B3Q090

B3Q090 Order Code: B3Q090 Version: A0 2018-02-24 Gas Discharge Tube Features Exterior Surface Mounting Design 6.8×3.5×3.5mm Current Current Handling Capability 6,000A @ 8/20μ s Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level: Level 1 SMD Application Information rmation Package (Top View) xDSL ` 1 Agency Approvals 2 3 Schematic Symbol Icon Description Compliance with 2011/65/EU 1 2 Compliance with IEC61249-2-21:2003 Mean lead free 3 3 3 Electrical Parameter DC Breakdown Voltage 1)2) 3)4) Impulse Spark-over Voltage 4) Impulse Discharge Current 5) 100V/s 72-108 At 1kV/μs for 99 % of measured values At 1kV/μs Typical values of distribution V  650  600 V V 8/20μs 6,000 A Insulation Resistance DC=100V ≥1 GΩ C(1MHz) VDC=0.5V ≤1.0 pF Weight ~0.33 g Operating And Storage Temperature -40-+90 ℃ Marking Without 1) At delivery AQL 0.65 level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 4) Tip electrode “1”or “2”to center electrode “3” 5) Total Currents through center electrode 2, half value through each Tip electrode“1” “2”. 1 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3Q090 Order Code: B3Q090 Version: A0 2018-02-24 Gas Discharge Tube Product Characteristics Characteristics Part Numbering System B3Q 090 (1) (2) Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated (1) Bencent 3-Electrode SMD Gas Discharge Tube (2) DC Breakdown Voltage, e.g., 090=90V Environmental Reliability Characteristics Testing items High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Technical standards Temperature: 90℃ Time: 2H Temperature: -40℃ Time: 2H Frequency: 10-500Hz Amplitude: 0.15mm Time: 45mins Temperature: 260±5℃ Time of dip soldering: 10s, 1time Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions REF mm inch A B C D E F 6.8±0.2 2.4±0.15 1.2±0.1 0.4±0.1 3.5±0.15 3.5±0.15 0.268±0.008 0.094±0.006 0.047±0.004 0.016±0.004 0.138±0.006 0.138±0.006 REF mm inch A 8.10 0.217 B 1.75 0.138 C 1.40 0.055 D 1.80 0.071 E 4.20 0.165 Recommended Soldering Pad A C B D B C E 2 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3Q090 Order Code: B3Q090 Version: A0 2018-02-24 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time (min to max) 60 – 180 secs Average ramp up rate (Liquids) Tamp (TL) to peal TS(max) to TL - Ramp-up Rate 3°C/second max (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 seconds TL TS(max) Ramp-down Preheat TS(min) tS 260+0/-5 °C Time within 5°C of actual peak 8 – 20 seconds Temperature (tp) Critical Zone TL to TP Ramp-up TL 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 25 Time time to peak temper ature Package Reel Information 3 /3 OUTLINE REEL (PCS) PER CARTON (PCS) TAPING 2,000 32,000 www.bencent.com.cn REF mm inch A 3.9±0.2 0.154±0.008 B 7.0±0.2 0.276±0.008 d Φ1.5±0.1 Φ0.059±0.004 E 1.75±0.1 0.069±0.004 F 7.5±0.1 0.295±0.002 P 8.0±0.1 0.315±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 W 16.0±0.3 0.63±0.012 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 Φ0.512±0.006 W1 20.8±2.0 0.819±0.079 REEL DIAMETERS (mm) 330 CARTON SIZE(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications