GN24C02A

旌芯半导体科技（上海）有限公司 GN Semiconductor (Shanghai) Co., Ltd. GN24C02A I2C-Compatible Serial EEPROM General Description The GN24C02A is 2-Kbit I C-compatible Serial EEPROM (Electrically Erasable Programmable Memory) 2 device. It contains a memory array of 256 ×8bits, which is organized in 8 bytes per page. GN24C02A provides the following devices for different application. Device Selection Table Max. Clock Frequency Device Name Voltage Range Temp. Range GN24C02A -LI 1.6V~5.5V -40°C ~ 85°C 1MHz GN24C02A -MI 1.7V~5.5V -40°C ~ 85°C 1MHz [1] [1] Note 1: 400 kHz for VCC < 2.5V. Features   Single Supply Voltage and High Speed  Minimum operating voltage down to 1.6V  1 MHz clock from 2.5V to 5.5V  400kHz clock from 1.7V to 2.5V Low power CMOS technology  Read current 400uA, maximum  Write current 1.6mA, maximum  Schmitt Trigger, Filtered Inputs for Noise Suppression  Sequential & Random Read Features  Page Write Modes, Partial Page Writes Allowed  Write protect of the whole memory array  Self-timed Write Cycle (5ms maximum)  High Reliability   Endurance: > 1 Million Write Cycles  Data Retention: > 100 Years  ESD HBM: 4KV  Latch-up Capability: +/- 200mA Package: SOP8 SOT23-5 and TSOT23-5 中国(上海)自由贸易试验区芳春路400号1幢3层 http://www.gnsemic.com 电话:021-34125778 第 1 页，共 19页 旌芯半导体科技（上海）有限公司 GN Semiconductor (Shanghai) Co., Ltd. GN24C02A 1. Pin Configuration 1.1 Pin Configuration Figure 1-1 Pin Configuration E0 1 E1 2 8 VCC 7 WCB GN24C02A E2 3 6 SCL GND 4 5 SDA SCL 1 GND 2 SDA 3 5 WCB 4 Vcc GN24C02A 1.2 Pin Definition Table 1-1 Pin Definition Pin Name Type Description 1 E0 I/O Slave Address Setting 2 E1 Input Slave Address Setting 3 E2 Input Slave Address Setting 4 GND Ground Ground 5 SDA I/O Serial Data Input and Serial Data Output 6 SCL Input Serial Clock Input 7 WCB Input Write Control, Low Enable Write 8 VCC Power Power 中国(上海)自由贸易试验区芳春路400号1幢3层 http://www.gnsemic.com 电话:021-34125778 第 2 页，共 19 页 旌芯半导体科技（上海）有限公司 GN Semiconductor (Shanghai) Co., Ltd. GN24C02A 1.3 Pin Descriptions Serial Clock (SCL): The SCL input is used to positive-edge clock data in and negative-edge clock data out of each device. Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. Device Addresses (E2, E1, E0): The E2, E1 and E0 pins are device address inputs. Typically, the E2, E1 and E0 pins are for hardware addressing and a total of 8 devices can be connected on a single bus system. If these pins are left floating, the E2, E1 and E0 pins will be internally pulled down to GND. Write Control (WCB): The Write Control input, when WCB is connected directly to VCC, all write operations to the memory are inhibited. When connected to GND, allows normal write operations. If the pin is left floating, the WCB pin will be internally pulled down to GND. 2. Block Diagram Figure 2-1 Block Diagram SCL SDA Start Stop Control Logic NC Slave Address Comparator High Voltage Generator Serial Bus Control Logic Page Data Latch MATCH I N C L O A D Address Counter E1 X -DECODER WCB Write Control Logic EN EEPROM ARRAY E2 DataOut/ACK Serial MUX VCC GND Y-DECODER 中国(上海)自由贸易试验区芳春路400号1幢3层 http://www.gnsemic.com 电话:021-34125778 第 3 页，共 19 页 旌芯半导体科技（上海）有限公司 GN Semiconductor (Shanghai) Co., Ltd. GN24C02A 3. Electrical Characteristics Absolute Maximum Ratings NOTICE: Stresses above those listed under “Absolute  Storage Temperature .......................-65°C to +150°C  Operation Temperature ....................-40°C to +85°C  Maximum Operation Voltage............. 6.25V  Voltage on Any Pin with Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not Respect to Ground. ..........................-1.0V to (Vcc+1.0) V  implied. Exposure to maximum rating conditions for extended DC Output Current ............................5.0 mA Table 3-1 Pin Capacitance Symbol periods may affect device reliability. [1] Parameter Max. Units Test Condition CI/O Input / Output Capacitance (SDA) 8 pF VI/O=GND CIN Input Capacitance (E0, E1,E2,WCB,SCL) 6 pF VIN=GND Note: [1] Test Conditions: TA = 25°C, F = 1MHz, Vcc = 5.0V. Table 3-2 DC Characteristics（Unless otherwise specified, VCC = 1.7V to 5.5V, TA = –40°C to 85°C） Symbol Parameter Min. Typ. Max. Unit Test Condition 1.6 - 5.5 V GN24C02A-LI 1.7 - 5.5 V GN24C02A-MI - - 1.0 uA Vcc = 3.3V, TA = 85°C - - 3.0 uA Vcc = 5.5V, TA = 85°C Isb Standby Current ICC1 Supply Current - 0.2 0.4 mA ICC2 Supply Current - 0.8 1.6 mA ILI Input Leakage Current - 0.10 1.0 µA VIN = VCC or GND ILO Output Leakage Current - 0.05 1.0 µA VOUT = VCC or GND VIL Input Low Level –0.6 - 0.3VCC V VIH Input High Level 0.7VCC - VCC+0.5 V - - 0.2 V IOL = 1.5 mA - - 0.4 V IOL = 2.1 mA VOL1 VOL2 Output Low Level VCC = 1.7V (SDA) Output Low Level VCC = 3.0V (SDA) 中国(上海)自由贸易试验区芳春路400号1幢3层 http://www.gnsemic.com 电话:021-34125778 Vcc=5.5V, Read at 400Khz Vcc=5.5V Write at 400Khz 第 4 页，共 19 页 旌芯半导体科技（上海）有限公司 GN Semiconductor (Shanghai) Co., Ltd. GN24C02A Table 3-3 AC Characteristics （Unless otherwise specified, VCC = 1.7V to 5.5V, TA = –40°C to 85°C, CL=100pF, Test Conditions are listed in Notes [2]） Symbol 1.7≤VCC