UBQ10A05L04HI

UBQ10A05L04HI Electrostatic Discharged Protection Devices (ESD) Data Sheet Description UBQ10A05L04HI is a ultra low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from over-voltage caused by electrostatic discharge (ESD), cable discharge events (CDE), and electrical fast transients (EFT). It has a typical capacitance of only 0.3pF between I/O pins. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC61000-4-2. They are designed for easy PCB layout by allowing the traces to run straight through the device. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, UDI, Display PortTM, MDDI, Serial ATA and Infiniband circuits. Features 1 2 3 4 5 10 9 8 7 6 Pin Configuration TMDS D2+ 1 IEC61000-4-2 ESD 20kV Air, 20kV contact compliance QFN-10 (2.5×1.0×0.5mm) surface mount package Protects four I/O lines Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: B 54 10 ● ● ● ● ● ● ● ● ● ● ● ● TMDS D2- TMDS D2- GND Applications Revision:ESD-UBQ10A05L04HI -001(A1) TMDS D1+ TMDS D1+ TMDS D1- TMDS D1- TMDS D0+ TMDS D0- GND 1/5 1 High Definition Multimedia Interface (HDMI 1.4) Digital Visual Interface (DVI) Unified Display Interface (UDI) Display Port Interface MDDI Ports PCI Express Serial ATA GND 10 ● ● ● ● ● ● ● TMDS D2+ TMDS D0+ TMDS D0- GND TMDS CK+ TMDS CK+ TMDS CK- TMDS CK- http://brightking.pulseelectronics.com UBQ10A05L04HI Maximum Ratings Rating Symbol Value Unit IPP 5 A Peak Pulse Current (tp=8/20μs) ESD voltage (Contact discharge) ±20 VESD kV ESD voltage (Air discharge) ±20 Storage & operating temperature range TSTG ,TJ ℃ -55~+150 Electrical Characteristics (TJ=25℃) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 5 V VBR IBR=1mA Reverse leakage current IR VR=5V Each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 9.8 V Clamping voltage (tp=8/20μs) VC IPP=4A 15 V Off state junction capacitance Revision:ESD-UBQ10A05L04HI -001(A1) 6 V 0Vdc,f=1MHz I/O pin to GND 0.6 pF 0Vdc,f=1MHz Between I/O pins 0.3 pF CJ 2/5 http://brightking.pulseelectronics.com UBQ10A05L04HI ESD Protection Standards IEC61000-4-2 Interfaces of consumer electronic equipment are widely specified according to the International Electrotechnical Commission standard IEC61000-4-2. This standard is not targeted towards particular devices but towards general equipment, systems and subsystems that may be involved in electrostatic discharge. consists of a 150pF capacitor and a 330Ω series resistor representing the counterpart to the Device Under Test (DUT). 330Ω 50MΩ to 100MΩ v high-voltage generator 150pF DUT 001aaf202 Test circuit according IEC61000-4-2 IPP 100% 90% 10% tr=0.7ns to 1ns t 30ns 60ns ESD surge according IEC61000-4-2 Revision:ESD-UBQ10A05L04HI -001(A1) 3/5 http://brightking.pulseelectronics.com UBQ10A05L04HI Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-UBQ10A05L04HI -001(A1) 20-40 seconds 8 minutes max. 4/5 http://brightking.pulseelectronics.com UBQ10A05L04HI Dimensions (QFN-10) Dimension D Symbol 1 E L 10 e b2 b1 Millimeters Inches Min. Nom. Max. Min. Nom. Max. A 0.45 0.55 0.65 0.018 0.022 0.026 A1 - 0.03 0.05 - 0.001 0.002 A A2 A2 A1 1.00 0.675 1.55 0.20 0.875 0.50 Recommended Soldering Pad Layout 0.005REF b1 0.15 0.20 0.25 0.006 0.008 0.010 b2 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 e 0.20 0.40 0.13REF L 0.50BSC 0.30 0.38 0.020BSC 0.43 0.012 0.015 0.017 Packaging Tape Pin Code P0 P1 P2 K F B W E øD0 A øD1 t Reel D2 D Revision:ESD-UBQ10A05L04HI -001(A1) W1 5/5 Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.80±0.05 E 1.75±0.10 F 3.50±0.10 A 1.22±0.10 B 2.70±0.10 K 0.70±0.05 t 0.25±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS http://brightking.pulseelectronics.com