Product specification
DOC. No.: 651-0163-01
P/N:
KH-252515-G2.1
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
06/01/18’
Page: 1/6
Initiated/Date
SAM
06/01/18’
1、Scope
This product is applied to RF circuits and provides a switch interface for circuit tests .
And it’s the second type of the “MINI RF CONNECTOR”,with excellent performance
and less space occupation.
2、Technology Parameters
2.1
2.2
2.3
2.4
2.5
Voltage Rating
250VAC
1A
Current Rating
DC~6GHz
Frequency Range
Impedance
50Ω
Operating Temperature
-40℃~+85℃
3、Electrical Characteristics
3.1 Insulation Resistance
500MΩ
3.2 Dielectric Withstanding Voltage
300V AC
3.3 Contact Resistance
120 mΩ max
1.2 max ( DC~3GHz), 1.3 max ( 3~6GHz)
3.4 Voltage Standing wave Ratio(VSWR)
3.4.1 Test Method:
3.5 Isolation
20dBmin ( DC~3GHz), 15dBmin ( 3~6GHz)
3.5.1 Test Method:
3.6 Insertion Loss
0.10dBmax ( DC~3GHz), 0.20dBmax ( 3~6GHz)
3.6.1 Test Method:
WWW.BDS666.COM
0755-83044319
Product specification
P/N:
KH-252515-G2.1
DOC. No.: 651-0163-01
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
06/01/18’
Page: 2/6
Initiated/Date
SAM
06/01/18’
4、Mechanical Characteristics
4.1
4.2
4.3
4.4
4.5
Contact Retention Force
3.4N~4.5N
Mating Force
30N or less
Unmating Force
5N~40N
Mechanical Durability
500 Cycles
Adhered Force of Solder
50N
4.5.1 Test method:
2
4.6 Shock
Acceleration:750m/s (peak-to-peak). Period:6m sec. Waveform:Half-sine.
4.7 Vibration
Frequncy Range:10Hz~30Hz Amplitude: 3mm.
5、Environmental Characteristics
5.1 High Temperature Cycling
50
5.2 Humidity,Steady State: Temperature:60℃ Humidity:95% RH Period:96 hours
5.3 Salt Spray
Temperature:35℃ Solution Conduction:5% , Period:48 hours
WWW.BDS666.COM
075583044319
Product specification
P/N:
KH-252515-G2.1
DOC. No.: 651-0163-01
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
06/01/18’
Page: 3/6
Initiated/Date
SAM
06/01/18’
6、SMT Soldering Condition
6.1 Recommanded IR Temperature & Time Curve
6.2 IR Extreme Temperature & Time Curve
(
(
7、Profile Dimensions
WWW.BDS666.COM
0755-83044319
Product specification
P/N:
KH-252515-G2.1
DOC. No.: 651-0163-01
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
Page: 4/6
Initiated/Date
SAM
06/01/18’
06/01/18’
8、Printed Circuit Board(PCB)Pad
Recomend PCB Layout
General Tolerance: ±0.05
The standard solder stencil mask pattern
(Mask thickness 0.12mm)
9、Package Specification
9.1 Peeling off Force of Cover Tape
When cover tape is peeled off as in right figure by a speed of 300mm/minute.The
peeling off force should be 1.3N maximum.
9.2 THE WAY OF PACKAGE :TAPE PACKING,1000Pcs/REEL(Ф178mm)
DIRECTION OF USING
EMPTY CARRIER
EMPTY CARRIER
COVER TAPE
COMPONENTS
10、Storage Conditions
Temperature:-10~+40 ℃
Relative Humidity:15~85 % RH
Life:Half year.
WWW.BDS666.COM
0755-83044319
Product specification
P/N:
KH-252515-G2.1
DOC. No.: 651-0163-01
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
06/01/18’
Page: 5/6
Initiated/Date
SAM
06/01/18’
11、Accessories for Tests
Type I :
Type II :
WWW.BDS666.COM
0755-83044319
Product specification
DOC. No.: 651-0163-01
P/N:
KH-252515-G2.1
Rev.: C
Approved/Date
Approved/Date
Henry
Henry
06/01/18’
Page: 6/6
Initiated/Date
SAM
06/01/18’
06/01/18’
12、Test Plan
ITEMS
Test NO.
3.1
3.2
Test Group
Test Items
Insulation
Resistance
Withstanding
Voltage
A
1,5
2
2,6
Contact Resistance
3,12
3.4
VSWR
4,13
3.5
Insulation
5,14
3.6
Insertion Loss
6,15
4.2
Insertion Force
7,10
4.3
Unmating Force
8,11
4.5
Mechanical
Durability
Adhered Force of
Solder
C
1
3.3
4.4
B
1,4
E
F
G
5
5
H
I
J
1,3
9
1
4.6
Shock
2
4.7
Vibration
3
5.1
High Temperature
Cycling
3
5.2
Humidity
4
5.3
Salt Spray
The least quantity of the
Specimens.
D
2
5
5
5
5
5
WWW.BDS666.COM
0755-83044319
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