B1201D

产品承认书 SPECIFICATION FOR APPROVAL CUSTOMER： CUSTOMER P/N： JXD P/N. : B1201D DESCRIPTION： 10/100 BASE-T MAGNETICS MODULES REF NO: QTC-005 REV/NO: A/0 DATE: 2014-9-28 ATTACHMENT： ■ SPECIFICATION ■ SAMPLE Q’TY OF SAMPLES √ PCS CUSTOMER'S SIGNATURE REMARK FULL APPROVED CONDITIONAL APPROVED REJECTED 深圳磁联达电子有限公司 Shenzhen CND-TEK Industrial Co.,Ltd 公司地址: 深圳市南山区西丽镇阳光工业区5栋3楼 TEL: 86-755-29016433 FAX: 0755-27652977 Email: cd001@cd-tek.com Http: //www.cd-tek.com 1. FEATURES: 1.1 Compatible with various 10/100 Base-TX transceiver requiring 1:1 transmit and receive turns ratio 1.2 Compliant with IEEE 802.3 standard including baseline wander compensation specification of 350uH OCL when Biased at 8mA from 0℃ to 70℃ 1.3 Single channel interface for 10/100Mbps Ethernet applications with CMC’s tuned to Enhance EMC system performance 1.4 Availiable in Through Hole package. 1.5 Operating Temperature range: 0℃ TO +70℃ 1.6 Storage temperature range: -25℃ TO +125℃ 2. DIMENSIONS & MARKING DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：B1201D 深圳磁联达电子有限公司 Shenzhen magnetic Lianda Electronics Co. Ltd. REV.: A/0 PAGE: 2 OF 4 3. SCHEMATICS: 4.ELECTRICAL SPECIFICATIONS @25℃ 4.1 OCL : 350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias 4.2 Leakage Inductance: 0.5 μH Max. @ 100KHz, 0.2V 4.3 Cw/w: 56 pF Max. @ 100KHz, 0.2V 4.4 DCR: 0.9 Max. 4.5 Turns Ratio(±5%): 1CT:1(TX), 1CT:1(RX) 4.6 Polarity: 1-12, 4-9 In-Phase 4.7 Insertion Loss: -1.1 dB Max. (TX & RX)@ 1-100 MHz 4.8 Return Loss: -18 dB Min @ 0.5-30MHz -15 dB Min @ 40 MHz -13 dB Min @ 60 MHz -11 dB Min @ 80 MHz -10 dB Min.@ 100 MHz 4.9 Cross Talk: -45 dB Min.@ 30 MHz -40 dB Min.@ 60 MHz -35 dB Min.@ 100 MHz 4.10 Common Mode Rejection : -43 dB Min.@ 1-30 MHz -37 dB Min.@ 60 MHz -33 dB Min.@ 80-100 MHz 4.11 Isolation HI-POT: 1500Vrms 1mA 1Second DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：B1201D REV.: A/0 深圳磁联达电子有限公司 Shenzhen magnetic Lianda Electronics Co. Ltd. PAGE: 3 OF 4 5. Recommended Lead Free Wave Soldering Curve : Item Soldertechnique simulation 1 Solder iron 2 Vapor phase reflow 3 4 5 Wave:TopsideBoar d-mount product Wave:BottomsideB oard-mount product Vapor phase reflow Temperature (℃) 350±10 (solder irno temp) 215±5 (vapor temp) 260±5 (solder temp) 260±5 (solder temp) 215±5 (vapor temp) Time(s) Temperature ramp/immersion and emersion rate 4~5 10±1 25mm/s±6mm/s 20±1 10±1 215±5 (vapor temp) Preheat 1℃/s~4℃/s to within 100℃ of solder temp 25mm/s±6mm/s 6. Reliability Test Criteria： 6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement. 6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright. 6.3 Resistance to soldering heat : Dip in 260℃+/- 5℃ molten solder for 5+/- 0.5 seconds. Shall not be any abnormality. 6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality. 6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any abnormality. 6.6 Dry heat: 100+/-2℃ 96 hours. 6.7 Cold: -20+/-2℃ 96 hours. 6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours. 6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃. DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：B1201D REV.: A/0 深圳磁联达电子有限公司 Shenzhen magnetic Lianda Electronics Co. Ltd. PAGE: 4 OF 4