WSB5557Z-2/TR

WSB5557Z WSB5557Z Schottky Barrier Diode Http://www.sh-willsemi.com Features  100mA Average rectified forward current  Low forward voltage  Ultra-low leakage current  Small package DFN0603-2L DFN0603-2L(Bottom View) Applications  Circuit Low Current rectification Absolute maximum ratings Marking Parameter Symbol Value Unit Reverse voltage (repetitive peak) VRM 30 V Reverse voltage (DC) VR 30 V Average rectified forward current IO 100 mA IFSM 2 A TJ 150 O C Operating temperature Topr -40 ~ 150 O C Storage temperature Tstg -40 ~ 150 O C Peak forward surge current (8.3ms single sine pluse) Junction temperature Electronics characteristics (TA=25oC) Parameter Symbol Condition Min. Reverse Voltage VR IR=100uA 30 Forward Voltage VF Reverse current IR Junction capacitance CJ VR=5V, F=1MHz Thermal Resistance Rθ(JA) Junction to Ambient Typ. Max. Unit V IF=1mA 0.36 V IF=10mA 0.46 V VR=10V 0.3 uA VR=30V 0.5 uA 13 pF 650 K/W Order Information Device WSB5557Z-2/TR Package Marking DFN0603-2L *H (1) Shipping 10000/Reel&Tape Note 1：*= Month Code(A~Z); H= Device code; Will Semiconductor Ltd. 1 2015/3/4 - Rev.1. 0 WSB5557Z Typical characteristics (Ta=25oC, unless otherwise noted) 1000 1 o o o Reverse Current (uA) 0.1 o 125 C o 65 C o 0.01 150 C 100 85 C o 25 C o 0C 1E-3 o -40 C 1E-4 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 125 C 10 o 85 C 1 o 65 C 0.1 o 25 C o 0.01 0 C o -40 C 1E-3 1E-4 5 10 Forward Voltage (V) 15 20 25 Reverse Voltage (V) Fig.1 Forward voltage vs. Forward current Fig.2 Reverse current vs. Reverse voltage 40 o Junction Capacitance-Cj (pF) Forward Current (A) 150 C T=25 C f=1MHz 35 30 25 20 15 10 5 0 5 10 15 20 25 Reverse Voltage (V) Fig.3 Junction capacitance vs. Reverse voltage Will Semiconductor Ltd. 2 2015/3/4 - Rev.1. 0 30 WSB5557Z Package outline dimensions F G C E D A H B Symbol A Dimensions in millimeter Min. Typ. Max. 0.275 0.310 0.340 B 0.050 REF. C 0.270 0.320 0.370 D 0.570 0.620 0.670 E 0.125 0.160 0.195 F 0.030 REF. G 0.225 0.260 0.295 H 0.365 0.400 0.435 Recommend land pattern (Unit: mm) Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met. Will Semiconductor Ltd. 3 2015/3/4 - Rev.1. 0