SY6281AAC

SY6281 Low Loss Power Distribution Switch TARGET DESIGN SPECIFICATION Preliminary Spec General Description Features The SY6281 develops ultra-low Rds(on) switch with programmable current limiting to protect the power source from over current and short circuit conditions. It integrates the over temperature protection and discharges the output capacitor during the shutdown. In case the output is pulled higher than the input voltage under the shutdown, the SY6281 can block the current flowing from the output to the input. • • • • • • • • Distribution voltages: 2.4V to 5.5V Programmable current limit Enable polarity: active low Over temperature shutdown and automatic retry Reverse blocking (no body diode) At shutdown, OUT can be forced higher than IN Automatic output discharge at shutdown Compact SOT23 packages minimize the board space. Ordering Information SY6281 □(□□)□ Temperature Code Package Code Optional Spec Code Temperature Range: -40°C to 85°C Ordering Number Package type SY6281AAC SOT23-5 Applications Note ---- • USB 3G Datacard • USB Dongle • MiniPCI Accessories Typical Applications Figure 1. Schematic Diagram SY6281 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 1 SY6281 Pinout (top view) (SOT23-5) Top mark: FHxyz (Device code: FH, x=year code, y=week code, z= lot number code) Pin Name IN GND OUT ENB ISET Pin number 5 2 1 4 3 Pin Description Input pin Ground pin Output pin ON/OFF control. Pull low to enable IC. Do not float. Current limit programming pin. Connect a resistor Rset from this pin to GND to program the current limit: Ilim (A)=6800/Rset (ohm) Absolute Maximum Ratings (Note 1) All pins-------------------------- ---------------------------------------------------------------------------------- 6V Power Dissipation, PD @ TA = 25°C SOT23-5, -------------------------------------------------------------- 0.6W Package Thermal Resistance (Note 2) θ JA ------------------------------------------------------------------------------------------------------- 200°C/W θ JC ------------------------------------------------------------------------------------------------------- 130°C/W Junction Temperature Range ------------------------------------------------------------------------------------ 150°C Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------ 260°C Storage Temperature Range ------------------------------------------------------------------------------------- -65°C to 150°C Recommended Operating Conditions (Note 3) IN--------------------------------------------------------------------------------------------------------------------- 2.4V to 5.5V All other pins ------------------------------------------------------------------------------------------------------- 0-5.5V Junction Temperature Range ------------------------------------------------------------------------------------ -40°C to 125°C Ambient Temperature Range ------------------------------------------------------------------------------------ -40°C to 85°C SY6281 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 2 SY6281 Electrical Characteristics (VIN = 5V, CL=1uF, per channel, TA = 25°C unless otherwise specified) Parameter Input Voltage Range Shutdown Input Current Quiescent Supply Current FET RON ENB Rising Threshold ENB Falling Threshold ENB Leakage IN UVLO Threshold IN UVLO Hysteresis Over Current Limit Turn-ON Time Turn-OFF Time OUT Shutdown Discharge Resistance Thermal Shutdown Temperature Thermal Shutdown Hysteresis Symbol VIN ISHDN IQ RDS(ON)1 VENB(H) VENB(L) IENB VIN,UVLO VIN,HYS ILIM ILIM(min) ILIM(max) TON TOFF RDIS TSD Test Conditions Min 2.4 Open load, IC Disabled. Open load, IC Enabled. Typ 0.1 25 80 Max 5.5 1 2 0.8 1 2.3 VENB=5.5V RSET=6.8kΩ RL=10Ω RL=10Ω, CL=1uF 0.75 0.1 1 0.4 2 120 10 150 130 20 1.25 Unit V µA µA mΩ V V µA V V A A A us us Ω ℃ ℃ Note 1: Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2: θ JA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Pin 2 of SOT23-5 packages is the case position for θ JC measurement. Note 3: The device is not guaranteed to function outside its operating conditions SY6281 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 3 SY6281 SOT23-5 Package outline & PCB layout design 0.55 1.50 - 1.70 0.80 2.70 - 3.00 2.40 2.80 - 3.10 0.95 TYP 0.30 - 0.50 0.01 - 0.1 0.1 - 0.15 0.25 REF Recommended Pad Layout 1.0 - 1.3 0.95 TYP 0.3 - 0.6 1.90 TYP Notes: All dimensions are in millimeters. All dimensions don’t include mold flash & metal burr. SY6281 Rev. 0.1 Silergy Corp. Confidential- Prepared for Customer Use Only 4