SET23AXXL02 SERIES
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
Brightking’s SET23AXXL02 series of transient voltage suppressor (TVS)
are designed to protect components which are connected to data and
transmission lines from voltage surges caused by electrostatic discharge
(ESD), electrical fast transients (EFT) and lightning.
TVS diodes are characterized by their high surge capability, low operating
and clamping voltages, and fast response time. This makes them ideal for
use as board level protection of sensitive semiconductor components.
The low profile SOT-23 package allows flexibility in the design of crowded
circuit boards.
Features
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IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOT-23 surface mount package
Protects one bidirectional line or two unidirectional lines
Working voltage: 3.3V, 5V, 12V, 15V, 24V and 36V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
Applications
Pin Configuration
LINE 1
LINE 1
SET23AXXL02
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Cellular handsets and accessories
Personal digital assistants (PDA’s)
Portable instrumentation
Set Top Box (STB)
Servers, notebook, and desktop PC
Wireless bus protection
RS-232, RS-422, RS-423 protection
X
LINE 2
LINE 2
Bidirectional Protect Line
LINE 1
LINE 1
LINE 2
LINE 2
SET23AXXL02
Unidirectional Protect Lines
Revision:31-Jul-15
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SET23AXXL02 SERIES
Maximum Ratings
Rating
Symbol
Value
ESD voltage (Contact discharge)
Unit
±8
VESD
kV
ESD voltage (Air discharge)
±15
Storage & operating temperature range
TSTG ,TJ
-55~+150
℃
Electrical Characteristics (TJ=25℃)
SET23A03L02 (Marking: B 03C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Symbol
Condition
Min.
Typ.
VRWM
Max.
Unit
3.3
V
VBR
IBR=1mA
4
V
Reverse leakage current
IR
VR=3.3V
Each I/O pin
5
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
7.5
V
Clamping voltage (tp=8/20μs)
VC
IPP=10A
15
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
Symbol
Condition
200
pF
SET23A05L02 (Marking: B 05C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Min.
Typ.
VRWM
Max.
Unit
5
V
VBR
IBR=1mA
Reverse leakage current
IR
VR=5V
Each I/O pin
5
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
9.8
V
Clamping voltage (tp=8/20μs)
VC
IPP=15A
20
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
Revision:31-Jul-15
6
V
220
pF
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SET23AXXL02 SERIES
Electrical Characteristics (TJ=25℃)
SET23A12L02 (Marking: B 12C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Symbol
Condition
Min.
Typ.
VRWM
Max.
Unit
12
V
VBR
IBR=1mA
13.3
V
Reverse leakage current
IR
VR=12V
Each I/O pin
1
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
19
V
Clamping voltage (tp=8/20μs)
VC
IPP=10A
25.9
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
Symbol
Condition
100
pF
SET23A15L02 (Marking: B 15C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Min.
Typ.
VRWM
Max.
Unit
15
V
VBR
IBR=1mA
16.7
V
Reverse leakage current
IR
VR=15V
Each I/O pin
1
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
24
V
Clamping voltage (tp=8/20μs)
VC
IPP=10A
30
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
Symbol
Condition
90
pF
SET23A24L02 (Marking: B 24C)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Min.
Typ.
VRWM
Max.
Unit
24
V
VBR
IBR=1mA
Reverse leakage current
IR
VR=24V
each I/O pin
1
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
43
V
Clamping voltage (tp=8/20μs)
VC
IPP=5A
49
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
Revision:31-Jul-15
26.7
V
80
pF
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SET23AXXL02 SERIES
Electrical Characteristics (TJ=25℃)
SET23A36L02 (Marking: B 36C)
Parameter
Symbol
Reverse stand-off voltage
Condition
Min.
Typ.
VRWM
Reverse breakdown voltage
Max.
Unit
36
V
VBR
IBR=1mA
40
V
Reverse leakage current
IR
VR=36V
each I/O pin
1
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
51
V
Clamping voltage (tp=8/20μs)
VC
IPP=5A
76.8
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
70
pF
Typical Characteristics Curves
Figure 1. Power Derating Curve
Figure 2. Pulse Waveforms
110
100
Peak Power Dissipation (%)
100
90
Peak value Ipp
Waveform
Parameters:
tr=8µs
td=20µs
90
80
80
70
70
60
60
50
50
40
40
30
30
20
20
10
10
0
tr
0
25
50
75
100
125
150
TA-Ambient Temperature (℃)
0
0
5
10
15
20
25
30
t-Time (μs)
Figure 4. ESD Clamping(8kV Contact IEC61000-4-2)
Forward Voltage (V)
Figure 3. Forward Voltage vs. Forward Current
175
td=t|IPP/2
Revision:31-Jul-15
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SET23AXXL02 SERIES
Recommended Soldering Conditions
Reflow Soldering
Recommended Conditions
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (ts)
150℃
200℃
60-180 seconds
TS max to TL
-Ramp-up Rate
3℃/second max.
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Revision:31-Jul-15
20-40 seconds
6℃/second max.
8 minutes max.
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SET23AXXL02 SERIES
Dimensions (SOT-23)
Dimension
Symbol
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.08
0.18
0.003
0.007
B
0.15
-
0.006
-
C
-
0.13
-
0.005
D
0.89
1.09
0.035
0.043
E
2.80
3.05
0.110
0.120
F
1.90
0.075
G
0.95
0.037
H
1.19
1.40
0.047
0.055
I
2.10
2.49
0.083
0.098
J
0.35
0.50
0.014
0.020
Packaging
Tape
Reel
Symbol
Dimension (mm)
W
8.00±0.30
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.10
D0
Φ1.55±0.10
D1
Φ1.00±0.05
E
1.75±0.10
F
3.50±0.10
A
3.10±0.10
A0
2.10±0.10
B
2.75±0.10
B0
0.65±0.10
K
1.10±0.10
t
0.20±0.05
D
Φ178.0±2.0
D2
Φ13.0
W1
9.5
Quantity: 3000PCS
Revision:31-Jul-15
www.brightking.com
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