VB2103K
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P-Channel 100-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 100
RDS(on) (Ω)
ID (A)
0.50 at VGS = - 10 V
- 1.5
0.56 at VGS = - 6.0 V
- 1.4
Qg (Typ.)
7.7
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• Ultra Low On-Resistance
• Small Size
APPLICATIONS
• Active Clamp Circuits in DC/DC Power Supplies
TO-236
(SOT-23)
G
1
3
S
D
2
Top View
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
- 100
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)a, b
TA = 25 °C
TA = 70 °C
Conduction)a, b
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipationa, b
IS
L = 1.0 mH
TA = 25 °C
TA = 70 °C
- 1.5
- 1.4
- 1.55
- 3.0
- 1.0
IAS
4.5
1.01
mJ
2.0
0.85
1.0
0.58
TJ, Tstg
Operating Junction and Storage Temperature Range
A
- 1.4
EAS
PD
V
- 1.65
IDM
Pulsed Drain Current
Continuous Source Current (Diode
ID
Unit
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t≤5s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
75
100
120
166
40
50
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. Pulse width limited by maximum junction temperature.
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Limits
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VGS = 0 V, ID = - 250 µA
- 100
VGS(th)
VDS = VGS, ID = - 250 µA
- 1..0
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = - 100 V, VGS = 0 V
-1
VDS = - 100 V, VGS = 0 V, TJ = 55 °C
- 10
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-Resistancea
Forward Transconductancea
Diode Forward Voltage
VDS ≤ - 15 V, VGS = 10 V
- 3.0
- 1.6
nA
µA
A
VGS = - 10 V, ID = - 0.5 A
0.50
VGS = - 6.0 V, ID = - 0.5 A
0.56
gfs
VDS = - 15 V, ID = - 0.5 A
2.2
VSD
IS = - 1.0 A, VGS = 0 V
0.7
- 1.2
7.7
12
RDS(on)
V
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = - 50 V, VGS = 10 V,
ID ≅ - 0.5 A
f = 1.0 MHz
nC
1.5
2.5
Ω
9
520
VDS = - 25 V, VGS = 0 V, f = 1 MHz
pF
40
20
Switchingc
Turn-On Time
Turn-Off Time
Body Diode Reverse Recovery Charge
td(on)
tr
td(off)
tf
Qrr
VDD = - 50 V, RL = 75 Ω
ID ≅ - 1.0 A, VGEN = - 10 V
Rg = 6 Ω
IF = 0.5 A, dI/dt = 100 A/µs
7
11
11
17
16
25
11
17
90
135
ns
nC
Notes:
a. Pulse test: PW ≤ 300 µs duty cycle ≤ 2 %.
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1.6
1.6
VGS = 10 thru 4 V
1.4
1.4
1.2
I D - Drain Current (A)
I D - Drain Current (A)
1.2
1.0
0.8
0.6
0.4
1.0
0.8
0.6
TC = 125 °C
0.4
0.2
- 55 °C
2V
0.0
0
2
4
25 °C
0.2
3V
6
8
0.0
10
VDS - Drain-to-Source Voltage (V)
2.5
2.0
1.5
1.0
0.5
0.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
2.00
500
400
1.50
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
1.75
1.25
1.00
0.75
VGS = 6 V
Ciss
300
200
0.50
100
VGS = 10 V
0.25
Coss
0.00
0.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Crss
0
30
ID - Drain Current (A)
60
100
110
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
10
2.5
VDS = 50 V
ID = 0.5 A
VGS = 10 V
ID = 0.5 A
8
6
4
2
(Normalized)
2.0
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
90
1.5
1.0
0.5
0
0
1
2
3
4
5
6
Qg - Total Gate Charge (nC)
Gate Charge
7
8
0.0
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
3.0
3
ID = 0.5 A
RDS(on) - On-Resistance (Ω)
2.5
I S - Source Current (A)
TJ = 150 °C
1
TJ = 25 °C
2.0
1.5
1.0
0.5
0.0
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
2
6
8
10
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
1.3
12
1.0
10
ID = 250 µA
0.7
8
Power (W)
VGS(th) Variance (V)
4
0.4
0.1
6
4
TA = 25 °C
- 0.2
- 0.5
- 50
2
- 25
0
25
50
85
75
95
0
100
0.01
0.1
1
10
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
100
600
10
IDM Limited
Limited by R DS(on)*
10 µs
100 µs
I D - Drain Current (A)
1
1 ms
0.1
10 ms
ID(on)
Limited
0.01
100 ms
TA = 25 °C
Single Pulse
10 s, 1 s
100 s, DC
BVDSS Limited
0.001
0.1
1
10
100
1000
VDS - Drain-to-Source Voltage (V)
* VGS > minimum V GS at which R DS(on) is specified
Safe Operating Area
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THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 120 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
.
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SOT-23 (TO-236): 3-LEAD
b
3
E1
1
E
2
e
S
e1
D
0.10 mm
C
0.004"
A2
A
C
0.25 mm
q
Gauge Plane
Seating Plane
Seating Plane
C
A1
Dim
L
L1
MILLIMETERS
INCHES
Min
Max
Min
Max
A
0.89
1.12
0.035
0.044
A1
0.01
0.10
0.0004
0.004
A2
0.88
1.02
0.0346
0.040
b
0.35
0.50
0.014
0.020
c
0.085
0.18
0.003
0.007
D
2.80
3.04
0.110
0.120
E
2.10
2.64
0.083
0.104
E1
1.20
1.40
0.047
e
0.95 BSC
e1
L
1.90 BSC
0.40
L1
q
0.0748 Ref
0.60
0.016
0.64 Ref
S
0.024
0.025 Ref
0.50 Ref
3°
0.055
0.0374 Ref
0.020 Ref
8°
3°
8°
ECN: S-03946-Rev. K, 09-Jul-01
DWG: 5479
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0.049
(1.245)
0.029
0.022
(0.559)
(0.724)
0.037
(0.950)
(2.692)
0.106
RECOMMENDED MINIMUM PADS FOR SOT-23
0.053
(1.341)
0.097
(2.459)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
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