SDD32C18L01

SDD32C18L01 Electrostatic Discharged Protection Devices (ESD) Data Sheet Description Brightking’s SDD32C18L01 is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. It is designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge(ESD), electrical fast transients(EFT), and cable discharge events(CDE). Features ● ● ● ● ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance SOD-323 surface mount package Protects bi-directional line Peak power dissipation of 320W under 8/20μs waveform Working voltage: 18V Low leakage current Low clamping voltage Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: 2K Pin Configuration Applications ● ● ● ● Cellular handsets & Accessories Cordless phones Personal digital assistants (PDAs) Notebooks & Handhelds ● ● ● ● Portable instrumentation Digital cameras Peripherals MP3 players Maximum Ratings Rating Peak pulse power (tp=8/20μs waveform) ESD voltage (Contact discharge) ESD voltage (Air discharge) Storage & operating temperature range Revision：16-Jul-15 Symbol Value Unit PPP 320 W VESD TSTG ,TJ ±8 ±15 -55~+150 kV ℃ www.brightking.com SDD32C18L01 Electrical Characteristics (TJ=25℃) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 18 V VBR IBR=1mA 20 V Reverse leakage current IR VR=18V 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 29 V Clamping voltage (tp=8/20μs) VC IPP=5A 40 V Off state junction capacitance CJ 0Vdc,f=1MHz 40 pF Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveform 110 100 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 td=t|PP/2 30 20 10 0 0 5 10 15 20 25 30 t-Time (μs) Junction Capacitance (pF) Figure 3. Capacitance vs. Reverse Voltage Revision：16-Jul-15 www.brightking.com SDD32C18L01 Recommended Soldering Conditions Reflow Soldering Recommended Condition Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate Time 25℃ to Peak Temperature Revision：16-Jul-15 20-40 seconds 6℃/second max. 8 minutes max. www.brightking.com SDD32C18L01 Dimensions (SOD-323) G E Dimension Symbol X H 1 2 F A D B C detail X Millimeters Inches Min. Max. Min. Max. A 0.80 1.10 0.031 0.043 B - 0.10 - 0.004 C 0.20 - 0.008 - D 0.11 0.20 0.004 0.008 E 1.15 1.35 0.045 0.053 F - 0.35 - 0.014 G 1.60 1.80 0.063 0.071 H 2.40 2.60 0.094 0.102 Packaging F B0 B Reel W E Tape Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 1.48±0.10 A0 0.80±0.10 B 3.00±0.10 B0 1.80±0.10 K 1.05±0.10 t 0.25±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS Revision：16-Jul-15 www.brightking.com