SMD0805P010TF

Positive Thermal Coefficent RLY ELECTRO NICS SMD0805-010~110 Series Description The SMD0805 Series PTC provides surface mount overcurrent protection for applications where space is at a premium and resettable protection is desired. Features • RoHS compliant, lead-free and halogen-free • Fast response to fault currents • Compact design saves board space • Low resistance • Low-profile • Compatible with high temperature solders Applications • Mobile phones - battery and port protection • USB peripherals • Disk drives • Disk drives • PDAs / digital cameras • CD-ROMs • Plug and play protection for motherboards and peripherals • Game console port protection Electrical Characteristics I hold I trip Vmax I max Pd max. (A) (A) V(dc) (A) (W) Current (A) Time (Sec.) R min (Ω) R 1max (Ω) SMD0805P010TF 0.10 0.30 15 100 0.5 0.50 1.50 1.000 6.000 SMD0805P020TF 0.20 0.50 9 100 0.5 8.00 0.02 0.650 3.500 SMD0805P035TF 0.35 0.75 6 100 0.5 8.00 0.10 0.250 1.200 SMD0805P050TF 0.50 1.00 6 100 0.5 8.00 0.10 0.150 0.850 SMD0805P075TF 0.75 1.500 6 40 0.6 8.00 0.20 0.090 0.350 SMD0805P100TF 1.00 1.95 6 40 0.6 8.00 0.30 0.060 0.210 SMD0805P110TF 1.10 2.00 6 100 0.8 8.00 0.10 0.050 0.160 Type Number Maximum Time To Trip Resistance Ihold = Hold current: maximum current device will pass without tripping in 23°C still air. Itrip = Trip current: minimum current at which the device will trip in 23°C still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd = Power dissipated from device when in the tripped state at 23°C still air. Rmin = Minimum resistance of device in initial (un-soldered) state. Rtyp = Typical resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23°C measured one hour after tripping or reflow soldering of 260°C for 20 sec. ©2011 Ruilongyuan, Inc. 1 www.ruilon.com Positive Thermal Coefficent RLY ELECTRO NICS SMD0805-010~110 Series Temperature Rerating Ambient Operation Temperature -40°C -20°C 0°C 23°C 40°C 0805P010 0.14 0.12 0.11 0.10 60°C 70°C 0805P020 0.28 0.25 0.23 0.20 0.17 0.14 0805P035 0.47 0.44 0.39 0.35 0.30 0.27 0805P050 0.68 0.62 0.55 0.50 0.40 0.37 0805P075 1.00 0.90 0.79 0.75 0.63 0805P100 1.35 1.25 1.10 1.00 0.82 85°C 0.07 0.06 0.05 0.03 0.12 0.10 0.07 0.24 0.20 0.14 0.33 0.29 0.23 0.57 0.53 0.41 0.34 0.74 0.65 0.55 0.42 Hold Current (A) Part Number Average Time Current Curves 0.08 Temperature Rerating Curve Percentage of Rated Current 0.10A 0.20A 0.35A 0.50A 0.75A 1.00A 170% 0805 100000 10000 1000 Time in Seconds 50°C 150% 130% 110% 90% 70% 50% 30% 10% 100 -40 -30 -20 -10 0 10 20 30 40 50 Temperature (°C) 60 70 80 10 1 0.1 0.01 0.1 1 10 Current in Amperes 100 The average time current curves and Temperature Rerating curve performance is affected by a number or variables, and these curves provided as guidance only. Customer must verify the performance in their application. ©2011 Ruilongyuan, Inc. 2 www.ruilon.com Positive Thermal Coefficent RLY ELECTRO NICS SMD0805-010~110 Series Soldering Parameters Condition 260°C / 10 Sec Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec Preheat 120°C~ 180°C 50 Sec ~ 150 Sec 0°C~35°C, < = 70%RH Storage Condition • oven, N2 environment for lead–free • Recommended maximum paste thickness is 0.25mm (0.010 inch) • Devices can be cleaned using standard industry methods and solvents. Note: devices may not meet the performance requirements. Terminal Material Lead Solderability Soldering 260 Temperature (°C) Peak Temp/ Duration Time Cooling 220 180 120 0 Preheating 50 to 150 60 to 100 120 Time(s) Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Operating/Storage Temperature -40°C to +85°C ANSI/J-STD-002, Category 3 Maximum Device Surface Temperature in Tripped State 125°C Passive Aging +85°C, 1000 hours -/+5% typical resistance change Humidity Aging +85°C, 85%, R.H.,1000 hours -/+5% typical resistance change Thermal Shock MIL–STD–202, Method 107G +85°C/-40°C 20 times -30% typical resistance change Solvent Resistance MIL–STD–202, Method 215 No change Vibration MIL–STD–883C, Method 2007.1, Condition A No change Moisture Sensitivity Level Level 1, J–STD–020C ©2011 Ruilongyuan, Inc. 3 www.ruilon.com Positive Thermal Coefficent RLY ELECTRO NICS SMD0805-010~110 Series Dimensions MARKING CODE VARIES WITH AMPERAGE RATING (See Electrical Characteristic Table) SHOWN IS 1.0AMP RATING C A Top View N Bottom View N Side View B 1.20 mm (.047) Pad Layout D E 1.50 mm (.059) 1.00 mm (.040) Type Number A mm Max B mm Max C mm Max D mm Min E mm typ SMD0805P010TF 2.2 1.5 1.0 0.55 0.45 SMD0805P020TF 2.2 1.5 1.0 0.55 0.45 SMD0805P035TF 2.2 1.5 0.75 0.55 0.45 SMD0805P050TF 2.2 1.5 1.25 0.55 0.45 SMD0805P075TF 2.2 1.5 1.25 0.55 0.45 SMD0805P100TF 2.2 1.5 1.80 0.55 0.45 TAPE SPECIFICATIONS: EIA-481-1 (mm) 0805L010 0805L020 0805L035 0805L050 0805L075 REEL DIMENSIONS: EIA-481-1 (mm) 0805L100 W 8.0+/- 0.10 8.0+/- 0.10 8.0+/- 0.10 8.0+/- 0.10 H 12.0+/- 0.05 F 3.5+/- 0.05 3.5+/- 0.05 3.5+/- 0.05 3.5+/- 0.05 W 9.0+/- 0.5 E1 1.75+/- 0.10 1.75+/- 0.10 1.75+/- 0.10 1.75+/- 0.10 D Ø60+0.5 D0 1.55+/- 0.05 1.55+/- 0.05 1.55+/- 0.05 1.55+/- 0.05 F Ø13.0+/- 0.2 D1 1.0 (min) 1.0 (min) 1.0 (min) 1.0 (min) C Ø178+/- 1.0 P0 4.0+/- 0.10 4.0+/- 0.10 4.0+/- 0.10 4.0+/- 0.10 H1 11+/- 0.5 P1 4.0+/- 0.10 4.0+/- 0.10 4.0+/- 0.10 4.0+/- 0.10 W1 2.2+/- 0.5 P2 2.0+/- 0.05 2.0+/- 0.05 2.0+/- 0.05 2.0+/- 0.05 W2 3.0+0.5 A0 1.45+/- 0.10 1.42+/- 0.10 1.65+/- 0.10 1.65+/- 0.10 W3 4.0+0.5 B0 2.30+/- 0.10 2.24+/- 0.10 2.35+/- 0.10 2.35+/- 0.10 W4 5.5+0.5 T 0.25+/- 0.10 0.20+/- 0.10 0.20+/- 0.10 0.25+/- 0.10 K0 0.9+/- 0.10 1.04+/- 0.10 1.05+/- 0.10 1.50+/- 0.10 Leader min. 390 390 390 390 Trailer min. 160 160 160 160 ©2011 Ruilongyuan, Inc. 4 www.ruilon.com Positive Thermal Coefficent RLY ELECTRO NICS SMD0805-010~110 Series H P1 P2 D0 P0 E1 W4 W3 D F W T C W2 W F D2 W1 A0 K0 H1 B0 SHENZHEN RUILONG.YUAN CO.,LTD Phone: +86- 0755-82908296 82908752 82908224 82908036 Fax: +86- 0755-82908002 Email: jack@ruilon.com Website: http://www.ruilon.com RUILONYUAN Electronics ar e trademarks. 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