Application Note: AN_SY8703
High Efficiency, 1MHz, 1A, 30V
Step Down White LED Driver
Preliminary Specification
General Description
Features
SY8703 is a high efficiency step down regulator
capable of driving 1.0A white LED from up to 30V
input. It integrates the low RON MOSFET and internal
compensation. The 1MHz switching frequency allows
the use of very small inductor. This, along with the
small SOT23-6 package, achieves an extremely small
LED driver design.
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Ordering Information
Applications
SY8703□(□□)□
• Flash light
Temperature Code
Package Code
Optional Spec Code
Ordering Number
SY8703ABC
Package type
SOT23-6
Wide input range: 2.5-30 V
1 MHz switching frequency
Very low RON: 200mΩ
Enable and dimming control available
20kHz~1MHz wide dimming frequency range
Compact 6 pin SOT23 package
RoHS Compliant and Halogen Free
• Display cabinet lamp
• LED sign
Note
1A
Typical Applications
Figure 1. Schematic diagram
AN_SY8703 Rev. 0.9C
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AN_SY8703
Pinout (top view)
SOT23-6
Top Mark:EFxyz (device code: EF, x=year code, y=week code, z= lot number code)
Pin Name
Pin Number
IN
5
SEN
GND
LX
6
2
1
EN
4
TM
3
Pin Description
Input pin. Decouple this pin to GND pin with 1uF ceramic cap. Also used as
the positive current sense pin.
Negative Current Sense Pin.
Ground pin
Inductor node.
Enable and dimming control. Pull high to turn on IC. When used as dimming
input, the first pulse should be longer than 100ns to turn on IC, and then
shorter than 40nS to turn off IC. The recommend dimming frequency range is
20kHz~1MHz.
Test mode pin. Ground this pin in the real application.
Absolute Maximum Ratings
(Note 1)
LX, IN, EN------------------------------------------------------------------------------------------------------------------------ 33V
SEN ----------------------------------------------------------------------------------------------------------------------- VIN ± 0.7V
All other pins-------------------------- -------------------------------------------------------------------------------------------- 4V
Power Dissipation, PD @ TA = 25°C SOT-23-6, ------------------------------------------------------------------------- 0.6W
Package Thermal Resistance (Note 2)
θ JA --------------------------------------------------------------------------------------------------------------- 200°C/W
θ JC --------------------------------------------------------------------------------------------------------------- 130°C/W
Junction Temperature Range ------------------------------------------------------------------------------------------------ 150°C
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------------ 260°C
Storage Temperature Range -------------------------------------------------------------------------------------- -65°C to 150°C
Recommended Operating Conditions (Note 3)
IN, LX, EN ------------------------------------------------------------------------------------------------------------- 2.5V to 30V
SEN ----------------------------------------------------------------------------------------------------------------------- VIN ± 0.5V
All other pins ------------------------------------------------------------------------------------------------------------------ 0-3.6V
Junction Temperature Range ------------------------------------------------------------------------------------- -40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to 85°C
AN_SY8703 Rev. 0.9C
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AN_SY8703
Electrical Characteristics
(VIN = 5V, IOUT=100mA, TA = 25°C unless otherwise specified)
Parameter
Input Voltage Range
Shutdown Current
Low Side Main FET RON
Main FET Current Limit
Switching Frequency
Current Sense Limit
EN Rising Threshold
EN Falling Threshold
Symbol
VIN
ISHDN
RDS(ON)1
ILIM1
FSW
VIN-SEN
VENH
VENL
Test Conditions
Min
2.5
IN UVLO Rising Threshold
VIN,UVLO
UVLO Hysteresis
Thermal Shutdown
Temperature
Max Duty Cycle
Min Duty Cycle
VUVLO,HYS
0.1
V
TSD
150
C
EN=0
Typ
5
200
1.3
0.8
96
1.5
1
100
Max
30
10
1.2
104
Unit
V
µA
mΩ
A
MHz
mV
0.4
2.5
10
100
12
V
%
%
Note 1: Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may remain possibility to affect device reliability.
Note 2: θ JA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity
test board of JEDEC 51-3 thermal measurement standard.
Note 3. The device is not guaranteed to function outside its operating conditions
Block Diagram
AN_SY8703 Rev. 0.9C
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AN_SY8703
Typical Operation Characteristics
1
0.9
0.8
0.7
ILED/A
0.6
0.5
0.4
0.3
0.2
20kHz Dimming
200kHz Dimming
0.1
1MHz Dimming
0
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
PWM Duty Cycle
Startup
(VIN=25V, IOUT=1A, 5pcs LED Series)
VIN
5V/div
VLX
10V/div
ILED
0.5A/div
Fre.(kHz)
Time (2ms/div)
AN_SY8703 Rev. 0.9C
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AN_SY8703
Operation
SY8703 is a floating buck regulator IC that integrates the PWM control, power MOSFET on the same die to
minimize the switching transition loss and conduction loss. With ultra low RDS(ON) power switches and proprietary
PWM control, this regulator IC can achieve the high efficiency and the high switch frequency simultaneously to
minimize the external inductor and capacitor size, and thus achieving the minimum solution footprint.
Applications Information
Because of the high integration in the SY8703 IC , the application circuit based on this regulator IC is rather simple.
Only input capacitor CIN, output capacitor COUT, output inductor L and current sense resistor RSEN need to be
selected for the targeted applications specifications.
Current sense resistor RSEN:
Choose RSEN to program the proper output Current:
ILED(A) =
0.1(V )
R SEN (Ω)
Input capacitor CIN:
The ripple current through input capacitor is calculated as:
ICIN_RMS = IOUT ⋅ D(1 - D)
A typical X7R or better grade ceramic capacitor with suitable capacitance should be choosen to handle this ripple
current well. To minimize the potential noise problem, place this ceramic capacitor really close to the IN and GND
pins. Care should be taken to minimize the loop area formed by CIN, and IN/GND pins.
Output capacitor COUT:
The output capacitor is selected to handle the output current ripple noise requirements. For the best performance, it
is recommended to use X7R or better grade ceramic capacitor greater than 1uF capacitance.
Output inductor L:
There are several considerations in choosing this inductor.
1) Choose the inductance to provide the desired ripple current. It is suggested to choose the ripple current to be
about 40% of the maximum output current. The inductance is calculated as:
L=
VOUT (1 − VOUT /VIN,MAX )
FSW × I OUT,MAX × 40%
where Fsw is the switching frequency and IOUT,MAX is the LED current.
The SY8703 regulator IC is quite tolerant of different ripple current amplitude. Consequently, the final choice of
inductance can be slightly off the calculation value without significantly impacting the performance.
2) The saturation current rating of the inductor must be selected to be greater than the peak inductor current under
full load conditions.
ISAT, MIN > IOUT, MAX +
AN_SY8703 Rev. 0.9C
VOUT(1-VOUT/VIN,MAX)
2 ⋅ FSW ⋅ L
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AN_SY8703
Dimming Control
Fig.2 shows the internal block diagram of the dimming circuit of SY8703. The PWM signal changes the regulation
voltage by change the duty cycle. The relationship between the duty cycle and internal reference voltage is
calculated as:
VIN-SEN =Duty*100mV
Figure 2 Internal block diagram of the dimming circuit
Since the cut-off frequency of the internal low pass filter is near 5kHz, it is recommended selecting the PWM signal
frequency to be higher than 20kHz.
Layout Design:
The layout design of SY8703 regulator is relatively simple. For the best efficiency and minimum noise problems, we
should place the following components close to the IC: CIN, L, COUT and RSEN.
1) It is desirable to maximize the PCB copper area connecting to GND pin to achieve the best thermal and noise
performance. If the board space allowed, a ground plane is highly desirable.
2) CIN must be close to Pins IN and GND. The loop area formed by CIN and GND must be minimized.
3) The PCB copper area associated with LX pin must be minimized to avoid the potential noise problem.
AN_SY8703 Rev. 0.9C
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AN_SY8703
SOT23-6 Package Outline & PCB layout
1.90
1.50 - 1.70
1.00
2.70 - 3.00
2.40
2.80 - 3.10
0.95
0.60
0.30 - 0.50
0.1 - 0.15
0.01 - 0.1
Top View
0.25 REF
Recommended Pad Layout
1.0 - 1.3
0.95 TYP
0.3 - 0.6
1.90 TYP
Notes: All dimensions are in millimeters.
All dimensions don’t include mold flash & metal burr.
AN_SY8703 Rev. 0.9C
Silergy Corp. Confidential- Prepared for Internal Use Only
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