESR, Ultra High-Q, High Self-Resonant Frequencies • RF & Microwave capacitors • Voltage range: 50V - 1,500V • Capacitance range: 0.1pF - 1,000pF • Operating temperature up to 125°C* • Porcelain Capacitors P100 • Laser Marked (optional) • RoHS compliant Electrical specifications Parameter Capacitance Value 0.1pF - 1,000pF A, B, C, D below 10pF F, G, J, K above 10pF See capacitance range chart (100 ± 30) ppm/°C, –55°C to +125°C 106 MΩ min. 2.5 x WVDC for WVDC ≤ 500V 1.8 x WVDC for extended range values ≥ 820pF 1.5 x WVDC for WVDC > 500V none none Tolerances Working voltage (WVDC) Temperature coefficient Insulation Resistance Dielectric Withstanding (test voltage applied for 5 seconds) APPLICATIONS Aging Piezo Effect • Cellular Base Station Amplifiers • Industrial • Medical (MRI) • Scientific Environmental specifications Parameter CIRCUIT APPLICATIONS Value 2,000 hours, +125°C at 2 x WVDC (standard WVDC range) And CHB up to 100pF: 1,000 hours, 175°C at 500V 240 hours, 85% relative humidity at 85°C (ESA/SCC n°3009) 56 days, 93% relative humidity at 40°C 0V, 5V, WVDC Life Test • DC to RF Conversion • Matching Networks • Tuning, Coupling and DC Blocking Moisture Resistance Test 1 Moisture Resistance Test 2 PHYSICAL CHARACTERISTICS * The temperature range for the CHB up to 100pF is upgrated from +125°C to +175°C. • Chip capacitors for surface mounting with copper (non magnetic) or nickel barrier and tinning • Ribbon leads for surface mounting HOW TO ORDER 152 CH B 100 J S 1 L E Voltage code Dielectric Size code Capacitance code Tolerance code Termination code Ribbon code Marking code Tape and reel 500 = 50V 101 = 100V 201 = 200V 251 = 250V 301 = 300V 501 = 500V 601 = 600V 102 = 1,000V 152 = 1,500V CH = (100±30) ppm/°C A = 0505 B = 1111 Please refer to capacitance code given in capacitance range chart A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% See note 1 S = Standard: tin-plated nickel -: no lead or ribbon -: no marking -: no tape and reel Available on size 1111: L = laser marking E = horizontal orientation C = Non-magnetic: tin-plated copper See note 2 1 = Micro-strip ribbons 6 = Radial leads 0.1pF (0R1) non available with these terminations. Please refer to voltage given in capacitance range chart X = verticale orientation CHA: 3,000 components per reel -RoHS The RoHS tag is not part of the reference Tag added at the end of P/N for information CHB: 1,000 components per reel See note 3 Note 1: For capacitance values less than 10pF, tolerances B, C and D available. Tolerance code A available for: A case for capacitance values of 0.1pF - 4.7pF. B case for capacitance values of 0.1pF - 3.3pF. For capacitance values of 10pF or higher, tolerances F, G, J and K available. Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated. Note 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certified types to ensure that only non-magnetic materials are used. Note 4: Ribbon lead styles capacitors are not available in Tape and Reel. Examples: 501 CHB 470 J1L any termination material could be used. 501 CHB 470 JC1L only non-magnetic termination materials could be used. Please consult us for specific requirements. www.exxelia.com 152 Page revised 02/21 CERAMIC CAPACITORS Taping : dimensions General Information CAPACITOR TERMINATIONS AND SOLDERING RECOMMENDATIONS condition. The vapor phase and IR reflow soldering are less aggressive, inducing more restricted thermal shocks. This is the reason why they are preferred to the wave soldering method for reliable applications. In all cases, proper pre-heating is essential. I. TERMINATION TYPES The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of the maximum soldering temperature. While multilayer ceramic capacitors can withstand the peak soldering temperatures for short durations, they should be minimized whenever possible. Our capacitors are delivered with one of the following terminations (for technical reasons, only a limited number of termination types are available in certain cases). All our terminations are backward compatible. Parameter Value Comment Termination Materials A C S non-magnetic (silver-palladium) non-magnetic (pure tin over copper barrier) lead-free (pure tin over nickel barrier) Above precaution given for SMD types are applicable for the implementation of large bare chips (1515 and above). But in general, large bare chips above 2225 are not recommended to be mounted on epoxy printed board due to the thermal expansion mismatch between ceramic capacitor body and epoxy. This is the reason why leaded components will be preferred especially for reliable applications. For information, the typical thermal profiles of these three soldering processes are given hereafter. These typical diagrams are only given as an aid to SMD users in determining specific processes linked to their instrumentations and to their own experience. NB: • terminations type C recommended for non magnetic applications. • termination type A available for non magnetic applications (for historical reason, we have also another code, the code “P”, for the same type of termination. The parts that were designed-in before 2005 might still have a code “P” instead of “A” in the part numbering. But both codes correspond to the same type of termination). NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards. Please, refer to this standard for more information. III.1.1. Vapour Phase Soldering II. SPECIFICATIONS 250°C Care must be taken when using particular terminations: if the terminations are heated up above a particular temperature and/or for too long a period of time, there is a risk of leaching (dissolution of the termination revealing the inner electrodes). 20s ... 40s 230°C 217°C 200°C ca. 60s ... 130s >217°C 150°C The chart below gives the resistance to soldering heat per termination type, based on a SAC387 solder bath at 260°C. Ramp down rate