D-G080508G1-KS2

无锡市方舟科技电子有限公司 WUXI ARK TECHNOLOGY ELECTRONIC CO. , LTD 规格书 DATASHEET  方舟 P/N（ARKLED P/N） ： D-G080508G1-KS2  日期（Date）：2017-03-10  版本（Version）：V1.0 制定： 审核： 地址：江苏省宜兴市金张渚工业集中区宇龙路 6 号 Add: NO.6, Yulong Road, Golden Zhangzhu Industrial Park, Yixing City, Jiangsu Province, China 电话(Tel): 销售(Sales): 0086-510-87341161 技术(Tech) : 0086-510-87341558 邮箱(Email)：销售(Sales):sales@arkchn.com 技术(Tech) : tech@arkchn.com 传真(Fax) : 0086-510-87342800 网址(Website) : www.arkch.com DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) Page 2／12 产品特征  由 8mm 料带装载在直径 7 英寸料盘上  适用于高速贴片设备  适用于回流焊接设备  高可靠性和高稳定性  高品质、和低功耗、低成本  符合 RoHS 指令要求  符合无铅要求  静电承受能力 1000V(HBM) Fetures  Package in 8mmtape on 7” diameter reel  Compatible with automatic placement equipment.  Compatible with infrared and vapor phase reflow solder process.  High intensity and reliability.   High quality, Low power requirement and low cost.  Pb-free.  ESD 2000V(HBM). The product itself will remain within RoHS compliant version. 物料基本信息 Device Selection Guide 芯片材料 Chip material 发光颜色 Emitted color 环氧树脂颜色 Resin Color InGaN 纯绿色 Pure Green 透明 Water Clear DATESHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 绝对最大额定参数 Page 3／12 Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 最大 Maximum 单位 Unit 功率 Power Dissipation Pd 70 mW 峰值正向电流 Peak Forward Current (Duty 1/10 @1KHz) IF(Peak) 80 mA 正向电流 Continuous Forward Current IF 20 mA 反向电压 Reverse Voltage VR 5 V 静电放电 Electrostatic Discharge(HBM) ESD 1000 V 工作温度范围 Operating Temperature Range Topr -30 to +80 ℃ 存储温度范围 Storage Temperature Range Tstg -40 to +90 ℃ 焊接温度 Soldering Temperature Tsol 回流焊：260℃/10 sec 手工焊：350℃/3 sec Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 光电参数 Page 4／12 Electrical/Optical Characteristics(Ta=25℃) 参数 Parameter 符号 Symbol 最小值 Min. 平均值 Typ. 最大值 Max. 单位 Unit 条件 Condition 发光强度 Luminous Intensity IV 250 *** 330 mcd IF=5mA 主波长 Dominant Wavelength λd 526 *** 531 nm IF=5mA 视角 Dominant Wavelength 2θ1/2 ----- 120 ----- Deg IF=5mA 正向电压 Forward Voltage VF 2.6 3.2 V IF=5mA 反向电流 Reverse Current IR ----- 10 µA VR=5V 注意： 1. 光强公差为±15% 2. 正向电压公差为± 0.1v 3. 主波长公差为± 1nm ----- Note: 1. Luminous Intensity Tolerance ±15% 2. Forward VoltageTolerance ± 0.1v 3. Dominant Wavelength Tolerance ± 1nm DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 光电曲线 Typical Electro-Optical Characteristics Curves Page 5／12 DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 外型尺寸图 Page 6／12 Package Outline Dimensions ① ② ① ② 极性 Polarity 负极 Cathode Mark 推荐焊盘尺寸 Recommend Soldering Pad ① 注意： 1. 单位为毫米. 2. 未标注的公差为±0.1mm. ② Note: 1. All dimensions are in millimeters. 2. Tolerances unspecified are ±0.1mm. DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 包装材料 标贴解释 Page 7／12 Packing Materials ARKLED方舟科技 Label Explanation CODE: P/N:  P/N：型号 Part Number  QTY：数量 Packing Quantity  BIN：BIN 级  LOT No: 生产任务单号  ERP No: ERP 单据编号 BIN Rank XXXXXXXXXXXXX XXXXXXXXXXXXX QTY: 3000PCS BIN: XXXXXX LOT NO: XXXXXXX IV(mcd): XXXXXX ERP NO: XXXXXXX Date: XXXXXX Lot Number ERP Number 料盘尺寸 Reel Dimensions 注意： 1. 单位为毫米. 2. 未标注的公差为±0.1mm. Note: 1. All dimensions are in millimeters. 2. Tolerances unspecified are ±0.1m DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) Page 8／12 包装数量：每料盘装载数量 3000 颗 Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel 注意： 1. 单位为毫米. 2. 未标注的公差为±0.1mm. 包装 Note: 1. All dimensions are in millimeters. 2. Tolerances unspecified are ±0.1mm. Moisture Resistant Packaging 标签 Label 干燥剂 Desiccant 防潮袋 Moistue-proof Bag DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) Page 9／12 可靠性实验和条件 Reliability Test Items And Conditions  产品的可靠性必须通过以下实验。  The reliability of products shall be satisfied with items listed below.   Confidence level：90% LTPD：10%   置信等级：90% LTPD：10 项目 Items 测试条件 Test Conditions 测试时长/周期 Test Hours/Cycles 样本数量 Sample size Ac/Re 回流焊 Reflow Soldering 260℃±5℃/5 sec 3 cycles 22 pcs 0/1 80℃/90%RH 9.5Hrs ∫ 45 min 45 cycles 22 pcs 0/1 300 cycles 22 pcs 0/1 100℃ 1000 Hrs 22 pcs 0/1 低温存储 Low Temperature Storage -40℃ 1000 Hrs 22 pcs 0/1 直流点亮寿命 DC Operating Life IF = 20 mA 1000 Hrs 22 pcs 0/1 85℃/ 85%RH 1000 Hrs 22 pcs 0/1 温湿度高低温交变 Temperature/Humidity Alter 冷热冲击 Thermal Shork 高温存储 High Temperature -20℃ 1Hr 100℃ 15min ∫ 5 min -40℃ 15min Storage 高温高湿 High Temperature / High Humidity DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) Page 10／12 使用注意事项 Precautions For Use  过电流保护 顾客需要使用电阻进行保护，否则轻微的的电 压波动会导致较大的电流改变（有产品烧 坏的可能）。  储藏 1. 未使用产品之前请勿打开防潮包装袋。 2. 产品需在一年之内使用。未使用的产品需 保存在温度低于 25℃，湿度低于 80%的环 境中。 3. 当打开包装袋后，产品需保存在湿度低于 60%的环境中。 4. 当打开包装袋后，产品需在 168 小时(7 天)内用完。 5. 如果产品存放超过指定期限，需对产品进 行烘烤，烘烤条件为 60±5℃/24 hours。  焊接条件 1. 无铅回流焊温度曲线  Over–Current–Proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change.(Burn out will happen)  Storage 1. Do not open moisture proof bag before the products are ready to use. 2. The LEDs should be used within a year. Before opening the package, the LEDs should be kept at 25℃ or less and 80%RH or less. 3. After opening the package, the LEDs should be kept at 60%RH or less. 4. The LEDs should be used within 168 hours (7 days) a after opening the package. 5. If the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours  Soldering Condition 1. Pb-free solder temperature profile \ DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) 2. 不可通过二次回流焊 3. 回流焊进行时，芯片不可受力 4. 回流焊后，不可弯曲线路板  烙铁焊接 产品每一端的焊点必须使用功率小于 25w 的 烙铁尖端焊接，烙铁温度必须低于 350℃，时 间为 3 秒。间隔 2 秒或更长时间后，才能进行 另一端的焊接。请务必小心操作因为产品很容 易因为手工焊接造成损伤。  维修 当产品已经焊接好后，一般不可维修。只有当 维修不可避免时，则必须使用双头烙铁（如下 图），请事先确保产品是否会因为维修而损坏。 Page 11／12 2. Reflow soldering should not be done more than two times. 3. When soldering, do not put stress on the LEDs during heating. 4. After soldering, do not warp the circuit board.  Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.  Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. DATASHEET D-G080508G1-KS2 SMD(2.0*1.25mm) Page 12／12 应用局限 高可靠性应用（例如：军事，航空航天，汽车安全系统，医疗设备等）可能需要更高要求的 产品。如果您有任何疑虑，请在使用该产品之前联系我们。此规格书仅保证该产品作为单独 部件的质量和性能。请勿超出此文件对该产品规格性能描述使用。 Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems,and medical equipment may require different product. If you have any concerns, please contact us before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document.