G8801D

产品承认书 SPECIFICATION FOR APPROVAL CUSTOMER： CUSTOMER P/N： CND-TEK P/N. : G8801D DESCRIPTION： 1000 BASE-T MAGNETICS MODULES REF NO: QTC-001 REV/NO: V1.02 DATE: 2015/03/02 ATTACHMENT： ■ SPECIFICATION ■ SAMPLE Q’TY OF SAMPLES PCS √ FULL APPROVED CONDITIONAL APPROVED REJECTED CUSTOMER'S SIGNATURE REMARK G8801D 1000 BASE-T MAGNETICS MODULES V1.0.2 Feb 2, 2015 ␡ൣ⻱㚄䗮⭥ᆀᴹ䲀‫ޜ‬ਨ 6KHQ]KHQ&1'7(.Electronics&R/WG ‫ޜ‬ਨൠ൰␡ൣᐲইኡ४㾯ѭ䭷街道百旺社区牛城村牛城路221号505 7(/ )$;86- (PDLOsales2#FGWHNFRP +WWSZZZFGWHNFRP 1. FEATURES: 1.1 Designed for long haul Gigabit Ethernet 1000 Base-T, full duplex applications. 1.2 Supports four pairs of category 5 UTP cable. 1.3 Cable interface for isolation and low common mode emissions 1.4 Compliant with IEEE 802.3ab standard for 1000 Base-T 1.5 Designed to support 1:1 Turns Ratio Transceivers. 1.6 Operating Temperature range: 0℃ TO +70℃ 1.7 Storage temperature range: -25℃ TO +125℃ 2. DIMENSIONS & MARKING CND-TEK xxxx G8801D Note：1、Dimension：mm 2、Unless otherwise specified,all tolerances are：±0.05mm 3. SCHEMATICS: 4.ELECTRICAL SPECIFICATIONS @25℃ 4.1 OCL : 350 μH Min. @ 100 KHz, 100mV with 8mA DC Bias 4.2 Leakage Inductance: 0.5 μH Max. @ 100KHz, 0.2V 4.3 Cw/w: 35 pF Max. @ 100KHz, 0.2V 4.4 DCR: 1.40Ω Max. 4.5 Turns Ratio(±5%): 1CT:1CT(TX), 1CT:1CT(RX) 4.6 Polarity 1-72, 3-70, 5-68, 7-66 In-Phase 4.7 Insertion Loss -1.2 dB Max. (TX & RX)@ 1~100 MHz 4.8 Return Loss: -16 dB Min @ 0.5-40MHz 4.9 Cross Talk: -50 dB Min.@ 1~10 MHz -55+22*log(f/10) dB Min.@ 10~100 MHz 4.10 Common Mode Rejection : -50 dB Min.@ 2 MHz 4.11 Isolation HI-POT: -15+20*log(f/200) dB Min.@ 30~200 MHz 1500Vrms 1mA 1Second 5. Recommended Lead Free IR Reflow Soldering Curve： Item Soldertechnique simulation Temperature (℃) Time(s) 1 Solder iron 350±10 (solder irno temp) 4~5 2 Vapor phase reflow 215±5 (vapor temp) 60±5 3 IR/convection reflow 255±5 (component temp) 30±5 Temperature ramp/immersion and emersion rate 1℃/s~4℃/s time above 183℃ 90s~120s Note：The curve includes recommended value only, please adjust your equipment to make sure the solder process.Details please refers to the standard J-STD-020. 6. Reliability Test Criteria： 6.1 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement. 6.2 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright. 6.3 Resistance to soldering heat : Convection reflow condition setting: peak temperature at 260℃+0/-5℃ above 217℃ for 90-180 seconds, ramp-up rate 2-3℃/s. Ramp-down rate 6℃/s Max. No mechanical problem found. No electrical failure found per our specification. 6.4 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality. 6.5 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be any abnormality. 6.6 Dry heat: 100+/-2℃ 96 hours. 6.7 Cold: -20+/-2℃ 96 hours. 6.8 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours. 6.9 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3minutes at 20+/2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃.