ESD5Z5V0C
Transient Voltage Suppressors for ESD Protection
Applications
2
1
•
Cellular phones
•
Portable devices
•
Digital cameras
•
Power supplies
Top View
Features
Simplified outline SOD-523 and symbol
•
Small Body Outline Dimensions
•
Low Body Height
•
Peak Power up to 200 Watts @ 8 x 20 _s
Pulse
•
Low Leakage current
•
Response Time is Typically < 1 ns
•
ESD Rating of Class 3 (> 16 kV) per Human
Body Model
•
IEC61000−4−2 Level 4 ESD Protection
•
IEC61000−4−4 Level 4 EFT Protection
Absolute Ratings (Tamb=25°C )
Symbol
Parameter
Value
Units
PPP
Peak Pulse Power (tp = 8/20μs)
200
W
TL
Maximum lead temperature for soldering during 10s
260
°C
Tstg
Storage Temperature Range
-55 to +155
°C
Top
Operating Temperature Range
-40 to +125
°C
Tj
Maximum junction temperature
150
°C
±15
±8
KV
IEC61000-4-2 (ESD)
air discharge
contact discharge
IEC61000-4-4 (EFT)
ESD Voltage
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Per Human Body Model
1
40
A
16
KV
ESD5Z5V0C
Transient Voltage Suppressors for ESD.Protection
Electrical Parameter
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @
VRWM
IT
Test Current
VBR
Breakdown Voltage @ IT
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.VF = 0.9V at IF = 10mA
Device
Device
Marking
ESD5Z5V0C
5C
IR(uA)
VBR (V)@ IT
VC (V)
VC (V)
VRWM
(V)
@ VRWM
(Note 1)
Max
Max
Min Max
mA
Typ
Max
5.0
1.0
5.6
1.0
11.6
18.6
7.8
IT
IPP
@ IPP=5 A* @ Max IPP* (A)*
PPK
(W)*
(pF)
Max
Max
Typ
9.4
174
25
8
10
1. VBR is measured with a pluse test current IT at an ambient temperature of 25℃.
0.07
100
90
0.06
80
70
0.04
Cj (pF)
IR (uA)
0.05
0.03
20
10
0
25
50
75
100
0
125
Fig 1. Reverese
2
4
6
SAMPLE
T(℃)
www.tw-gmc.com
50
30
0.01
0
60
40
0.02
Fig 2. Capacitance character
character
1
2
C
ESD5Z5V0C
Transient Voltage Suppressors for ESD Protection
Package Outline Dimensions
SOD-523
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−X−
A
−Y−
B
1
2
DIM
A
B
C
D
J
K
S
D 2 PL
0.08 (0.003)
M
T X Y
MILLIMETERS
MIN
NOM
MAX
1.10
1.20
1.30
0.70
0.80
0.90
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
0.15
0.20
0.25
1.50
1.60
1.70
C
J
K
S
−T−
SEATING
PLANE
SOLDERING FOOTPRINT*
1.40
0.0547
0.40
0.0157
0.40
0.0157
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SCALE 10:1
1
3
mm
(inches
)
MIN
0.043
0.028
0.020
0.010
0.0028
0.006
0.059
INCHES
NOM
MAX
0.047
0.051
0.032
0.035
0.024
0.028
0.012
0.014
0.0055 0.0079
0.008
0.010
0.063
0.067
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