WSF30100D
N-Ch MOSFET
General Description
Product Summery
The WSF30100D is the highest performance trench
N-ch MOSFET with extreme high cell density, which
provide excellent RDSON and gate charge for most
of the synchronous buck converter applications .
The WSF30100D meet the RoHS and Green Product
requirement , 100% EAS guaranteed with full function
reliability approved.
BVDSS
RDSON
ID
30V
3.6mΩ
100A
Applications
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
z Power Tool Application
Features
TO-252 Pin Configuration
Advanced high cell density Trench technology
Super Low Gate Charge
Excellent CdV/dt effect decline
100% EAS Guaranteed
Green Device Available
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Symbol
Parameter
Max.
Units
VDSS
Drain-Source Voltage
30
V
VGSS
Gate-Source Voltage
±20
V
ID
Continuous Drain Current, VGS @ 10V
TC=25℃
100
A
Continuous Drain Current, VGS @ 10V
TC=100℃
59
A
IDM
Pulsed Drain Current note1
360
A
EAS
Single Pulsed Avalanche Energy note2
95
mJ
IAS
Avalanche Current
19.5
A
PD
Total Power Dissipation4
TC=25℃
68
W
Thermal Resistance Junction-ambient 1
(Steady State)
62
℃/W
Thermal Resistance Junction-Ambient 1
(t ≤10s)
25
℃/W
2.2
℃/W
-55 to +175
℃
RθJA
RθJC
TJ, TSTG
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
www.winsok.tw
Page 1
Rev 1: May.2020
WSF30100D
N-Ch MOSFET
Electrical Characteristics (TJ=25℃, unless otherwise noted)
Symbol
V(BR)DSS
Parameter
Test Condition
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
Min.
Typ.
Max.
Units
VGS=0V, ID=250μA
30
32
-
V
Reference to 25℃, ID=1mA
---
0.028
---
V/℃
VDS= VGS, ID=250μA
1.0
1.6
2.5
V
VGS(th)
Gate Threshold Voltage
RDS(on)
Static Drain-Source on-Resistance note3 VGS =10V, ID =30A
-
3.6
4.5
mΩ
RDS(on)
Static Drain-Source on-Resistance note3 VGS =4.5V, ID =20A
-
6.7
9.5
mΩ
IDSS
Zero Gate Voltage Drain Current
VDS =30V, VGS = 0V,
-
-
1.0
μA
IGSS
Gate to Body Leakage Current
VDS =0V, VGS = ±20V
-
-
±100
nA
-
2100
-
pF
-
326
-
pF
Ciss
Input Capacitance
VDS =15V, VGS =0V, f =
1.0MHz
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
-
282
-
pF
Qg
Total Gate Charge
-
45
-
nC
Qgs
Gate-Source Charge
-
3
-
nC
Qgd
Gate-Drain(“Miller”) Charge
-
15
-
nC
td(on)
Turn-on Delay Time
-
21
-
ns
tr
Turn-on Rise Time
-
32
-
ns
td(off)
Turn-off Delay Time
-
59
-
ns
VDS =15V, ID =30A, VGS =10V
VDS=15V, ID=30A, RGEN=3Ω,
VGS =10V
tf
Turn-off Fall Time
-
34
-
ns
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
90
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
360
A
VSD
Drain to Source Diode Forward Voltage
-
-
1.2
V
-
15
-
ns
-
4
-
nC
trr
VGS = 0V, IS=30A
Body Diode Reverse Recovery Time
IF=20A,dI/dt=100A/μs
Qrr
Body Diode Reverse Recovery Charge
Notes:
1、Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature
2、The test condition is, VDD =15V, VG =10V, RG =25Ω, L=0.5mH, IAS =19.5A
3、The data tested by pulsed Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%
4、The power dissipation is limited by 150℃ junction temperature
www.winsok.tw
Page 2
Rev 1: May.2020
WSF30100D
N-Ch MOSFET
Typical Characteristics
Figure1: Output Characteristics
Figure 2: Typical Transfer Characteristics
Figure 3:On-resistance vs. Drain Current
Figure 4: Body Diode Characteristics
Figure 5: Gate Charge Characteristics
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Figure 6: Capacitance Characteristics
Page 3
Rev 1: May.2020
WSF30100D
N-Ch MOSFET
Figure 7: Normalized Breakdown Voltage vs.
Junction Temperature
Figure 9: Maximum Safe Operating Area
vs. Case Temperature
Figure 8: Normalized on Resistance vs
Junction Temperature
Figure 10: Maximum Continuous Drain Current
Figure.11: Maximum Effective
Transient Thermal Impedance, Junction-to-Case
www.winsok.tw
Page 4
Rev 1: May.2020
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