SY6282ACC

SY6282 6.5V, 3A Low Loss Power Distribution Switch Preliminary Specification Features General Description • • • • • • • Input voltage: 2.4V to 6.5V 3A load current capability Programmable current limit Over temperature protection Reverse blocking (no body diode) OUT can be forced higher than IN at shutdown Compact TSOT23-5 package minimizes the board space • RoHS Compliant and Halogen Free SY6282 is ultra-low RDS(ON) switch with programmable current limit to protect the power source from over current and short circuit conditions. They incorporate over temperature protection and reverse blocking function. Ordering Information SY6282 □(□□ □□)□ □□ □ Tempera ture Code Packa ge Code Optiona l Spec Code Ordering Number SY6282ACC Package type TSOT23-5 Applications • • • • • Note USB 3G Datacard USB Dongle MiniPCI Accessories USB Charger Public Place Multi-USB Charger Typical Applications VIN 6 IN OUT VOUT 1 SY6282 CIN 10µF 4 COUT 10µF 3 EN ISET GND RSET 6.8kΩ 2 Figure 1. Schematic Diagram SY6282 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 殷先生：１３３８０３６８９３９　　　　　ＱＱ：７１９３０７６１０ 1 SY6282 Pinout (top view) (TSOT23-5) Top mark: Lnxyz for SY6282ACC (Device code: Ln x=year code, y=week code, z= lot number code) 4 5 r EN IN Pin Description Output pin, decoupled with a 10µF capacitor to GND. Ground pin. Current limit programming pin. Connect a resistor RSET from this pin to ground to program the current limit: ILIM (A)=6800/RSET (Ω) ON/OFF control. Pull high to enable IC. Do not leave it floating. Input pin, decoupled with a 10µF capacitor to GND. fo Pin number 1 2 3 re pa re d Pin Name OUT GND ISET l-P Absolute Maximum Ratings (Note 1) .C on fid en tia All pins------------------------------------------------------------------------------------------------------------------- -0.3V to 7V Power Dissipation, PD @ TA = 25°C TSOT23-5, ------------------------------------------------------------------------- 1.46W Package Thermal Resistance (Note 2) θ JA --------------------------------------------------------------------------------------------------------------- 68.5°C/W θ JC --------------------------------------------------------------------------------------------------------------- 10.9°C/W Junction Temperature--------------------------------------------------------------------------------------------------------- 150°C Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------------ 260°C Storage Temperature Range ------------------------------------------------------------------------------------- -65°C to 150°C Recommended Operating Conditions (Note 3) Si le rg y Co rp IN------------------------------------------------------------------------------------------------------------------------ 2.4V to 6.5V All other pins ------------------------------------------------------------------------------------------------------------- 0V to 6.5V Junction Temperature Range ------------------------------------------------------------------------------------- -40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to 85°C SY6282 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 殷先生：１３３８０３６８９３９　　　　　ＱＱ：７１９３０７６１０ 2 SY6282 Electrical Characteristics (VIN = 5V, COUT=10µF, TA = 25°C unless otherwise specified) Test Conditions Min 2.4 Open load, IC Disabled. Open load, IC Enabled. Typ 0.2 38 50 Max 6.5 1 2 0.8 1 2.3 VEN=5.0V 0.75 0.4 fo RL=10Ω, COUT=1µF RL=10Ω, COUT=1µF r RSET=6.8kΩ d Symbol VIN ISHDN IQ RDS(ON) VEN(H) VEN(L) IEN VIN_UVLO VIN_HYS ILIM IRANGE TON TOFF TSD TSD_HYS 0.1 1 130 20 150 20 1.25 3.5 Unit V µA µA mΩ V V µA V V A A µs µs ℃ ℃ re Parameter Input Voltage Range Shutdown Input Current Quiescent Supply Current FET RON EN Rising Threshold EN Falling Threshold EN Leakage Current IN UVLO Threshold IN UVLO Hysteresis Over Current Limit Programmable current limit range Turn-on Time Turn-off Time Thermal Shutdown Temperature Thermal Shutdown Hysteresis l-P re pa Note 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. en tia Note 2: θ JA is measured in the natural convection at TA = 25°C on a Silergy test board. Pin 2 of TSOT23-5 package is the case position for θ JC measurement. fid Note 3: The device is not guaranteed to function outside its operating conditions. Si le rg y Co rp .C on Block Diagram SY6282 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 3 SY6282 TSOT23-5 Package outline & PCB layout design 0.55 1.50 - 1.70 d fo 0.80 r 2.70 - 3.00 2.40 2.80 - 3.10 0.30 - 0.50 re 0.95 TYP 0.01 - 0.1 1.00 (max) fid en 0.25 REF tia l-P 0.1 - 0.20 re pa Recommended Pad Layout 0.95 TYP 1.90 TYP Co rp .C on 0.3 - 0.6 Si le rg y Notes: All dimensions are in millimeters. All dimensions don’t include mold flash & metal burr. SY6282 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 4 SY6282 Taping & Reel Specification 1. Taping orientation TSOT23-5 3.9/4.1 fo r 7.7/8.3 1.45/1.55 re d Feeding direction re pa 2. Carrier Tape & Reel specification for packages fid en tia l-P Reel Width rg y Co rp .C on Reel Size Tape width (mm) Pocket pitch(mm) Reel size (Inch) Reel width(mm) Trailer length(mm) Leader length (mm) Qty per reel 8 4 7" 8.4 280 160 3000 Si le Package types TSOT23-5 3. Others: NA SY6282 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 5