RFANT5220110A0T

Approval sheet MULTILAYER CERAMIC ANTENNA RFANT Pb free Series – RoHS Compliance Halogens Free Product 2.4 GHz ISM Band Working Frequency P/N: RFANT5220110A0T *Contents in this sheet are subject to change without prior notice. Page 1 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet FEATURES 3 1. Surface Mounted Devices with a small dimension of 5.2 x 2.0 x 1.1 mm meet future miniaturization trend. 2. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product. 3. High Stability in Temperature / Humidity Change APPLICATIONS 1. Bluetooth 2. Wireless LAN 3. HormRF 4. ISM band 2.4GHz wireless applications DESCRIPTION Walsin Technology Corporation develops a new ceramic embedded antenna specified for 2.4 GHz ISM Band application, as TM shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b and Bluetooth typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the friendly usage for antenna, this antenna has been designed to a typical 150MHz bandwidth through Walsin’s advanced LTCC (Low Temperature Co-fired Ceramic) technology and superior product design via 3D EM Simulation Skill. 3 This antenna has a rectangular ceramic body with a tiny dimension of 5.2x 2.0 x 1.1 mm meet the future SMT automation and miniaturization requirements on modern portable devices. CONSTRUCTION Soldering terminal Identification mark C WT Feeding DIMENSIONS Figure Page 2 of 9 Symbol Dimension L 5.20 ± 0.20 mm W 2.00 ± 0.20 mm T 1.15 ± 0.10 mm A 0.40 ± 0.25 mm ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet SOLDER LAND PATTERN DESIGN Figure ELECTRICAL CHARACTERISTICS RFANT5220110A0T Specification Working Frequency Range 2.4 GHz ～ 2.5GHz Gain 2 dBi (Typical) VSWR 2 max. Polarization Linear Azimuth Bandwidth Omni-directional Impedance 50Ω Rated Power (max.) 3 Watts Maximum Input Power 5 Watts for 5 minutes Operation Temperature -40˚C ~ +85˚C Remark: The specification is defined based on the test board dimension as in below Page 3 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet Antenna on Test Board ( FR4 Thickness 0.8mm) 3.3mm 1.5mm 2.5mm Empty Area 18x9 mm WTC Empty Area 1mm 18mm 50Ω Ω Feed line GROUND 30x18 mm Antenna S11 on Test Board Bandwidth >150MHz Page 4 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet RADIATION PATTERN Radiation Pattern and Gain were dependent on measurement board design. The specification of RFANT5220110A0T antenna was measured based on the PCB size and installation position as shown in the below figure Test Board WTC Empty Area WTC Z Y X Y Z GROUND 30x18 mm X Vertical Horizontal Y Y Y-Z Plane Average Gain= -0.82 dBi z z Peak Gain= -5.42 dBi Average Gain=-8.98 dBi Peak Gain = 1.69 dBi Average Gain =-3.22 dBi X-Z Plane z Average Gain=-0.91 dBi z X X Peak Gain= -5.97 dBi Average Gain=-3.24dBi Peak Gain= 2.66 dBi Average Gain= -8.61 dBi X X-Y Plane X Average Gain= -0.68 dBi Y Y Peak Gain= -5.97 dBi Average Gain=-3.12 dBi Page 5 of 9 Peak Gain= 2.59 dBi Average Gain= -9.24 dBi ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 *Solder bath temperature：235 ± 5°C At least 95% of a surface of each terminal JESD22-B102D *Immersion time：2 ± 0.5 sec electrode must be covered by fresh solder. *Solder：Sn3Ag0.5Cu for lead-free Leaching *Solder bath temperature：260 ± 5°C Loss of metallization on the edges of each of metallization) *Leaching immersion time：30 ± 0.5 sec electrode shall not exceed 25%. IEC 60068-2-58 *Solder : SN63A (Resistance to dissolution Resistance to soldering heat *Preheating temperature：120~150℃, No mechanical damage. JIS C 0050-5.4 Samples shall satisfy electrical specification 1 minute. *Solder temperature：270±5°C *Immersion time：10±1 sec after test. Loss of metallization on the edges of each electrode shall not exceed 25%. *Solder：Sn3Ag0.5Cu for lead-free Measurement to be made after keeping at room temperature for 24±2 hrs Drop Test JIS C 0044 *Height：75 cm No mechanical damage. *Test Surface：Rigid surface of concrete or Samples shall satisfy electrical specification after test. steel. *Times：6 surfaces for each units；2 times for each side. Adhesive Strength of Termination JIS C 0051- 7.4.3 *Pressurizing force： 5N(≦0603)；10N(>0603) No remarkable damage or removal of the termination. *Test time：10±1 sec Bending test The middle part of substrate shall be No mechanical damage. JIS C 0051- 7.4.1 pressurized by means of the pressurizing Samples shall satisfy electrical specification rod at a rate of about 1 mm/s per second after test. until the deflection becomes 1mm/s and then pressure shall be maintained for 5±1 sec. Measurement to be made after keeping at room temperature for 24±2 hours Page 6 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet Temperature cycle JIS C 0025 1. 30±3 minutes at -40°C±3°C, No mechanical damage. 2. 10~15 minutes at room temperature, Samples shall satisfy electrical specification 3. 30±3 minutes at +85°C±3°C, 4. 10~15 minutes at room temperature, after test. Total 100 continuous cycles Measurement to be made after keeping at room temperature for 24±2 hrs Vibration JIS C 0040 *Frequency：10Hz~55Hz~10Hz(1min) No mechanical damage. *Total amplitude：1.5mm Samples shall satisfy electrical specification *Test times：6hrs.(Two hrs each in three after test. mutually perpendicular directions) High temperature JIS C 0021 *Temperature：85°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Humidity (steady conditions) *Humidity：90% to 95% R.H. No mechanical damage. *Temperature：40±2°C Samples shall satisfy electrical specification JIS C 0022 *Time：1000+24/-0 hrs. after test. Measurement to be made after keeping at room temperature for 24±2 hrs ※ 500hrs measuring the first data then 1000hrs data Low temperature JIS C 0020 *Temperature：-40°C±2°C No mechanical damage. *Test duration：1000+24/-0 hours Samples shall satisfy electrical specification Measurement to be made after keeping at after test. room temperature for 24±2 hrs Page 7 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2 Fig 2. Infrared soldering profile ORDERING CODE RF Walsin RF device ANT 522011 0 Product code Dimension code Unit of dimension ANT : Antenna Per 2 digits of Length, Width, Thickness : 0 : 0.1 mm A 0 T Application Specification Packing A : 2.4GHZ ISM Band Design Code T : 7” Reeled 1 : 1.0 mm e.g. : 522011 = Length 52, Width 20, Thickness 11 Minimum Ordering Quantity: 2000 pcs per reel. PACKAGING Plastic Tape specifications (unit :mm) Index Dimension (mm) Index Dimension (mm) Page 8 of 9 Ao Bo ΦD T W 2.40 ± 0.10 5.50 ± 0.10 1.55 ± 0.05 1.20 ± 0.10 12.0 ± 0.10 E F Po P1 P2 1.75 ± 0.10 5.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 ASC_RFANT5220110A0T_V13 Sep. 2012 Approval sheet Reel dimensions C Index Dimension (mm) A B A B C Φ178 Φ60.0 Φ13.5 Typing Quantity: 2000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection, which can be confirmed. (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : -10 to +40°C Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Page 9 of 9 ASC_RFANT5220110A0T_V13 Sep. 2012