ESDR0524P

ESDR0524P TVS Array Features ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance ● UDFN-10 (2.5×1.0×0.5mm) surface mount package ● Protects four I/O lines ● Working voltage: 5V ● Low leakage current ● Low operating and clamping voltages ● Solid-state silicon avalanche technology ● Lead Free/RoHS compliant ● Solder reflow temperature: Pure Tin-Sn, 260~270℃ ● Flammability rating UL 94V-0 ● Meets MSL level 1, per J-STD-020 UDFN10 Applications ● High Definition Multimedia Interface (HDMI 1.4) ● Digital Visual Interface (DVI) ● Unified Display Interface (UDI) ● Display Port Interface ● MDDI Ports ● PCI Express ● Serial ATA 1 2 3 4 5 10 9 8 7 6 Pin Configuration 1 10 TMDS D2+ TMDS D2- TMDS D2+ TMDS D2- GND GND TMDS D1+ TMDS D1+ TMDS D1- TMDS D1- TMDS D0- 1 10 TMDS D0+ TMDS D0+ TMDS D0- GND GND TMDS CK+ TMDS CK+ TMDS CK- TMDS CK- 1/5 ESDR0524P Rating Symbol Value ESD voltage (Contact discharge) Unit ±8 VESD kV ESD voltage (Air discharge) ±15 Lead soldering temperature Storage & operating temperature range TL 260 ℃ TSTG ,TJ -55~+150 ℃ Electrical Characteristics (TJ=25 OC ) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 5 V VBR IBR=1mA Reverse leakage current IR VR=5V Each I/O pin Clamping voltage (tp=8/20μs) VC IPP=1A 9.8 V 0Vdc,f=1MHz I/O pin to GND 0.6 pF 0Vdc,f=1MHz Between I/O pins 0.3 pF Off state junction capacitance CJ 2/5 6 V 1 μA ESDR0524P IEC61000-4-2 Interfaces of consumer electronic equipment are widely specified according to the International Electrotechnical Commission standard IEC61000-4-2. This standard is not targeted towards particular devices but towards general equipment, systems and subsystems that may be involved in electrostatic discharge. consists of a 150pF capacitor and a 330Ω series resistor representing the counterpart to the Device Under Test (DUT). 3/5 ESDR0524P Reflow Soldering Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 20-40 seconds 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max. 4/5 ESDR0524P Dimensions (UDFN-10) Dimension Symbol Millimeters Min. Nom. Max. Inches Min. Nom. Max. A 0.45 0.55 0.65 0.018 0.022 0.026 A1 - 0.03 0.05 - 0.001 0.002 A2 0.13REF 0.005REF b1 0.15 0.20 0.25 0.006 0.008 0.010 b2 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 e L 0.50BSC 0.30 0.38 0.020BSC 0.43 0.012 0.015 0.017 Packaging Tape Reel Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.80±0.05 E 1.75±0.10 F 3.50±0.10 A 1.22±0.10 B 2.70±0.10 K 0.70±0.05 t 0.25±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS 5/5