ESD5Z3V3
Transient Voltage Suppressors for ESD Protection
Applications
PINNING
DESCRIPTION
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Cellular phones
1
Cathode
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Portable devices
2
Anode
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Digital cameras
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Power supplies
PIN
Features
2
1
Top View
Simplified outline SOD-523 and symbol
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Small Body Outline Dimensions
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Low Body Height
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Stand−off Voltage: 3.3V
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Peak Power up to 200 Watts @ 8 x 20 _s Pulse
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Low Leakage
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Response Time is Typically < 1 ns
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ESD Rating of Class 3 (> 16 kV) per Human
Body Model
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IEC61000−4−2 Level 4 ESD Protection
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IEC61000−4−4 Level 4 EFT Protection
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We declare that the material of product
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S- Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change
Requirements; AEC-Q101 Qualified and PPAP Capable.
compliance with RoHS req uirements.
Absolute Ratings (Tamb=25°C )
Symbol
Parameter
Value
Units
PPP
Peak Pulse Power (tp = 8/20μs)
200
W
TL
Maximum lead temperature for soldering during 10s
260
°C
Tstg
Storage Temperature Range
-55 to +150
°C
Top
Operating Temperature Range
-40 to +125
°C
Tj
Maximum junction temperature
150
°C
±15
±8
KV
IEC61000-4-2 (ESD)
air discharge
contact discharge
IEC61000-4-4 (EFT)
40
ESD Voltage
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Per Human Body Model
1
16
A
KV
ESD5Z3V3
Transient Voltage Suppressors for ESD Protection
Electrical Parameter
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
Working Peak Reverse Voltage
IR
Maximum Reverse Leakage Current @ VRWM
IT
Test Current
VBR
Breakdown Voltage @ IT
IF
Forward Current
VF
Forward Voltage @ IF
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.VF = 0.9V at IF = 10mA
Device
ESD5Z3V3
Device
Marking
ZE
IR(uA)
VBR (V)@ IT
VC (V)
VC (V)
VRWM
(V)
@ VRWM
(Note 1)
Max
Max
Min
mA
Typ
Max
3.3
1.0
5.0
1.0
8.4
14.1
IT
@ IPP=5 A* @ Max IPP* (A)*
*Surge current waveform per Figure 1.
1. VBR is measured with a pluse test current IT at an ambient temperature of 25℃.
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1
2
IPP
PPK
C
(W)*
(pF)
Max
Max
Typ
11.2
158
105
ESD5Z3V3
Transient Voltage Suppressors for ESD Protection
SOD-523
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
1
2X b
0.08
M
2
MILLIMETERS
X Y
TOP VIEW
A
c
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
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NOM
A
0.50
0.60
0.70
b
0.25
0.30
0.35
0.20
1.80
2X
0.40
DIMENSION: MILLIMETERS
1
3
MAX
c
0.07
0.14
D
1.10
1.20
1.30
E
0.70
0.80
0.90
HE
1.50
1.60
1.70
L2
SIDE VIEW
0.48
MIN
L
HE
2X
DIM
0.30 REF
0.15
0.20
0.25
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