HCB3216KF-300T80

HCB3216KF-300T80

  • 厂商:

    TAI-TECH(台庆)

  • 封装:

    1206

  • 描述:

    贴片磁珠 1206 30Ω@100MHz ±25% 8A 10mΩ

  • 详情介绍
  • 数据手册
  • 价格&库存
HCB3216KF-300T80 数据手册
TAI-TECH KBM01-180900278 P1. High Current Ferrite Chip Bead(Lead Free) HCB3216KF-300T80 ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 楊祥忠 羅培君 張嘉玲 楊祥忠 羅培君 張嘉玲 1.0 13/06/06 變更可靠度條件 2.0 14/01/24 3.0 14/08/01 變更 Reflow 圖示 楊祥忠 羅培君 張嘉玲 3.1 14/08/01 修正包裝帶尺寸 楊祥忠 羅培君 張嘉玲 4.0 16/01/26 楊祥忠 詹偉特 張嘉玲 5.0 17/02/16 修訂 Recommended PC Board Pattern 楊祥忠 詹偉特 張嘉玲 變更電鍍錫層厚度 3.0um min.=>3.5um min. 增訂可靠度 Thermal shock: (Bead) Step3:125±2℃ 30±5min 備 註 www.tai-tech.com.tw TAI-TECH KBM01-180900278 P2. High Current Ferrite Chip Bead(Lead Free) HCB3216KF-300T80 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. Halogen 3. Suitable for reflow soldering. 4. Shapes and dimensions follow E.I.A. spec. Halogen-free 5. Available in various sizes. 6. Excellent solder ability and heat resistance. 7. High reliability. 8.100% Lead(Pb) & Halogen-Free and RoHS compliant. 9. Low DC resistance structure of electrode to prevent wasteful electric power consumption. Pb Pb-free 2.Dimensions Chip Size A 3.20±0.20 B 1.60±0.20 C 1.10±0.20 D 0.50±0.30 Units: mm 3.Part Numbering HCB 3216 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 300 T 80 D E F LxW Lead Free Material 300=30Ω T=Taping and Reel, B=Bulk(Bags) 80=8000mA 4.Specification Tai-Tech Part Number Impedance (Ω) HCB3216KF-300T80 ● DC Resistance (Ω) max. Rated Current (mA) max. 60mV/100M 0.01 8000 30±25% Rated current: based on temperature rise test In compliance with EIA 595  Impedance-Frequency Characteristics HCB3216KF-300T80 80 IMPEDANCE(Ohm) ● Test Frequency (Hz) 60 40 Z 20 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 TAI-TECH KBM01-180900278 P3. 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB Test Condition GHB FCA -55~+125℃ (Including self-temperature rise) -55~+125℃ (on board) Transportation Storage Temperature --- For long storage conditions, please see the Application Notice Agilent4291 Agilent E4991 Impedance (Z) Agilent4287 Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Rated Current < 1A ΔT 20℃Max Rated Current ≧ 1A ΔT 40℃Max Life test Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Load Humidity Appearance: no damage. Thermal shock Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Temperature: 125±2℃ Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2℃. Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Condition for 1 cycle Step1: -55±2℃ 30±5 min. Step2: 25±2℃ ≦0.5min Step3: +125±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Appearance:No damage. Impedance:within±15% of initial value Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10~2K~10Hz for 20 minutes Equipment: Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Bending Appearance:No damage. Impedance:within±10% of initial value Inductance:within±10% of initial value Q:Shall not exceed the specification value. RDC:within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions: >=0805inch(2012mm):40x100x1.2mm =0805inch(2012mm):1.2mm 0805inch(2012mm):1kg
HCB3216KF-300T80
物料型号:HCB3216KF-300T80 器件简介:该器件是一种高电流铁氧体芯片珠(无铅),具有单片无机材料构造,闭合磁路避免串扰,适用于回流焊接,形状和尺寸遵循E.I.A.规格,提供多种尺寸,具有优异的焊接能力和耐热性,高可靠性,100%无铅和无卤素,符合RoHS标准,电极的低直流电阻结构可防止浪费电能。

引脚分配:未提供具体信息。

参数特性:具有30Ω的阻抗值(在60mV/100MHz下),直流电阻最大为0.01Ω,最大额定电流为8000mA。

功能详解:主要用于抑制高频噪声,提高信号完整性,适用于回流焊接,具有高可靠性和良好的热性能。

应用信息:适用于回流焊接,适用于各种电子设备中的噪声抑制。

封装信息:遵循E.I.A.规格,提供多种尺寸,具体尺寸信息见产品数据表。


请注意,以上信息是基于PDF文档内容的中文分析,部分信息如引脚分配在文档中未提供具体细节。
HCB3216KF-300T80 价格&库存

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HCB3216KF-300T80
    •  国内价格
    • 10+0.28890
    • 100+0.23490
    • 300+0.20790
    • 3000+0.15650
    • 6000+0.14030
    • 9000+0.13220

    库存:11475

    HCB3216KF-300T80
    •  国内价格
    • 100+0.09603
    • 500+0.09047
    • 1000+0.08215
    • 5000+0.07105
    • 10000+0.06439

    库存:0