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N- and P- Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
P-Channel
20
- 20
RDS(on) (Ω)
ID (A)
0.090 at VGS = 4.5 V
3.28
0.110 at VGS = 2.5 V
2.13
0.130 at VGS = 1.8 V
1.50
0.155 at VGS = - 4.5 V
- 2.80
0.190 at VGS = - 2.5 V
- 1.81
0.220 at VGS = - 1.8 V
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFETs: 1.8 V Rated
• Thermally Enhanced SC-70 Package
• Fast Switching
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
- 1.15
• Load Switch for Portable Devices
D1
SOT-363
SC-70 (6-LEADS)
S1
1
6
S2
D1
G2
G1
2
5
G2
D2
3
4
S2
G1
Top View
S1
D2
N-Channel
P-Channel
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
N-Channel
Parameter
Symbol
5s
P-Channel
Steady State
5s
Steady State
Drain-Source Voltage
VDS
20
- 20
Gate-Source Voltage
VGS
± 20
± 20
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 85 °C
Pulsed Drain Current
IS
TA = 25 °C
TA = 85 °C
Operating Junction and Storage Temperature Range
PD
V
3.28
3.03
- 2.80
- 2.58
2.12
1.81
- 1.72
- 1.53
9.5
IDM
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
ID
- 8.5
2.61
2.48
- 1.61
-1.48
1.24
1.17
1.10
0.97
0.88
0.75
0.66
0.5
TJ, Tstg
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t≤5s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
130
170
170
220
80
100
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
VGS(th)
VDS = VGS, ID = 100 µA
N-Ch
0.45
1
VDS = VGS, ID = - 100 µA
P-Ch
- 0.45
1
N-Ch
± 100
P-Ch
± 100
N-Ch
1
VDS = - 16 V, VGS = 0 V
P-Ch
-1
VDS = 16 V, VGS = 0 V, TJ = 85 °C
N-Ch
5
IGSS
VDS = 0 V, VGS = ± 8 V
VDS = 16 V, VGS = 0 V
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
IDSS
P-Ch
VDS ≥ 5 V, VGS = 4.5 V
N-Ch
2
VDS ≤ - 5 V, VGS = - 4.5 V
P-Ch
-2
RDS(on)
gfs
VSD
nA
µA
-5
VDS = - 16 V, VGS = 0 V, TJ = 85 °C
ID(on)
V
A
VGS = 4.5 V, ID = 2.55 A
N-Ch
0.090
VGS = - 4.5 V, ID = - 1.85 A
P-Ch
0.155
VGS = 2.5 V, ID = 1.55 A
N-Ch
0.110
VGS = - 2.5 V, ID = - 1.35 A
P-Ch
0.19+0
VGS = 1.8 V, ID = 0.50 A
N-Ch
0.130
VGS = - 1.8 V, ID = - 0.50 A
P-Ch
0.220
VDS = 10 V, ID = 1.13 A
N-Ch
2.6
VDS = - 10 V, ID = - 0.88 A
P-Ch
1.5
IS = 0.48 A, VGS = 0 V
N-Ch
0.8
1.2
IS = - 0.48 A, VGS = 0 V
P-Ch
- 0.8
- 1.2
N-Ch
1.25
2
1.8
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
tr
td(off)
Fall Time
tf
Reverse Recovery Time
trr
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 2.55 A
P-Channel
VDS = - 10 V, VGS = - 4.5 V, ID = - 0.88
A
N-Channel
VDD = 10 V, RL = 20 Ω
ID ≅ 0.5 A, VGEN = 4.5 V, Rg = 6 Ω
P-Channel
VDD = - 10 V, RL = 20 Ω
ID ≅ - 0.5 A, VGEN = - 4.5 V, Rg = 6 Ω
IF = 0.48 A, dI/dt = 100 A/µs
P-Ch
1.2
N-Ch
0.21
P-Ch
0.3
N-Ch
0.3
P-Ch
0.21
nC
N-Ch
15
25
P-Ch
18
30
N-Ch
22
35
P-Ch
25
40
N-Ch
25
40
P-Ch
15
25
N-Ch
12
20
P-Ch
12
20
N-Ch
30
60
P-Ch
30
60
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
10
VGS = 5 V thru3 V
TC = - 55 °C
I D - Drain Current (A)
I D - Drain Current (A)
25 °C
7.5
1.5 V
5.0
2.5
7.5
125 °C
5.0
2.5
1V
0.0
0
1
2
3
0.0
0.0
4
0.5
1.0
1.5
2.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.6
160
120
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.5
0.4
0.3
VGS = 1.8 V
0.2
VGS = 2.5 V
Ciss
80
40
Coss
0.1
VGS = 4.5 V
0.0
0.0
Crss
0
0.5
1.0
1.5
2.0
0
4
ID - Drain Current (A)
8
Capacitance
5
1.6
VDS = 10 V
ID = 1.28 A
VGS = 4.5 V
ID = 1.13 A
4
1.4
R DS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
20
16
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
3
2
1
0
0.0
12
1.2
1.0
0.8
0.3
0.6
0.9
Qg - Total Gate Charge (nC)
Gate Charge
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1.2
1.5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.6
2
TJ = 150 °C
R DS(on) - On-Resistance (Ω)
0.5
I S - Source Current (A)
1
TJ = 25 °C
0.4
ID = 1.13 A
0.3
0.2
0.1
0.0
0.1
0
0.4
0.2
0.6
0.8
1.0
0
1.2
1
3
4
5
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.2
5
ID = 100 µA
0.1
4
0.0
3
Power (W)
VGS(th) Variance (V)
2
- 0.1
2
- 0.2
1
- 0.3
- 0.4
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
1
10
100
600
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
10
IDM Limited
P(t) = 0.0001
I D - Drain Current (A)
Limited by RDS(on)*
1
P(t) = 0.001
ID(on)
Limited
P(t) = 0.01
0.1
P(t) = 0.1
TA = 25 °C
Single Pulse
P(t) = 1
P(t) = 10, DC
BVDSS Limited
0.01
0.1
1
10
100
V DS - Drain-to-Source Voltage (V)
* V GS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 170 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10-4
4. Surface Mounted
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
3.0
3.0
TC = - 55 °C
2.5
I D - Drain Current (A)
I D - Drain Current (A)
2.5
3V
VGS = 5 V
thru 3.5 V
2.5 V
2.0
1.5
2V
1.0
1.5 V
0.5
25 °C
2.0
125 °C
1.5
1.0
0.5
1V
0.0
0.0
0.0
0
1
2
3
4
0.5
1.0
1.5
3.0
3.5
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
160
0.64
VGS = 1.8 V
Ciss
120
0.48
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
2.5
2.0
VGS = 2.5 V
0.32
VGS = 4.5 V
80
Coss
40
0.16
Crss
0.0
0.0
0
0.5
1.0
1.5
2.0
2.5
0
3.0
6
8
10
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
Capacitance
12
1.6
VDS = 10 V
ID = 0.9 A
VGS = 4.5 V
ID = 0.88 A
1.4
3
2
(Normalized)
4
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
4
On-Resistance vs. Drain Current
5
1.2
1.0
0.8
1
0
0.0
2
0.3
0.6
0.9
1.2
1.5
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1.6
2
I S - Source Current (A)
ID = 0.88 A
R DS(on) - On-Resistance (Ω)
TJ = 150 °C
1
TJ = 25 °C
1.2
0.8
0.4
0.0
0.1
0
0.4
0.2
0.6
0.8
1.0
0
1.2
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.30
5
0.25
ID = 100 µA
4
0.15
3
Power (W)
V GS(th) Variance (V)
0.20
0.10
0.05
2
0.00
- 0.05
1
- 0.10
- 0.15
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
1
10
100
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
600
10
IDM Limited
I D - Drain Current (A)
P(t) = 0.0001
Limited by RDS(on)*
1
P(t) = 0.001
ID(on)
Limited
P(t) = 0.01
0.1
P(t) = 0.1
TA = 25 °C
Single Pulse
BVDSS Limited
0.01
0.1
1
P(t) = 1
P(t) = 10
DC
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which R DS(on) is specified
Safe Operating Area, Junction-to-Ambient
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P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
2. Per Unit Base = R thJA = 170 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10-4
t1
t2
4. Surface Mounted
10-3
10-2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
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