BC091N-H

BC091N-H Order Code: BC091N-H Version: A5 2018-03-26 Gas Discharge Tube Features Exterior Small Size Design EIA 18124.5×3.2×2.7mm Current Handling Capability 3,000A @ 8/20μ s Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level: Level 1 SMD Application Information rmation Package (Top View) Ethernet ` 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance withIEC61249-2-21:2003 Mean lead free Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage Impulse Discharge Current 3)4) 100V/s 63-117 V At 1kV/μs for 99 % of measured values650 V At 1kV/μs Typical values of distribution550 V 8/20μs 10 operation[5×(﹢)＆5×（﹣）] 3,000 A Arc Voltage At 1A ~10 V Insulation Resistance DC=50V ≥1 GΩ Capacitance at 1 MHz VDC=0.5V ≤0.5 pF Weight ~0.20 g Operating And Storage Temperature -40-125 ℃ Marking Without 1) At delivery AQL0.65level II ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 4) After impulse discharge current test: DC breakdown voltage: 63-130 1/ 3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC091N-H Order Code: BC091N-H Version: A5 2018-03-26 Gas Discharge Tube Part Numbering System BC 091 N –H (1) (2) (3) （4） Product Characteristics Characteristics Lead Material Copper or iron nickel alloy Body Material Ceramics Terminal Finish 100% Matte-Tin Plated (1) Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.: 091=9×101=90V (3) Tolerance of DC Breakdown Voltage, M=+-20%, N=+-30%, the Specific tolerance is decided by the table of “Electrical Parameter” (4) “-H” denotes the higher impulse discharge current Environmental Reliability Characteristics Testing items Technical standards Temperature: 125℃ Time:2H Temperature: -40℃ Time:2H Frequency: 10-500Hz Amplitude: 0.15mm Time: 45mins Temperature: 260±5℃ Time of dip soldering: 10s, 1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A C REF mm inch A 4.5±0.3 0.177±0.012 B 0.5±0.2 0.020±0.008 C 2.7±0.2 0.106±0.008 D 3.2±0.2 0.126±0.008 REF mm inch A 5.5 0.217 B 3.5 0.138 C 3.5 0.138 D B Recommended Soldering Pad A B C 2/ 3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC091N-H Order Code: BC091N-H Version: A5 2018-03-26 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time (min to max) 60 – 180 secs Average ramp up rate (Liquids) Tamp (TL) to peal TS(max) to TL - Ramp-up Rate 3°C/second max (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 seconds TS(max) TL Ramp-down Preheat TS(min) tS 260+0/-5 °C Time within 5°C of actual peak 8 – 20 seconds Temperature (tp) Critical Zone TL to TP Ramp-up TL 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 25 Time time to peak temperature Package Reel Information 3/ 3 OUTLINE REEL (PCS) PER CARTON (PCS) TAPING 2,500 40,000 www.bencent.com.cn REF mm inch A 3.7±0.2 0.146±0.008 B 5.0±0.1 0.197±0.004 d Φ 1.5±0.1 Φ 0.059±0.004 E 1.75±0.1 0.069±0.004 F 5.5±0.1 0.217±0.002 P 8.0±0.1 0.315±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 W 12.0±0.2 0.472±0.008 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 0.512±0.006 W1 16.8±2.0 0.661±0.079 REEL DIAMETERS (mm) 330 CARTON SIZE(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications