SMD1206P050TF

ELECTRONICS Positive Thermal Coefficent SMD1206 Series Circuit Protection System Specifications are subject to change without notice. Positive Thermal Coefficent - SMD1206 Series Features 1. I(hold): 0.05~2A 2. RoHS compliant, lead-free and halogen-free 3. Fast response to fault currents 4. Low resistance 5. Low-profile 6. Compact design saves board space 7. Compatible with high temperature solders Applications 1. USB peripherals 2. Disk drives 3. CD-ROMs 4. General electronics 5. Disk drives 6. Set-top-box and HDMI 7. Mobile Internet Device (MID) 8. PDAs / digital cameras 9. Game console port protection 10. Plug and play protection for motherboards and peripherals 11. Mobile phones - battery and port protection Product Name S M Surface Mount Device D 1 2 Device Dimensions: Length/Width (Unit: 1/100 inch) Circuit Protection System 0 6 P 0 0 Polytronics Symbol Current Rating:0.5A 5 T F T: Thin Version (Optional) F: Lead-free / - - Special Voltage Rating (Optional) Specifications are subject to change without notice. Page:1 Positive Thermal Coefficent - SMD1206 Series Dimension A B D Ihold Itrip Type Number A A Maximum Time To Trip Current A Time s C Vmax Imax P Rmin R1max dmax Vdc A W Ω Ω Package Dimensions (mm) Package A B C D min max min max min max min SMD1206P005TF 0.05 0.15 0.25 1.5 60 100 0.4 3.6 50 1206 3 3.5 1.5 1.8 0.6 1.1 0.15 SMD1206P010TF 0.1 0.25 0.5 1 60 100 0.4 1.6 15 1206 3 3.5 1.5 1.8 0.6 1.1 0.15 SMD1206P020TF 0.2 0.46 8 0.08 30 100 0.6 0.35 2.5 1206 3 3.5 1.5 1.8 0.4 0.9 0.15 SMD1206P025TF 0.25 0.5 8 0.08 16 100 0.6 0.35 2.5 1206 3 3.5 1.5 1.8 0.4 0.9 0.15 SMD1206P035TF 0.35 0.75 8 0.1 6 100 0.6 0.25 1.3 1206 3 3.5 1.5 1.8 0.4 0.9 0.15 SMD1206P050TF 0.5 1 8 0.1 6 100 0.6 0.15 0.7 1206 3 3.5 1.5 1.8 0.35 0.85 0.15 SMD1206P050TF/13.2 0.5 1 8 0.1 13.2 100 0.6 0.15 0.7 1206 3 3.5 1.5 1.8 0.35 0.85 0.15 SMD1206P075TF 0.75 1.5 8 0.2 6 100 0.6 0.09 0.5 1206 3 3.5 1.5 1.8 SMD1206P075TF/13.2 0.75 1.5 8 0.2 13.2 100 0.6 0.09 0.5 1206 3 3.5 1.5 1.8 0.45 1.25 0.15 SMD1206P100TF 1 1.8 8 0.3 6 100 0.6 0.055 0.27 1206 3 3.5 1.5 1.8 0.4 0.8 0.15 SMD1206P110TF 1.1 2.2 8 0.3 6 100 0.8 0.04 0.18 1206 3 3.5 1.5 1.8 0.4 0.8 0.15 SMD1206P150TF 1.5 3 8 1 6 100 0.8 0.04 0.13 1206 3 3.5 1.5 1.8 0.5 1.2 0.15 SMD1206P200TF 2 3.5 8 1.5 6 100 0.8 0.018 0.08 1206 3 3.5 1.5 1.8 0.5 1.2 0.15 0.3 0.8 0.15 Vocabulary Ihold = Hold current: maximum current device will pass without tripping in 23ºC still air. Itrip = Trip current: minimum current at which the device will trip in 23 ºC still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec. Circuit Protection System Specifications are subject to change without notice. Page:2 Positive Thermal Coefficent - SMD1206 Series Thermal Derating Curve Percentage of Rated Current 200.00 150.00 100.00 50.00 0.00 -40.00 0.00 40.00 80.00 Device Ambient Temperature ( 120.00 ) Thermal Derating Chart Profile Feature Pb-Free Assembly Average Ramp-Up Rate(Ts max to T p) 3°C/second mac. Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max) 150°C 200°C 60~180 seconds Time maintained above: -Temperature(TL) -Time(tL) +217°C 60~150 seconds Peak Temperature(Tp) Ramp-Down Rate ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Circuit Protection System Time 25°C to Peak Temperature Storage Condition 260°C 6°C/second max. 8 minutes max 0°C~35°C,70%RH Specifications are subject to change without notice. Page:3 Positive Thermal Coefficent - SMD1206 Series Tape And Reel Specifications (mm) EIA Tape Component Dimention Governing Specifications P0 EIA 481-1 W 12 ± 0.3 P0 4.0 ± 0.10 P1 8.0 ± 0.10 P2 2.0± 0.05 A0 3.5 ± 0.23 B0 5.1 ± 0.15 B1max 5.9 D0 1.5+0.1,-0 F 5.5 ± 0.05 E1 1.75 ± 0.10 E2min 10.25 Tmax 0.6 T1max 0.1 K0 0.9 ± 0.15 Leader min. 390 Trailer min. 160 T 60 W1 12.4+20,-0.0 W2max. 18.4 E1 A0 B1 F K0 B0 T1 P1 W E2 EIA Reel Dimentions W2(measured at hub) A 178 N min. Embossment P2 Cover tape Reel Dimensions A max D0 Cover tape . 0 N(hub dia.) W1(measured at hub) Carrier tape Embossed cavity Storage And Handling • Storage conditions : 40°C max, 70% R.H. • Devices may not meet specified performance if storage conditions are exceeded. Circuit Protection System Specifications are subject to change without notice. Page:4 Positive Thermal Coefficent - SMD1206 Series Thermal Derating Chart Part Numberr -40℃ -20℃ 0℃ 23℃ 40℃ 50 ℃ 60℃ 70℃ 85℃ SMD1206P010TF 0.14 0.33 0.115 0.1 0.085 0.08 0.07 0.06 0.05 SMD1206P020TF 0.28 0.25 0.23 0.20 0.17 0.15 0.14 0.12 0.09 SMD1206P025TF 0.37 0.33 0.29 0.25 0.22 0.20 0.17 0.15 0.12 SMD1206P035TF/16 0.50 0.45 0.40 0.35 0.30 0.27 0.24 0.21 0.15 SMD1206P050TF 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P050TF/15 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P075TFT 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P075TF/13.2 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P110TFT 1.64 1.46 1.30 1.10 0.92 0.83 0.80 0.65 0.52 SMD1206P150TFT 2.20 1.99 1.77 1.50 1.34 1.23 1.10 1.01 0.84 SMD1206P175TF 2.50 2.25 2.00 1.75 1.55 1.45 1.35 1.25 1.10 SMD1206P200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10 Warehouse Storage Conditions of Products · Storage Conditions: 1. Storage Temperature: -10°C~+40°C 2. Relative Humidity:≤75%RH 3. Keep away from corrosive atmosphere and sunlight. · Period of Storage: 1 year Circuit Protection System Specifications are subject to change without notice. Page:5