产品承认书
SPECIFICATION FOR APPROVAL
CUSTOMER:
CUSTOMER P/N:
CND-TEK P/N. :
B1605S
10/100 BASE-T MAGNETICS MODULES
DESCRIPTION:
REF NO:
QTC-001
REV/NO:
V1.02
2015/03/02
DATE:
ATTACHMENT:
■ SPECIFICATION
■ SAMPLE
Q’TY OF SAMPLES
PCS
√
FULL APPROVED
CONDITIONAL APPROVED
REJECTED
CUSTOMER'S SIGNATURE
REMARK
B1605S
10/100 BASE-T MAGNETICS MODULES
V1.0.2
Feb 2, 2015
␡ൣ⻱㚄䗮⭥ᆀᴹ䲀ޜਨ
6KHQ]KHQ&1'7(.Electronics&R/WG
ޜਨൠ൰␡ൣᐲইኡ४㾯ѭ䭷街道百旺社区牛城村牛城路221号505
7(/ )$;86-
(PDLOsales2#FGWHNFRP
+WWSZZZFGWHNFRP
1. FEATURES:
1.1 Compatible with various 10/100 Base-TX transceiver requiring 1:1 transmit and 1:1 receive turns ratio.
1.2 Compliant with IEEE 802.3 standard including baseline wander compensation specification of 350μH
OCL when Biased at 8mA
1.3 Low profile Surface Mount Packaging designed for Hi-Temp Reflow Process
1.4 Single channel interface for 10/100Mbps Ethernet applications with CMC’s tuned to Enhance EMC
system performance
1.5 Operating Temperature range: 0℃ TO +70℃
1.6 Storage temperature range: -25℃ TO +125℃
2. DIMENSIONS & MARKING
CND-TEK
XXXX
B1605S
Recommended Land Pattern
Note :1、Dimension :mm
2、Unless otherwise specified,all tolerances are :±0.05mm
3. SCHEMATICS:
4.ELECTRICAL SPECIFICATIONS @25℃
4.1 OCL :
350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias
4.2 Leakage Inductance:
0.5 μH Max. @ 100KHz, 0.2V
4.3 Cw/w:
28 pF Max. @ 100KHz, 0.2V
4.4 DCR:
1.20Ω Max.
4.5 Turns Ratio(±5%):
1CT:1CT(TX), 1CT:1CT(RX)
4.6 Polarity:
1-16, 6-11 In-Phase
4.7 Insertion Loss:
-1.1 dB Max. @ 1-100MHz
4.8 Return Loss:
-16 dB Min. @ 1-30MHz
-12 dB Min. @ 30-60 MHz
-10 dB Min.@ 60-80 MHz
4.9 Cross Talk:
-42 dB Min.@ 1-60 MHz
-35 dB Min.@ 60-100 MHz
4.10 Common Mode Rejection : -40 dB Min.@ 1-30 MHz
-35 dB Min.@ 60 MHz
-30 dB Min.@ 80-100 MHz
4.11 Isolation HI-POT:
1500Vrms 1mA 1Second
5. Recommended Lead Free IR Reflow Soldering Curve:
Item
Soldertechnique
simulation
Temperature
(℃)
Time(s)
1
Solder iron
350±10
(solder irno temp)
4~5
2
Vapor phase reflow
215±5
(vapor temp)
60±5
3
IR/convection reflow
255±5
(component temp)
30±5
Temperature ramp/immersion
and emersion rate
1℃/s~4℃/s time above 183℃
90s~120s
Note:The curve includes recommended value only, please adjust your equipment to make sure the solder
process.Details please refers to the standard J-STD-020.
6. Reliability Test Criteria:
6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement.
6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and
bright.
6.3 Resistance to soldering heat : Convection reflow condition setting: peak temperature at 260℃+0/-5℃
above 217℃ for 90-180 seconds, ramp-up rate 2-3℃/s. Ramp-down rate 6℃/s Max. No mechanical problem
found. No electrical failure found per our specification.
6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall
not be any abnormality.
6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any
abnormality.
6.6 Dry heat: 100+/-2℃ 96 hours.
6.7 Cold: -20+/-2℃ 96 hours.
6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours.
6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃.
Packing Specification
1、Each Reel Qty:600pcs/pkg
2、Total unit transformer in carton:
600 × 10 (Total Reel in Carton) = 6000 PCS
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