BAV21W

山东晶导微电子有限公司 BAV19W / BAV20W / BAV21W Jingdao Microelectronics FEATURES ▪ For surface mounted applications ▪ Glass Passivated Chip Junction ▪ Fast reverse recovery time ▪ Ideal for automated placement ▪ Lead free in comply with EU RoHS 2011/65/EU directives PINNING PIN MECHANICAL DATA ▪ Case: SOD-123FL ▪ Approx. Weight:15mg 0.00053oz DESCRIPTION 1 Cathode 2 Anode 1 2 Simplified outline SOD-123FL and symbol Absolute Maximum Ratings at 25 °C Symbols BAV19W BAV20W BAV21W Units Maximum Repetitive Peak Reverse Voltage V RRM 120 200 250 V Maximum RMS voltage V RMS 100 150 200 V Continuous Forward Current IF 250 mA Repetitive Peak Forward Current I FRM 625 mA I FSM 1 3 9 A P tot 500 mW T j , T stg -55 ~ +150 °C Parameter Non-reptitive Peak Forward Surge Current Total Power Dissipation Operating and Storage Temperature Range at 1s at 1ms at 1 us Characteristics at T a = 25 °C Parameter Reverse Breakdown Voltage at I R=100 μA Symbols BAV19W BAV20W BAV21W Units V (BR)R 120 200 250 V VF 1.00 1.25 V IR 0.1 100 μA Typical Junction Capacitance at V R=4V, f=1MHz Cj 5 pF Maximum Reverse Recovery Time t rr 50 ns Maximum Forward Voltage at 100 m A at 200 m A Maximum DC Reverse Current T a = 25 °C at Rated DC Blocking Voltage T a =150 °C 2016.01 SOD123FL-K-BAV19W/BAV20W/BAV21W Page 1 of 3 山东晶导微电子有限公司 BAV19W / BAV20W / BAV21W Jingdao Microelectronics Fig.2 Typical Reverse Characteristics 600 500 400 300 200 100 0.0 25 75 50 100 125 150 175 Instaneous Reverse Current（μ A） Total Power Dissipation (mW) Fig.1 Forward Current Derating Curve 100 T J =150°C 10 1 0.1 T J =25°C 0.01 00 1.0 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 80 100 120 T J =25°C 10 1 0.1 1.0 10 100 Reverse Voltage (V) Instaneous Forward Voltage (V) 2016.01 60 100 T J =25°C 0.2 40 Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Instaneous Forward Current (A) Fig.3 Typical Instaneous Forward Characteristics 0.01 0.0 20 percent of Rated Peak Reverse Voltage (%) Ambient Temperature (°C) www.sdjingdao.com Page 2 of 3 山东晶导微电子有限公司 BAV19W / BAV20W / BAV21W Jingdao Microelectronics PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-123FL ∠ALL ROUND C A ∠ALL ROUND VM D E A g Top View mil Bottom View A C D E e g HE max 1.1 0.20 2.9 1.9 1.1 0.9 3.8 min 0.9 0.12 2.6 1.7 0.8 0.7 3.5 max 43 7.9 114 75 43 35 150 min 35 4.7 102 67 31 28 138 UNIT mm g pad e E A pad HE 7° The recommended mounting pad size Marking Type number 2.0 (79) 1.2 (47) Marking code BAV19 B19 BAV20 B20 BAV21 B21 1.2 (47) 1.2 (47) ∠ Unit： mm (mil) 2016.01 JD511132B5 Page 3 of 3