G2401S

产品承认书 SPECIFICATION FOR APPROVAL CUSTOMER： CUSTOMER P/N： CND-TEK P/N. : G2401S DESCRIPTION： 1000 BASE-T MAGNETICS MODULES REF NO: REV/NO: A/0 DATE: 2014-9-15 ATTACHMENT： ■ SPECIFICATION ■ SAMPLE Q’TY OF SAMPLES √ PCS CUSTOMER'S SIGNATURE REMARK FULL APPROVED CONDITIONAL APPROVED REJECTED 深圳磁联达电子有限公司 Shenzhen CND-TEK Industrial Co.,Ltd 公司地址: 深圳市南山区西丽镇阳光工业区5栋3楼 TEL: 86-755-29016433 FAX: 0755-27652977 Email: cd001@cd-tek.com Http: //www.cd-tek.com 1. FEATURES: 1.1 Designed for long haul Gigabit Ethernet 100/1000 Base-T, full duplex applications. 1.2 Supports four pairs of category 5 UTP cable,Cable interface for isolation and low common mode emissions. 1.3 Low profile Surface Mount Packaging designed for Hi-Temp Reflow Process 1.4 Compliant with IEEE 802.3ab standard for 1000 Base-T,Designed to support 1:1 Turns Ratio Transceivers. 1.5 Operating Temperature range: 0℃ TO +70℃ 1.6 Storage temperature range: -25℃ TO +125℃ 2. DIMENSIONS & MARKING DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：G2401S 深圳磁联达电子有限公司 Shenzhen CND-TEK Industrial Co.,Ltd REV.: A/0 PAGE: 2 OF 4 3. SCHEMATICS: 4.ELECTRICAL SPECIFICATIONS @25℃ 4.1 OCL : 350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias 4.2 Leakage Inductance: 0.5 μH Max. @ 100KHz, 0.2V 4.3 Cw/w: 28 pF Max. @ 100KHz, 0.2V 4.4 DCR: 0.9 Max. 4.5 Turns Ratio(±5%): 1CT:1(TX), 1CT:1(RX) 4.6 Polarity: 2-23, 5-20, 8-17, 11-14 In-Phase 4.7 Insertion Loss: -1.0 dB Max. @ 1-100MHz 4.8 Return Loss: -16 dB Min. @ 1-30MHz -12 dB Min. @ 30-60 MHz -10 dB Min.@ 60-80 MHz 4.9 Cross Talk: -42 dB Min.@ 1-60 MHz -35 dB Min.@ 60-100 MHz 4.10 Common Mode Rejection : -40 dB Min.@ 1-30 MHz -35 dB Min.@ 60 MHz -30 dB Min.@ 80-100 MHz 4.11 Isolation HI-POT: 1500Vrms 1mA 1Second DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：G2401S REV.: A/0 深圳磁联达电子有限公司 Shenzhen CND-TEK Industrial Co.,Ltd PAGE: 3 OF 4 5. Recommended Lead Free IR Reflow Soldering Curve： Temperature Temperature ramp/immersion Time(s) (℃) and emersion rate 350±10 1 Solder iron 4~5 (solder irno temp) 215±5 2 Vapor phase reflow 60±5 (vapor temp) IR/convection 255±5 1℃/s~4℃/s time above 183℃ 3 30±5 reflow (component temp) 90s~120s Note：The curve includes recommended value only, please adjust your equipment to make sure the solder process.Details please refers to the standard J-STD-020. Item Soldertechnique simulation 6. Reliability Test Criteria： 6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement. 6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright. 6.3 Resistance to soldering heat : Convection reflow condition setting: peak temperature at 260℃+0/-5℃ above 217℃ for 90-180 seconds, ramp-up rate 2-3℃/s. Ramp-down rate 6℃/s Max. No mechanical problem found. No electrical failure found per our specification. 6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality. 6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any abnormality. 6.6 Dry heat: 100+/-2℃ 96 hours. 6.7 Cold: -20+/-2℃ 96 hours. 6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours. 6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃. DRAWN BY: CHECKED BY: APPROVED BY: CUSTOMER: PART NO. ：G2401S REV.: A/0 深圳磁联达电子有限公司 Shenzhen CND-TEK Industrial Co.,Ltd PAGE: 4 OF 4