WSF20N20
N-Ch MOSFET
General Description
Product Summery
The WSF20N20 is the highest performance trench
N-Ch MOSFET with extreme high cell density,which
provide excellent RDSON and gate charge for most
of the synchronous buck converter applications .
BVDSS
RDSON
ID
200V
136mΩ
20A
The WSF20N20 meet the RoHS and Green Product
requirement , 100% EAS guaranteed with full
function reliability approved.
Applications
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
Features
z Load Switch
z Advanced high cell density Trench technology
TO-252 Pin Configuration
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
ID@TA=25℃
ID@TA=70℃
IDM
EAS
Rating
Units
Drain-Source Voltage
200
V
Gate-Source Voltage
±20
V
1
20
A
1
12
A
1
6
A
1
4.5
A
64
A
Single Pulse Avalanche Energy
35
mJ
A
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
IAS
Avalanche Current
5
PD@TC=25℃
Total Power Dissipation3
50
W
PD@Tc=100℃
Total Power Dissipation3
20
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
50
℃/W
---
2.5
℃/W
Rev 3: Apr.2019
WSF20N20
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
200
---
---
V
---
0.098
---
V/℃
---
136
160
mΩ
---
200
380
mΩ
1.0
2.0
3.0
V
---
-4.57
---
mV/℃
VDS=160V , VGS=0V , TJ=25℃
---
---
1
VDS=160V , VGS=0V , TJ=55℃
---
---
5
VGS=0V , ID=250uA
Reference to 25℃ , ID=1mA
VGS=10V , ID=8A
VGS=6.0V , ID=4A
VGS=VDS , ID =250uA
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±25V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=8A
---
20
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2
4
Ω
---
68
---
---
42
---
Qg
Total Gate Charge (10V)
Qgs
Gate-Source Charge
Qgd
Td(on)
VDS=100V , VGS=10V , ID=8A
Gate-Drain Charge
---
35
---
Turn-On Delay Time
---
17
---
uA
nC
Rise Time
VDD=30V , VGS=10V , RG=6Ω
---
11
---
Turn-Off Delay Time
ID=10A RL=30Ω
---
47
---
Fall Time
---
14
---
Ciss
Input Capacitance
---
3100
---
Coss
Output Capacitance
---
210
---
Crss
Reverse Transfer Capacitance
---
150
---
Min.
Typ.
Max.
Unit
20
---
---
mJ
Min.
Typ.
Max.
Unit
---
---
20
A
---
---
64
A
---
---
1.1
V
---
105
---
nS
---
360
---
nC
Tr
Td(off)
Tf
VDS=30V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.1mH , IAS=5A
Diode Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
2,6
Pulsed Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Conditions
1,6
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=5A , TJ=25℃
IF=5A , dI/dt=100A/µs , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t
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