BC3600

BC3600 Order Code: BC3600 Version: A3 2019-09-25 Gas Discharge Tube Features Small Size Design Exterior 4.5×3.2×3.2mm Current Handling Capability 2,000A @ 8/20μ s Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level：Level 1 SMD Application information rmation Package (Top View) AC Power ` 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance with IEC61249-2-21:2003 Mean lead free Compliance with UL1449,Certificated E337906 NO.B 104564 0001 Rev.00 DC Breakdown Voltage 1)2) 100V/s 3600(-20%~+20%) V At 1KV/μs For 99% of measured valuses ≤4800 V At 1KV/μs Typical values of distribution≤4700 V Hi-pot Test ID=10mA ≥1800 V Impulse Discharge Current 3) 8/20μs ±5times 2,000 A Impulse Discharge Current 3) 1.2/50μs ±40Times 10kV/12Ω A Impulse Discharge Current 3) 10/1000μs ±5Times 10 A AC Discharge Current 2A1S 1 Time Arc Voltage At 1A ~15 V Insulation Resistance DC=100V ≥1 GΩ Capacitance at 1 MHz VDC=0.5V ≤1 pF ~0.25 g -40-125 ℃ Impulse Spark-over Voltage Weight Operating And Storage Temperature Marking Without 1) At delivery AQL 0.65 level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC3600 Order Code: BC3600 Version: A3 2019-09-25 Gas Discharge Tube Part Numbering System BC 3600 (1) (2) Product Characteristics Characteristics (1)Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.：3600=3600V Lead Material Copper or iron nickel alloy Body Material Ceramics Terminal Finish 100% Matte-Tin Plated Environmental Reliability Characteristics Testing items Technical standards Temperature: 125℃ Time:2H Temperature: -40℃ Time:2H Frequency：10-500Hz Amplitude：0.15mm Time：45mins Temperature: 260±5℃ Time of dip soldering：10s，1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A C REF mm inch A 4.5±0.3 0.177±0.012 B 0.45±0.2 0.018±0.008 C 3.2±0.2 0.126±0.008 D 3.2±0.2 0.126±0.008 REF mm inch A 4.8 0.189 B 3.3 0.130 C 3.5 0.138 D B Recommended Soldering Pad A B C 2/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC3600 Order Code: BC3600 Version: A3 2019-09-25 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time （min to max） Average ramp up rate（Liquids）Tamp （TL） to peal TS(max) to TL - Ramp-up Rate 60 – 180 secs (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C TL Ramp-down Preheat TS(min) 60 – 150 seconds tS 25 8 – 20 seconds Temperature (tp) time to peak temperature Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 3/3 TS(max) 260+0/-5 °C Time within 5°C of actual peak Package Reel Critical Zone TL to TP Ramp-up TL 3°C/second max 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly Time Information OUTLINE REEL (PCS) PER CARTON (PCS) TAPING 2,500 40,000 www.bencent.com.cn REF mm inch A 3.7±0.2 0.146±0.008 B 5.0±0.1 0.197±0.004 d Φ 1.5±0.1 Φ 0.059±0.004 E 1.75±0.1 0.069±0.004 F 5.5±0.1 0.217±0.002 P 8.0±0.1 0.315±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 W 12.0±0.2 0.472±0.008 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.5 0.512±0.02 W1 16.8±2.0 0.661±0.079 REEL DIAMETERS (mm) 330 CARTON SIZE(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications