KH-3030175-G1

DOC. No.: Product Specification Part Number： KH-3030175-G1 Page: Rev.: D 651-0251-01 1/5 Checker/Date Inspector/Date Henry Henry 06/01/18’ 06/01/18’ Maker/Date SAM 06/01/18’ 1、Overview This product is applied to RF circuits and provides a switch interface for circuit tests , And it’s the first type of the “MINI RF CONNECTOR”. 2、Technology 2.1 2.2 2.3 2.4 3、Electrical 3.1 3.2 3.3 3.4 Parameters Rated Voltage Frequency Range Impedance Operating Temperature 250V AC 0～6GHz 50Ω -40℃～+85℃ Performance Insulation Resistance Dielectric Withstanding Voltage Contact Resistance Voltage Standing Wave Ratio(VSWR) 3.4.1 Test Methods： 3.5 Isolation 500MΩ　 300V AC 120 mΩ max 1.2 max ( DC～3GHz）, 1.3 max (3～6GHz) 20dBmin ( DC～3GHz）, 15dBmin ( 3～6GHz） 3.5.1 Test Methods: 3.6 Insertion loss 0.10dBmax ( DC～3GHz）, 0.20dBmax ( 3～6GHz） 3.6.1 Test Methods： WWW.BDS666.COM 0755-83044319 DOC. No.: Product Specification Rev.: D 651-0251-01 Part Number： KH-3030175-G1 Checker/Date Inspector/Date Henry Henry 06/01/18’ 06/01/18’ Page: 2/5 Maker/Date SAM 06/01/18’ 4、Mechanical Performance 4.1 4.2 4.3 4.4 4.5 Contact Stress Mating Force Unmating Force Durability Adhered Force of Solders 4.5.1 Test Methods: 4.6 Shock 4.7 Vibration 3.4N～4.5N 30N max 5N～40N 500 cycles 50N 2 Acceleration：750m/s (Peak); Duration of Shock：6m sec. Wave form：Half-sine 10Hz～30Hz : 3mm 5、Environment Performance 5.1 Thermal Shock ：50 5.2 Static Humidity & Thermal Test Temperature：60℃ Humidity：95% RH Time：96 hours WWW.BDS666.COM 0755-83044319 DOC. No.: Product Specification Rev.: D 651-0251-01 Checker/Date Part Number： KH-3030175-G1 Inspector/Date Henry Henry 06/01/18’ 06/01/18’ Page: 3/5 Maker/Date SAM 06/01/18’ 6、SMT Temperature Curve 6.2 Allowable Temperature and Time of Reflow Soldering 温度 温度 6.1 Reflow Soldering Standard Conditions 时间( 时间( 7、Appearance Dimension WWW.BDS666.COM 0755-83044319 DOC. No.: Product Specification Part Number： KH-3030175-G1 Rev.: D 651-0251-01 Checker/Date Inspector/Date Henry Henry 06/01/18’ 06/01/18’ Page: 4/5 Maker/Date SAM 06/01/18’ 8、Printed circuit board（PCB）pad Recomend PCB Layout The standard solder stencil mask pattern General Tolerance: ±0.05 (Mask thickness 0.15mm) 9、PACKING SPECIFICATION 9.1 Peeling off Force of Cover Tape When cover tape is peeled off as in right figure by a speed of 300mm/minute.The peeling off force should be 1.3N maximum. 9.2 THE WAY OF PACKAGE ：TAPE PACKING，1000Pcs/REEL（Ф178mm） DIRECTION OF USING EMPTY CARRIER EMPTY CARRIER COVER TAPE COMPONENTS 10、Storage Conditions Temperature：-10～+40 ℃ Moisture：15～85 % RH Valid Period：6 months WWW.BDS666.COM 0755-83044319 DOC. No.: Product Specification Part Number： KH-3030175-G1 Rev.: D 651-0251-01 Checker/Date Inspector/Date Henry Henry 06/01/18’ 06/01/18’ Page: 5/5 Maker/Date SAM 06/01/18’ 11、Accessories for Tests TYPE I ： TYPY II ： WWW.BDS666.COM 0755-83044319