XL-2012RGBC

XL-2012RGBC Technical Data Sheet Characteristics * 外观尺寸（L/W/H）:2.0*1.2*0.8mm Outline Dimensions (L / w / h): 2.0 x 1.2 x 0.8 mm * 发光颜色及胶体: 高亮度七彩色/白色胶体 Luminous color and colloid: high brightness Colorful /White colloid * 环保工艺符合ROHS要求 Environmental protection products Complied With RoHS Directive * EIA规范标准包装 EIA standard packaging * 适用于SMT自动化贴片机 Suitable for SMT automatic production * 适用于回流焊制程 Suitable for reflow soldering process roduct application * 医疗设备： 内窥镜、血氧仪 Medical equipment: endoscope 、oximeter * 汽车电子：背光按键灯、指示灯 Automotive electronics: backlight key light 、 indicator light * 工业产品：电 子 仪 表 盘 、 工 业 Industrial products: electronic instrument panel、 industrial equipmen * 智能家居：白色家电、数码管LED Smart home: white appliances, nixie tube LED * 通讯产品：手机按键灯、路由器、电视盒 Communication products: mobile phone button lamp, router * 装饰和娱乐照明 Decorative and recreational lighting 1 Catalogue Electrical Characteristics..........................................................................................................................3 Typical Characteristic Curves...................................................................................................................6 Reliability Test Items And Conditions......................................................................................................7 Outline Dimensions....................................................................................................................................8 Packaging.....................................................................................................................................................9 Guideline for Soldering.............................................................................................................................11 Precautions..................................................................................................................................................13 2 Electrical Characteristics 最大绝对额定值 Absolute maximum ratings at Ta=25℃ Parameter Symbol Value Unit 参数 符号 数值 单位 Pd 红色red：55 蓝色blue：80 绿色green：80 mW 消耗功率 Power consumption 正向冲值脉 （1/10占空比，0.1ms脉宽） Peak Forward current (1 / 10 duty cycle, 0.1ms pulse width) 红色red：100 IFP 蓝色blue：100 mA 绿色green：100 正向直流工作电流 Forward DC working current IF 反向电压 Reverse voltage VR 工作环境温度 Working environment temperature Topr 存储环境温度 Storage ambient temperature Tstg 焊接条件 Welding conditions Tsol 抗静电能力 Antistatic ability ESD 红色red：25 蓝色blue：25 绿色green：25 红色red：5 蓝色blue：5 绿色green：5 mA V -30°C ~ + 85°C -40°C ~ + 90°C 回流焊 : 260°C ，10s 手动焊 : 300°C ，3s Reflow: 260 ° C, 10s Manual welding: 300 ° C, 3S 2000 V Note:Plulse Width≤0.1ms,Duty≤1/ 10 注:脉冲宽度≤0.1ms, 占空比≤1/ 10 3 亮度分档； 代码 Code L22 最小值 Min 42 最大值 Max 59 单位 Unit mcd 测试条件 Test conditions IF = 20mA Q33 220 280 mcd IF = 20mA Q34 220 286 mcd IF = 20mA L33 52 68 mcd IF = 20mA 颜色 代码 最小值 最大值 单位 测试条件 Colour Code Min Max Unit Test conditions 红 F3 1.9 2.1 V IF = 20mA 绿 I5 2.6 2.8 V IF = 20mA 蓝 I5 2.6 2.8 V IF = 20mA 颜色 代码 最小值 最大值 单位 测试条件 Colour 红 Code R22 Min 619 Max 624 Unit nm Test conditions IF = 20mA G14 524 527 nm IF = 20mA G4 525 528 nm B11 463 466 nm IF = 20mA IF = 20mA B12 466 469 nm IF = 20mA 颜色 Colour 红 绿 蓝 电压分档: 波长分档: 绿 蓝 4 Electro-Optical Characteristics (Ta=25℃) (光电参数) Parameter Symbol Min. Typ. Max Unit Condition 参数 项目 最小值 平均值 最大值 单位 测试条件 R / 130 / G / 110 / B / 550 / / / 120 / R / 630 / G / 470 / B / 530 / R 620 / 630 G 465 / 475 B 520 / 530 R / 20 / G / 30 / B / 35 / R 1.8 / 2.4 G 2.8 / 3.4 B 2.8 / 3.4 R / / 1 G / / 1 B / / 1 光强 light intensity IV 半光强视角 Half light angle 2θ1/2 峰值波长 Half light angle 主波长 Dominant wavelength 半波宽 Half width wave 正向电压 Forward voltage 反向电流 Reverse current λP λD ∆λ VF IR mcd deg nm IF=20mA IF=20mA IF=20mA IF=20mA nm nm IF=20mA V IF=20mA uA VR=5V 1. 亮度公差：± 10% Tolerance of Luminous Intensity: ± 10% 2. 波长公差：± 1nm Tolerance of Dominant Wavelength: ± 1nm 3. 电压公差：±0.1V Tolerance of Forward Voltage: ±0.1V 5 Typical Characteristics Curves 6 Reliability Test Items And Conditions*1 测试项目 Test project 防潮等级 Moisture proof grade 焊接信赖性 （无铅回流焊） Welding reliability (lead free reflow) 冷热循环 thermal cycling 冷热冲击 Thermal Shock 测试条件 Test conditions 1.回流焊最高温度 =260℃,10 秒，2 次回 流焊； 2.回流焊之前存储条件 ：30℃，相对湿度 =70%，168H； 1. Maximum reflow temperature = 260 ℃, 10 seconds, 2 times Flow welding; 2. Storage condition before reflow: 30 ℃, relative humidity =70%，168H； 回流焊最高温度 =245±5℃，5 秒（无铅 回流焊） Maximum reflow temperature = 245 ± 5 ℃, 5S (lead-free Reflow) 40℃ 30分钟~25℃ 5分 钟~ 100℃ 30分钟~25℃ 5 分钟 40 ℃ for 30 minutes ~ 25 ℃ for 5 minutes~ 30 minutes at 100 ℃ ~ 5 minutes at 25 ℃ -35℃ 15分钟 转换时间3分钟 85℃ 15分钟 -35 ℃ for 15 minutes Conversion time: 3 minutes 85 ℃ for 15 minutes Criteria For Judging Damage 测试次数 Test times 参考标准 Reference standard 失效判定标 准 Failure criteria 失效LED数 量（PCS） Number of failed LEDs (PCS) / JEITA ED-4701 300.301 #1 0/22 / JEITA ED-4701 303 303A #2 0/22 300 个循 环 300 cycles ring JESD22-A104 #1 0/22 300 个循 环 300 cycles ring JESD22-A106 #1 0/22 7 高温存储 High temperature storage Ta=100℃ 1000 小时 1000 hours JESD22-A103 #1 0/22 低温存储 Low temperature storage Ta=-40℃ 1000 小时 1000 hours JESD22-A119 #1 0/22 常温老化 Normal temperature aging Ta=25℃ IF=20mA 1000 小时 1000 hours JESD22-A108 #1 0/22 （2）失效标准：Failure criteria 标准# Standard# #1 #2 项目 project 测试条件 Test conditions 失效标准 Failure criteria 正向电压(VF) Forward voltage (VF) IF=20mA ＞U.S.L*1.1 光强（IV） Light intensity (IV) IF=20mA ＜L.S.L*0.7 反向电流(IR) Reverse current (IR) VR=5V ＞U.S.L*2.0 焊接可靠性 Welding reliability / 锡膏覆盖焊盘比例小于 95% The proportion of solder paste covered pads is less than 95% 8 Package Dimensions 备注：1.单位：毫米（mm） Remarks: 1.Unit: mm (mm) 2.公差：如无特别标注则为±0.10mm 2. Tolerance: ± 0.10mm unless otherwise specified 9 卷盘包装规格 Reel packing specification 注明： Note: 1. 所有尺寸以毫米为单位； Dimensions are in millimeters. 2. 除特别标识外所有尺寸公差为±0.1 毫米 Tolerances unless mentioned are ±0. 1mm 10 包装 Packaging (1) 3、注意事项 Cautions 1)、LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零 件上的强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. 2)、SMD吸嘴的外径不应超过LED的尺寸以避免漏气。吸嘴的内径应尽可能大。 吸嘴头建议使用柔软的材料以避免LED硅胶表面划伤或损坏。 The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 11 1 Guideline for Soldering (1) 1. Hand Soldering 推荐使用功率低于20W 的烙铁，焊接时烙铁的温度必须保持在300℃以下，且每个电极只能进行一次焊 接，每次焊接的持续时间不得超过3 秒。 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. Be careful because the damage of the product is often started at the time of the hand soldering. 2. 推荐使用以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure ofPb-Free Reflow Soldering. · 回流焊接最多只能进行一次。 Reflow soldering should not be done more than once . · 在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process. · 在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature. 12 2 Guideline for Soldering (2) 3. Cleaning 在焊接后推荐使用酒精进行清洗，在温度不高于30℃的条件下持续 3 分钟，不高于50℃的条件下持续 30 秒 。使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损伤。 超声波清洗也是有效的方法，一般最大功率不应超过 300W ，否则可能对 LED 造成损伤。请根据具体的 情况预先测试清洗条件是否会对 LED 造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pretest should be done to confirm whether any damage to LEDs will occur. 此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影响， 请根据特定的PCB设计和焊接设备来确定焊接方案。 Note: This general guideline may not apply to all PCB designs and configurations of all soldering equipment. The technics in practise is influenced by many factors, it should be specialized base on the PCB designs and configurations of the soldering equipment.. 13 1 Precautions (1) 1. Storage · 本产品使用密封防潮抗静电袋包装，并附有干燥剂，未开封的产品有一年的保存时间。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to a minimum. · 开封前，产品须存放在温度不高于30℃，湿度不高于 60%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and be used within a year. · 开封后，产品须存放在温度不高于 30℃，湿度不高于 10%RH 的环境中，且应该在 168 小时（7 天） 内使 用完。建议工作环境为温度不高于 30℃，湿度不高于 60%RH。 After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and be soldered within 168 hours (7 days). It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH. · 对于尚未焊接的 LED，如果吸湿剂或包装失效，或者产品没有符合以上有效存储条件，烘焙可以起到一定 的性能恢复效果。烘焙条件： （60±5）℃，持续 24 小时。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (60±5)℃ for 24 hours. 2. Static Electricity 静电和电涌会导致产品特性发生改变，例如正向电压降低等，如果情况严重甚至会损毁产品。所以在使用 时 必须采取有效的防静电措施。 所有相关的设备和机器都应该正确接地，同时必须采取其他防止静电和电涌的措施。 使用防静电手环，防静电垫子，防静电工作服、工作鞋、手套，防静电容器，都是有效的防止静电和电涌 的 措施。 Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. 14 2 Precautions (2) 3. Design Consideration 设计电路时，通过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变 化将会引起较大的电流变化，可能导致产品损毁。 建议使用以下（A）电路，该电路能够很好的调节通过每个 LED 的电流； 不推荐使用（B）电路，该电路 在持续的电压驱动下，LED 的正向电压（VF ）发生变化，电流会随之而发生变化，可能使某些 LED 承受高于 规定的电流值。 In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. It is recommended to use Circuit A which regulates the current flowing through each LED rather than Circuit B. When driving LEDs with a constant voltage in Circuit B, the current through the LEDs may vary due to the variation in Forward Voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the Absolute Maximum Rating. (A) (B) LED 的特性容易因为自身的发热和环境的温度的改变而发生改变。温度的升高会降低 LED 的发光效率、 影响发光颜色等，所以在设计时应充分考虑散热的问题。 Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LEDs when making the system design. 15 Precautions (3) 说明（Note）： 1、 焊接时请不要重压 LED 灯（Do not press LED lamp when welding）； 2、焊接后温度未回降到常温时请勿扭曲线路板（Do not distort the circuit board when the temperature does not return to normal temperature after welding）； 3、手工焊接时，烙铁温度不高于 300℃，每个焊脚焊接时间不超过 3 秒 （The temperature of the iron should be lower than 300℃ and soldering within 3sec per solder-pad is to be observed）； 16 Precautions (4) 4. Others 直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变。过度的压力也可能直接 影响封装内部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态下，例如在回流焊接过程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering. LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的时 候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful. 不可用在PH