FSMD110-33R

FUZETEC TECHNOLOGY CO., LTD. NO. PQ04-01ER Product Specification and Approval Sheet Version B1 Page 1/5 Surface Mountable PTC Resettable Fuse: FSMD1812 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~3.00A (e) Maximum Voltage: 6V~60VDC (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL: C-UL: TÜ V: File No. E211981 File No. E211981 File No. R50004084, R50090556 3. Electrical Characteristics (23℃) Part Trip Rated Max Typical Current Current Voltage Current Power Current IH, A IT, A VMAX, VDC IMAX, A Pd, W 0.10 0.14 0.20 0.20 0.30 0.35 0.35 0.50 0.50 0.75 0.75 0.75 1.10 1.10 1.10 1.10 1.25 1.25 1.50 1.50 1.50 1.60 1.60 1.60 2.00 2.00 2.60 0.30 0.30 0.40 0.40 0.60 0.70 0.70 1.00 1.00 1.50 1.50 1.50 2.20 2.20 2.20 2.20 2.50 2.50 3.00 3.00 3.00 3.20 3.20 3.20 3.50 3.50 5.00 60 60 30 60 30 16 30 16 30 16 24 33 8 16 24 33 6 16 8 12 24 8 12 16 8 16 8 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 1.0 1.0 0.8 0.8 1.0 0.8 0.8 0.8 0.8 1.0 1.0 0.8 1.0 1.0 1.0 1.0 1.0 Number FSMD010-R FSMD014-R FSMD020-R FSMD020-60-R FSMD030-R FSMD035-R FSMD035-30-R FSMD050-R FSMD050-30-R FSMD075-R FSMD075-24R FSMD075-33R FSMD110-R FSMD110-16-R FSMD110-24R FSMD110-33R FSMD125-R FSMD125-16R FSMD150-R FSMD150-12R FSMD150-24R FSMD160-R FSMD160-12R FSMD160-16R FSMD200R FSMD200-16R FSMD260R Max Time to Trip Hold Resistance Time RMIN R1MAX Amp Sec Ohms Ohms 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 0.020 0.008 0.020 0.020 0.100 0.100 0.100 0.150 0.150 0.200 0.200 0.200 0.300 0.500 0.500 0.500 0.400 0.400 0.500 0.500 1.500 0.500 1.000 1.000 2.000 5.000 2.500 1.600 1.200 0.800 0.800 0.200 0.320 0.320 0.150 0.150 0.110 0.110 0.110 0.040 0.060 0.060 0.060 0.050 0.050 0.040 0.040 0.040 0.030 0.030 0.030 0.020 0.020 0.015 15.000 6.500 5.000 5.000 1.750 1.500 1.500 1.000 1.000 0.450 0.290 0.400 0.210 0.180 0.200 0.200 0.140 0.140 0.110 0.110 0.120 0.100 0.100 0.100 0.070 0.085 0.047 NOTE : Specification subject to change without notice. 2017/9/13 NO. FUZETEC TECHNOLOGY CO., LTD. PQ04-01ER Product Specification and Approval Sheet Version B1 FSMD260-13R FSMD260-16R FSMD300R 2.60 2.60 3.00 5.00 5.00 5.00 13.2 16 6 100 100 100 1.3 1.3 1.0 8.0 8.0 8.0 5.000 5.000 4.000 Page 2/5 0.015 0.015 0.012 0.050 0.050 0.040 IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin 4. FSMD Product Dimensions (Millimeters) Part Number FSMD010-R FSMD014-R FSMD020-R FSMD020-60-R FSMD030-R FSMD035-R FSMD035-30-R FSMD050-R FSMD050-30-R FSMD075-R FSMD075-24R FSMD075-33R FSMD110-R FSMD110-16-R FSMD110-24R FSMD110-33R FSMD125-R FSMD125-16R FSMD150-R FSMD150-12R FSMD150-24R FSMD160-R FSMD160-12R FSMD160-16R FSMD200R FSMD200-16R FSMD260R FSMD260-13R A B C D E Min Max Min Max Min Max Min Max Min Max 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.37 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 4.73 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.07 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 3.41 0.60 0.60 0.60 0.60 0.40 0.40 0.40 0.35 0.45 0.35 0.80 0.80 0.25 0.25 0.80 0.80 0.25 0.50 0.25 0.60 0.60 0.25 0.60 0.60 0.55 0.60 0.55 0.80 0.90 0.90 0.90 0.90 0.70 0.70 0.70 0.65 0.75 0.65 1.55 1.55 0.55 0.90 1.30 1.30 0.55 1.00 0.55 1.10 1.55 0.90 1.35 1.35 1.20 1.55 1.20 1.55 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.25 0.25 0.30 0.30 0.25 0.25 0.30 0.30 0.30 0.25 0.25 0.30 0.25 0.25 0.25 0.25 0.25 0.25 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.95 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 0.65 NOTE : Specification subject to change without notice. 2017/9/13 NO. FUZETEC TECHNOLOGY CO., LTD. PQ04-01ER Product Specification and Approval Sheet Version B1 FSMD260-16R FSMD300R 4.37 4.37 4.73 4.73 3.07 3.07 3.41 3.41 0.80 0.80 1.55 1.55 0.25 0.25 0.95 0.95 Page 3/5 0.25 0.25 0.65 0.65 5. Thermal Derating Curve FSMD Series Percent of Rated Hold and Trip Current 200% 150% 100% A= FSMD075-R, 075-24R, 075-33R, 110-R, 110-16-R, 110-24R, 110-33R, 125-R, 125-16R, 150-R, 150-12R, 150-24R, 160-R, 160-12R, 160-16R, 200R, 200-16R, 260R, 260-13R, 260-16R, 300R 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (℃) B= FSMD010-R, 014-R, 020-R, 020-60-R, 030-R, 035-R,035-30-R,050-R, 050-30-R 6. Typical Time-To-Trip at 23℃ AB C DE F G HIJ K LM N 100 10 Time-to-trip (S) A = FSMD010-R B = FSMD014-R C = FSMD020-R / 020-60-R D = FSMD030-R E = FSMD035-R / 035-30-R F = FSMD050-R / 050-30-R G = FSMD075-R / 075-24R / 075-33R H = FSMD110-R / 110-16-R / 110-24R / 110-33R I = FSMD125-R / 125-16R J = FSMD150-R / 150-12R / 150-24R K = FSMD160-R / 160-12R / 160-16R L = FSMD200R / 200-16R M = FSMD260R / 260-13R / 260-16R N = FSMD300R 1 0.1 0.01 0.001 0.1 1 10 100 Fault Current (A) NOTE : Specification subject to change without notice. 2017/9/13 FUZETEC TECHNOLOGY CO., LTD. NO. PQ04-01ER Product Specification and Approval Sheet Version B1 Page 4/5 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System Part Marking System FSMD □ □ □ – R F110 Current Rating F □ □ □ Part Identification Example Fuzetec Logo OR FSMD □ □ □ – □ □ – R F 110 16 Voltage Rating Current Rating F □ □ □ □ □ Part Identification Example Fuzetec Logo Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : Specification subject to change without notice. 2017/9/13 FUZETEC TECHNOLOGY CO., LTD. NO. PQ04-01ER Product Specification and Approval Sheet Version B1 Page 5/5 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1812 device Pad dimensions (millimeters) A B Device Nominal Nominal All 1812 Series 3.45 1.78 C Nominal 3.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to of the package, measured on the package body surface. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Reflow Profile NOTE : Specification subject to change without notice. 2017/9/13