SMD2016B150TF

SMD2016 SERIES Positive Temperature Coefficient(PTC)Data Sheet Description The2016series provides miniature surface mount resettable overcurrent protection withholding current from 0.3A to 2.0A. This series is suitable for applications with applications where space is at a premium and the device current is low. Features ■RoHS compliant and lead-free ■Halogen-free ■ High voltage ■ Low profile ■ Fast response to fault current ■ Compatible with high temperature solders Applications ■ Power over Ethernet (POE) ■Powered USB for POS and IPC ■ Automotive electronics control module protection ■ ■ ■ ■ IEEE 1394 port protection Low voltage telecom equipment Industrial control Security systems Agency Approval and Environmental Compliance Agency File Number Regulation Standard UL/CUL E482628 RoHS 2011/65/EU TUV B160696048001 Halogen Free EN 14582:2007 Electrical Characteristics Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ. (W) SMD2016B030TF 0.30 0.60 60 20 SMD2016B050TF 0.55 1.10 60 SMD2016B100TF 1.10 2.20 SMD2016B100TF/33 1.10 SMD2016B150TF SMD2016B200TF Revision：02-Nov-17 Maximum Time To Trip Resistance Time (Sec.) Current (A) Rmin (Ω) R1max (Ω) 1.40 3.00 1.50 0.500 2.300 20 1.40 5.00 2.50 0.200 1.000 15 40 1.40 0.50 8.00 0.060 0.400 2.20 33 40 1.40 0.50 8.00 0.060 0.400 1.50 3.00 15 40 1.40 1.00 8.00 0.050 0.180 2.00 4.20 6 40 1.40 3.00 8.00 0.030 0.100 www.brightking.com SMD2016 SERIES Note on Electrical Characteristics ■Vocabulary ·Ihold = Hold current: maximum current device will pass without tripping in 23℃ still air. ·Itrip = Trip current: minimum current at which the device will trip in 23℃ still air. ·Vmax= Maximum voltage device can withstand without damage at rated current (Imax) ·Imax= Maximum fault current device can withstand without damage at rated voltage (Vmax) ·Pd typ. = Typical power dissipated from device when in the tripped state at 23℃ still air. ·Rmin= Minimum resistance of device in initial (un-soldered) state. ·R1max= Maximum resistance of device at 23℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec. ■Value specified is determined by using the PWB with 0.090”*1.5oz copper traces. ■Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. ■Specifications are subject to change without notice. Polymeric PTC Selecting Guide ■Determine the following operating parameters for the circuits: ·Normal operating current (Ihold) ·Maximum interrupt current (Imax) ·Maximum circuit voltage (Vmax) ·Normal operating temperature surrounding device (min℃/max℃) ■Select the device from factor and dimension suitable for the application ■Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. ■Check that PPTC device’s trip time (time-to-trip) will protect the circuit. ■Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. ■Verify that performance and suitability of the chosen PPTC device in the application. ! WARNING ■Mechanical Stress ·PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. ■Chemical Pollutants ·Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. ■Electronic and Thermal Effect ·PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. ·PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit,in which case the voltage at such PPTC devices may reach a hazardous level. ·Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. ·Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. ·Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. ■General ·Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. ·The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. ·Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. ·Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. Revision：02-Nov-17 www.brightking.com SMD2016 SERIES Thermal Derating Curve Percentage of Rated Current 200.00 150.00 A-SMD2016B050TF SMD2016B100TF B A SMD2016B100TF/33 SMD2016B200TF B-SMD2016B030TF SMD2016B150TF 100.00 A B 50.00 0.00 -40.00 0.00 40.00 80.00 120.00 Device Ambient Temperature (℃) Thermal Derating Chart Recommended Hold Current (A) at Ambient Temperature (℃) Ambient Operation Temperature Part Number -40℃ -20℃ 0℃ 23℃ 40℃ 50℃ 60℃ 70℃ 85℃ SMD2016B030TF 0.45 0.40 0.35 0.30 0.25 0.23 0.20 0.18 0.14 SMD2016B050TF 0.93 0.80 0.65 0.50 0.42 0.38 0.33 0.30 0.23 SMD2016B100TF 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2016B100TF/33 1.66 1.47 1.29 1.10 0.91 0.83 0.73 0.64 0.50 SMD2016B150TF 2.26 2.00 1.76 1.50 1.24 1.13 1.00 0.87 0.68 SMD2016B200TF 2.80 2.50 2.19 2.00 1.84 1.74 1.50 1.34 1.14 Average Time-Current Curve Revision：02-Nov-17 www.brightking.com SMD2016 SERIES Soldering Parameters Profile Feature Pb-Free Assembly Average ramp-up rate (TS max to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (TS min to TS max) 150℃ 200℃ 60-180 seconds Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual PeakTemperature (tP) Ramp-down Rate Time 25℃ to Peak Temperature Storage Condition 20-40 seconds 6℃/second max. 8 minutes max. 0℃~35℃, ≤70%RH ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Device can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Revision：02-Nov-17 www.brightking.com SMD2016 SERIES Physical Dimensions (mm) C A BK Logo Part identification D A B Marking E B C D E Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD2016B030TF 4.72 5.44 3.70 4.43 0.55 1.05 0.30 1.50 0.25 0.65 SMD2016B050TF 4.72 5.44 3.70 4.43 0.75 2.00 0.30 1.50 0.25 0.65 SMD2016B100TF 4.72 5.44 3.70 4.43 0.50 1.20 0.30 1.50 0.25 0.65 SMD2016B100TF/33 4.72 5.44 3.70 4.43 0.75 1.25 0.30 1.50 0.25 0.65 SMD2016B150TF 4.72 5.44 3.70 4.43 0.50 1.55 0.30 1.50 0.25 0.65 SMD2016B200TF 4.72 5.44 3.70 4.43 0.50 1.20 0.30 1.50 0.25 0.65 Environmental Specifications Operating / Storage temperature -40℃ to +85℃ Maximum Device Surface Temperature in Tripped State 125℃ Passive Aging +85℃, 1000 hours ±50% typical resistance change Humidity Aging +85℃, 85%R.H. 1000 hours ±50% typical resistance change Thermal Shock MIL-STD-202, Method 107G +85℃/-40℃ 20 times -50% typical resistance change Solvent Resistance MIL-STD-202, Method 215 No change Vibration MIL-STD-883C, Method 2007.1, Condition A No change Moisture Level Sensitivity Level 1, J-STD-020C Revision：02-Nov-17 www.brightking.com SMD2016 SERIES Packaging Quantity and Marking Recommended Pad Layout (mm) Part Number Marking Quantity SMD2016B030TF 030 1500 SMD2016B050TF 050 1000 SMD2016B100TF 100 2000 SMD2016B100TF/33 1033 1500 SMD2016B150TF 150 1500 SMD2016B200TF 200 2000 ◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3. Revision：02-Nov-17 www.brightking.com SMD2016 SERIES Packaging Tape Reel Dimensions (mm) Symbol B100TF B200TF B030TF B100TF/33 B150TF B050TF W 12.0±0.30 12.0±0.30 12.0±0.30 F 5.50±0.05 5.50±0.05 5.50±0.05 E1 1.75±0.10 1.75±0.10 1.75±0.10 D0 1.55±0.05 1.55±0.05 1.55±0.05 D1 1.50(MIN) 1.50±0.10 1.50±0.10 P0 4.00±0.10 4.00±0.10 4.00±0.10 P1 8.00±0.10 8.00±0.10 8.00±0.10 P2 2.00±0.05 2.00±0.05 2.00±0.05 A0 4.40±0.10 4.48±0.10 4.45±0.10 B0 5.50±0.10 5.40±0.10 5.48±0.10 T 0.25±0.10 0.25±0.10 0.25±0.10 K0 0.75±0.10 1.36±0.10 1.86±0.10 Leader min. 390 390 390 Trailer min. 160 160 160 C Φ178.0±1.0 D Φ60.2±0.5 H 16.0±0.5 W 13.2±1.5 Part Number System Revision：02-Nov-17 www.brightking.com