TAI-TECH
SMD Power Inductor
TMPA0605S-150MN-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/07/05
新發行
羅宜春
梁周虎
許靜
備
注
TAI-TECH
SMD Power Inductor
TMPA0605S-150MN-D
1. Features
1. Shielded construction.
Halogen
Pb
Halogen-free
Pb-free
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
A
Recommend PC Board Pattern
D
L
H
E
B
150
2R2
1730
1526
G
Series
A
B
C
D
E
7.3±0.3 6.6±0.3 4.8±0.2 1.6±0.3
TMPA0605
L(mm)
3.0±0.2
Unit:mm
4. Part Numbering
TMPA
0605
S
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
-
150
MN
D
E
-
G(mm)
H(mm)
8.0
3.5
3.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
D
F
BxC
Standard.
150=15.0uH
M=±20%
Marking: Black.1501730(17YY, 30 WW,follow production date).
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
TMPA0605S-150MN-D
15.0
Heat Rating
Current DC
( A ) Irms.
Saturation
Current DC
(A)I sat
Typ
Max
Typ
Max
5.0
4.0
4.0
3.2
DCR
(mΩ)Typ
DCR
(mΩ)Max
Q(1MHz)
min
73
85
30
Agelient4284
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
6. Material List
NO
Items
1
Core
Alloy Powder .
Materials
2
Wire
Polyester Wire or equivalent.
3
Clip
100% Pb free solder(Ni+Sn---Plating)
4
Ink
Halogen-free ketone
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
1. -10~+40℃,50~60%RH (Product with taping)
2. -40~+125℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Approximately △L30%.
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Heat Rated Current (Irms)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs.
Life Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs.
Load Humidity
Moisture Resistance
Thermal shock
Vibration
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5minNumber of cycles: 500
Measured at room fempraturc after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles)
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
TAI-TECH
Item
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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