SDT23C24L02-AT

SDT23C24L02-AT Electrostatic Discharged Protection Devices (ESD) Data Sheet Description Brightking’s SDT23C24L02-AT component is designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage induced transient events. It is designed for use in applications where board space is at a premium. The device will protect up to two lines. It is bidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid state device designed specifically for transient suppression. It feature large cross -sectional area junctions for conduction high transient currents. It offer desirable characteristics for board level protection including fast response time, low and clamping voltage, and no device degradation. The device may be used to meet the immunity requirements of IEC61000-4-2, level 4. The size SOT-23 package makes them ideal for use in portable electronics such as RS-422 I/Os, RS-232 I/Os, notebook computers, and servers. Features ● ● ● ● ● ● ● ● ● ● ● ● ● SOT-23 surface mount package Protects bidirectional two I/O lines Peak power dissipation of 350W under 8/20μs waveform Working voltage: 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 AEC-Q101 qualified Marking: C24 Pin Configuration Applications ● ● ● ● RS-232 and RS-422 data lines Microprocessor based equipment LAN/WAN equipment Desktops PC and serves ● ● ● ● Notebook, Laptop and Palmtop computers Set Top Box Peripherals Serial and Parallel ports Maximum Ratings Rating Peak pulse power (tp=8/20μs waveform) ESD voltage (Contact discharge) ESD voltage (Air discharge) Storage & operating temperature range Revision：06-Mar-17 Symbol Value Unit PPP 350 W VESD TSTG ,TJ ±15 ±25 -55~+150 kV ℃ www.brightking.com SDT23C24L02-AT Electrical Characteristics (TJ=25℃) Parameter Symbol Reverse stand-off voltage Condition Min. Typ. VRWM Reverse breakdown voltage Max. Unit 24 V VBR IBR=1mA 26.7 V Reverse leakage current IR VR=24V Each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 43 V Clamping voltage (tp=8/20μs) VC IPP=5A 52 V Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND 40 pF Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveforms 110 100 Peak Power Dissipation (%) 100 90 Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 tr 0 25 50 75 100 125 150 0 175 TA-Ambient Temperature (℃) 0 5 10 15 20 25 30 t-Time (μs) Figure 4. Normalized Capacitance vs. Reverse Voltage Junction Capacitance (pF) Figure 3. Non-Repetitive Peak Pulse vs. Pulse Time td=t|IPP/2 Revision：06-Mar-17 www.brightking.com SDT23C24L02-AT Recommended Soldering Conditions Reflow Soldering Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate Time 25℃ to Peak Temperature Revision：06-Mar-17 20-40 seconds 6℃/second max. 8 minutes max. www.brightking.com SDT23C24L02-AT Dimensions (SOT-23) Dimension Symbol Millimeters Inches Min. Max. Min. Max. A 0.08 0.18 0.003 0.007 B 0.15 - 0.006 - C - 0.13 - 0.005 D 0.89 1.09 0.035 0.043 E 2.80 3.05 0.110 0.120 F 1.90 0.075 G 0.95 0.037 H 1.19 1.40 0.047 0.055 I 2.10 2.49 0.083 0.098 J 0.35 0.50 0.014 0.020 Packaging Tape Reel Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 3.10±0.10 A0 2.10±0.10 B 2.75±0.10 B0 0.65±0.10 K 1.10±0.10 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS Revision：06-Mar-17 www.brightking.com