WSD100N06GDN56
N-Ch MOSFET
General Description
Product Summery
The WSD100N06GDN56 is the SGT MOSFET
with extreme high cell density,which provide
excellent RDSON and gate charge for most of the
synchronous buck converter applications .
BVDSS
RDSON
ID
60V
3.0mΩ
100A
Applications
Secondary Side Synchronous Rectification
The WSD100N06GDN56 meet the RoHS and Green
Product requirement 100% EAS guaranteed with
full function reliability approved.
DC-DC Converter
Motor Control
Load Switching
Features
Lead Fre e an d Green Devices Available
DFN5x6A-8_EP Pin Configuration
(RoH SCom plia nt)
100% UIS + Rg Tested
Reliable and Rugged
Moistu re Sensitivity Level MSL1
(per JED EC J-STD-020D)
Absolute Maximum Ratings @TA=25℃ unless otherwise noted
Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
±20
V
ID1,6
IDM 2
PD
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
TC=25°C
100
TC=100°C
65
TC=25°C
240
TC=25°C
83
TC=100°C
50
A
A
W
IAS
Avalanche Current, Single pulse
45
A
EAS 3
Single Pulse Avalanche Energy
101
mJ
TJ
Maximum Junction Temperature
150
℃
-55 to 150
℃
TSTG
Storage Temperature Range
RθJA1
Thermal Resistance Junction to ambient
Steady State
55
℃/W
RθJC1
Thermal Resistance-Junction to Case
Steady State
1.5
℃/W
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Page 1
Rev 1: Apr.2019
WSD100N06GDN56
N-Ch MOSFET
Electrical Characteristics @TA=25℃ unless otherwise noted
Symbol
Conditions
Parameter
Min. Typ. Max.
Unit
Static
V(BR)DSS
IDSS
IGSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Leakage Current
VGS = 0V, ID = 250μA
60
V
VDS = 48 V, VGS = 0V
1
30
TJ=85°C
VGS = ±20V, VDS = 0V
µA
±100
nA
1.8
2.5
V
VGS = 10V, ID = 20A
3.0
3.6
mΩ
VGS = 4.5V, ID = 15A
4.4
5.4
mΩ
On Characteristics
VGS(TH)
RDS(on)2
Gate Threshold Voltage
Drain-Source On-state Resistance
VGS = VDS, IDS = 250µA
1.2
Switching
Qg
Total Gate Charge
Qgs
Gate-Sour
Qgd
Gate-Drain Charge
td (on)
tr
VDS=30V
VGS=10V
ID=20A
Charge
Turn-on Delay Time
VGEN=10V
VDD=30V
ID=20A
RG=Ω
Turn-on Rise Time
td(off)
Turn-off Delay Time
tf
Turn-off Fall Time
Rg
Gat resistance
VGS=0V, VDS=0V, f=1MHz
58
nC
16
nC
4.0
nC
18
ns
8
ns
50
ns
11
ns
0.7
Ω
3458
pF
1522
pF
22
pF
Dynamic
Ciss
In
Capacitance
Coss
Out
Crss
Reverse Transfer Capacitance
VGS=0V
VDS=30V
f=1MHz
Capacitance
Drain-Source Diode Characteristics and Maximum Ratings
IS
1,5
Continuous Source Current
ISM
Pulsed Source Current3
VSD 2
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
ISD = 1A , VGS=0V
ISD=20A, dlSD/dt=100A/µs
0.8
55
A
240
A
1.3
V
27
ns
33
nC
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is V DD=50V,VGS=10V,L=0.1mH,IAS=40A
4.The power dissipation is limited by 150℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
6.The maximum current rating is package limited.
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Page 2
Rev 1: Apr.2019
WSD100N06GDN56
N-Ch MOSFET
Typical Operating Characteristics
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs G-S Voltage
Fig.3 Diode Forward Voltage vs. Current
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized VGS(th) vs TJ
Fig.6 Normalized RDSON vs TJ
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Page 3
Rev 1: Apr.2019
WSD100N06GDN56
N-Ch MOSFET
Typical Operating Characteristics (Cont.)
Fig.7 Capacitance
Fig.8 Safe Operating Area
Normalized Thermal Respons e (RθJC)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
P DM
SINGLE
T ON
T
D = TON/T
TJpeak = TC+P DMXRθJC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
1
L x IAS2 x
2
BVDSS
BVDSS-VDD
BVDSS
IAS
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
Fig.10 Switching Time Waveform
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VGS
Fig.11 Unclamped Inductive Switching Waveform
Page 4
Rev 1: Apr.2019
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