SMD0603 SERIES
Positive Temperature Coefficient (PTC) Data Sheet
Description
The 0603 series provides miniature surface mount resettable overcurrent protection
with holding current from 40mA to 500mA. This series is suitable for ultra portable
applications where space is at a premium and the device current is low.
Features
■ RoHS compliant and lead-free
■ Halogen-free
■ Compact design saves board space
■ Low profile
■ Fast response to fault current
■ Compatible with high temperature solders
Applications
■ Mobile phones and PDAs
■ Portable MP3 and media player
■ Mobile internet Device (MID)
■ USB peripherals
■ IC VCC protection
Agency Approval and Environmental Compliance
Agency
File Number
Regulation
Standard
UL/CUL
E482628
RoHS
2011/65/EU
TUV
B160696048001
Halogen Free
EN 14582:2007
Electrical Characteristics
Part
Number
Ihold
(A)
Itrip
(A)
Vmax
(Vdc)
Imax
(A)
Pd typ.
(W)
SMD0603B004TF
0.04
0.12
24
20
SMD0603B010TF
0.10
0.30
15
SMD0603B020TF
0.20
0.50
SMD0603B025TF
0.25
SMD0603B035TF
SMD0603B050TF
Revision:27-Jul-17
Maximum
Time To Trip
Resistance
Time
(Sec.)
Current
(A)
Rmin
(Ω)
R1max
(Ω)
0.5
1.00
0.20
4.000
40.000
40
0.5
1.00
0.50
0.900
6.000
9
40
0.5
0.60
1.00
0.550
3.500
0.55
9
40
0.5
0.08
8.00
0.500
3.000
0.35
0.75
6
40
0.5
0.10
8.00
0.200
1.000
0.50
1.00
6
40
0.5
0.10
8.00
0.100
0.680
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SMD0603 SERIES
Note on Electrical Characteristics
■ Vocabulary
·Ihold = Hold current: maximum current device will pass without tripping in 23℃ still air.
·Itrip = Trip current: minimum current at which the device will trip in 23℃ still air.
·Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
·Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
·Pd typ. = Typical power dissipated from device when in the tripped state at 23℃ still air.
·Rmin = Minimum resistance of device in initial (un-soldered) state.
·R1max = Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec.
■ Value specified is determined by using the PWB with 0.020”*1.5oz copper traces.
■ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
■ Specifications are subject to change without notice.
Polymeric PTC Selecting Guide
■ Determine the following operating parameters for the circuits:
·Normal operating current (Ihold)
·Maximum interrupt current (Imax)
·Maximum circuit voltage (Vmax)
·Normal operating temperature surrounding device (min℃/max℃)
■ Select the device from factor and dimension suitable for the application
■ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure
the circuit’s requirement does not exceed the device rating.
■ Check that PPTC device’s trip time (time-to-trip) will protect the circuit.
■ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range.
■ Verify that performance and suitability of the chosen PPTC device in the application.
! WARNING
■ Mechanical Stress
·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application
where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate
materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and
other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied.
■ Chemical Pollutants
·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices,
and shall not be used or applied.
■ Electronic and Thermal Effect
·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature
error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by,
among others, incorrect pin-connection of a connector) or over-extensive trip events may occur.
·PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open
circuit, in which case the voltage at such PPTC devices may reach a hazardous level.
·Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to
the PPTC devices.
·Conductive material contamination, such as metal particle, may induce shortage, flame or arcing.
·Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices,
which shall not be used under such circumstances.
■ General
·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual
applications will be met.
·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or
mechanical procedures and/or conditions non-conformant to those recommended by manufacturer.
·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection
To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices.
·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.
Revision:27-Jul-17
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SMD0603 SERIES
Thermal Derating Curve
Thermal Derating Chart
Recommended Hold Current (A) at Ambient Temperature (℃)
Ambient Operation Temperature
Part
Number
-40℃
-20℃
0℃
23℃
40℃
50℃
60℃
70℃
85℃
SMD0603B004TF
0.052
0.048
0.044
0.040
0.032
0.028
0.024
0.020
0.012
SMD0603B010TF
0.13
0.12
0.11
0.10
0.08
0.07
0.06
0.05
0.03
SMD0603B020TF
0.27
0.25
0.23
0.20
0.17
0.14
0.12
0.10
0.07
SMD0603B025TF
0.32
0.29
0.27
0.25
0.21
0.18
0.16
0.14
0.10
SMD0603B035TF
0.47
0.41
0.38
0.35
0.29
0.26
0.24
0.20
0.14
SMD0603B050TF
0.67
0.59
0.54
0.50
0.41
0.37
0.34
0.29
0.20
Average Time-Current Curve
Revision:27-Jul-17
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SMD0603 SERIES
Soldering Parameters
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TS max to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (TS min to TS max)
150℃
200℃
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Storage Condition
20-40 seconds
6℃/second max.
8 minutes max.
0℃~35℃, ≤70%RH
·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
·Recommended maximum paste thickness is 0.25mm (0.010 inch)
·Device can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Revision:27-Jul-17
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SMD0603 SERIES
Physical Dimensions (mm)
C
A
Part identification
D
A
B
Marking
E
B
C
D
E
Part
Number
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
SMD0603B004TF
1.40
1.80
0.60
1.00
0.40
1.00
0.15
0.50
-
0.40
SMD0603B010TF
1.40
1.80
0.60
1.00
0.40
1.00
0.15
0.50
-
0.40
SMD0603B020TF
1.40
1.80
0.60
1.00
0.40
1.00
0.15
0.50
-
0.40
SMD0603B025TF
1.40
1.80
0.60
1.00
0.40
1.00
0.15
0.50
-
0.40
SMD0603B035TF
1.40
1.80
0.60
1.00
0.55
1.55
0.15
0.50
-
0.40
SMD0603B050TF
1.40
1.80
0.60
1.00
0.55
1.55
0.15
0.50
-
0.40
Environmental Specifications
Operating / Storage temperature
-40℃ to +85℃
Maximum Device Surface Temperature in Tripped State
125℃
Passive Aging
+85℃, 1000 hours
±50% typical resistance change
Humidity Aging
+85℃, 85%R.H. 1000 hours
±50% typical resistance change
Thermal Shock
MIL-STD-202, Method 107G
+85℃/-40℃ 20 times
-50% typical resistance change
Solvent Resistance
MIL-STD-202, Method 215
No change
Vibration
MIL-STD-883C, Method 2007.1, Condition A
No change
Moisture Level Sensitivity
Level 1, J-STD-020C
Revision:27-Jul-17
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SMD0603 SERIES
Packaging Quantity and Marking
Recommended Pad Layout (mm)
Part Number
Marking
Quantity
SMD0603B004TF
—
4000
SMD0603B010TF
C
4000
SMD0603B020TF
H
4000
SMD0603B025TF
I
4000
SMD0603B035TF
F
4000
SMD0603B050TF
J
4000
◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3)
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material: Matte Tin (Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.
Revision:27-Jul-17
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SMD0603 SERIES
Packaging
Tape
Dimensions (mm)
B004TF
B010TF
B020TF
B025TF
B035TF
B050TF
W
8.00±0.30
8.00±0.30
F
3.50±0.05
3.50±0.05
E1
1.75±0.10
1.75±0.10
D0
1.55±0.05
1.55±0.05
D1
0.50±0.10
0.50±0.10
P0
4.00±0.10
4.00±0.10
P1
4.00±0.10
4.00±0.10
P2
2.00±0.05
2.00±0.05
A0
1.10±0.10
1.10±0.10
B0
1.92±0.10
1.92±0.10
T
0.20±0.10
0.20±0.10
K0
0.75±0.10
0.95±0.10
Leader min.
390
390
Trailer min.
160
160
Symbol
Reel
C
Φ178.0±1.0
D
Φ60.2±0.5
H
11.0±0.5
W
9.0±1.5
Part Number System
Revision:27-Jul-17
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