AO6800
www.VBsemi.tw
Dual N-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)a
0.022 at VGS = 4.5 V
6.0
0.028 at VGS = 2.5 V
5.0
VDS (V)
20
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg Tested
• Compliant to RoHS Directive 2002/95/EC
Qg (Typ.)
1.8 nC
TSOP-6
Top View
3 mm
D1
G1
1
6
D1
S2
2
5
S1
G2
3
4
D2
G1
2.85 mm
D2
G2
S1
S2
N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDS
VGS
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Limit
20
± 12
6.0
4.0
3.5b, c
2.8b, c
18
1.17
ID
IDM
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
Maximum Power Dissipation
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
Continuous Source-Drain Diode Current
IS
Unit
V
A
0.95b, c
1.6
1.0
PD
1.14b, c
0.73b, c
- 55 to 150
260
TJ, Tstg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
b, d
t≤5s
Steady State
Maximum Junction-to-Ambient
Maximum Junction-to-Foot
Notes:
a. TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 150 °C/W.
E-mail:China@VBsemi TEL:86-755-83251052
Symbol
RthJA
RthJF
Typical
93
75
Maximum
110
90
Unit
°C/W
1
AO6800
www.VBsemi.tw
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
20
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
ID = 250 µA
VGS(th)
VDS = VGS , ID = 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
V
29
mV/°C
-4
0.4
1.5
V
± 100
nA
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
10
VDS ≥ 5 V, VGS = 10 V
10
µA
A
VGS = 4.5 V, ID = 3.4 A
0.022
2
VGS = 2.5 V, ID = 3.0 A
0.028
VDS = 10 V, ID = 3.4 A
10
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
400
VDS = 10 V, VGS = 0 V, f = 1 MHz
55
VDS = 10 V, VGS = 10 V, ID = 3.4 A
3.7
6
1.8
3
26
0.74
VDS = 10 V, VGS = 4.5 V, ID = 3.4 A
VDD = 10 V, RL = 5.6 Ω
ID ≅ 2.7 A, VGEN = 4.5 V, Rg = 1 Ω
1
5
10
10
20
15
30
10
20
tf
10
20
td(on)
5
10
15
30
td(off)
tr
td(off)
nC
0.42
f = 1 MHz
td(on)
tr
pF
VDD = 10 V, RL = 5.6 Ω
ID ≅ 2.7 A, VGEN = 10 V, Rg = 1 Ω
tf
10
20
10
20
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
1.2
A
18
IS = 2.7 A, VGS = 0 V
IF = 2.7 A, dI/dt = 100 A/µs, TJ = 25 °C
0.85
1.2
V
10
20
ns
4
10
nC
6
4
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
E-mail:China@VBsemi TEL:86-755-83251052
2
AO6800
www.VBsemi.tw
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
15
5
V GS = 8V t h r u 3 V
4
I D - Drain Current (A)
I D - Drain Current (A)
12
9
V GS = 2 V
6
T C = - 55 °C
3
2
T C = 25 °C
3
1
T C = 125 °C
V GS = 1 V
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.0
3.0
0.5
1.0
2.0
2.5
3.0
25
30
V GS - Gate-to-Source Voltage (V)
V DS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
600
0.050
500
Ciss
0.040
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
1.5
VGS = 2.5 V
0.030
VGS = 4.5 V
0.020
400
300
200
Coss
0.010
100
Crss
0
0.00
0
3
6
9
12
0
15
5
ID - Drain Current (A)
10
20
V DS - Drain-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current and Gate Voltage
1.8
10
ID = 3.4 A
ID = 3.4 A
1.6
V DS = 10 V
V DS = 6 V
6
V DS = 14 V
4
2
V GS = 2.5V , V GS = 4.5 V
1.4
(Normalized)
8
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
15
1.2
1.0
0.8
0
0
1
2
3
Qg - Total Gate Charge (nC)
Gate Charge
E-mail:China@VBsemi TEL:86-755-83251052
4
0.6
- 50
- 25
0
25
50
75
100
125
150
T J - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
3
AO6800
www.VBsemi.tw
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.14
ID = 3.4 A
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
0.12
T J = 150 °C
10
T J = 25 °C
1
0.10
0.08
T J = 125 °C
0.06
T J = 25 °C
0.04
0.02
0.1
0.0
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V GS - Gate-to-Source Voltage (V)
V SD - Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
1.9
6
ID = 250 μA
1.8
5
1.7
4
Power (W)
VGS(th) (V)
1.6
1.5
1.4
3
2
1.3
1
1.2
1.1
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
T J - Temperature (°C)
1
10
100
1000
Time (s)
Threshold Voltage
Single Pulse Power (Junction-to-Ambient)
100
Limited by RDS(on) *
I D - Drain Current (A)
10
100 μs
1
1 ms
TA = 25 °C
Single Pulse
10 ms
0.1
BVDSS Limited
0.01
0.1
1
10
100 ms
1 s, 10 s
DC
100
V DS - Drain-to-Source Voltage (V)
* V GS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
E-mail:China@VBsemi TEL:86-755-83251052
4
AO6800
www.VBsemi.tw
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
5
1.6
4
Power Dissipation (W)
I D - Drain Current (A)
1.2
Package Limited
3
2
0.8
0.4
1
0
0.0
0
25
50
75
100
T C - Case Temperature (°C)
Current Derating*
125
150
25
50
75
100
125
150
T C - Foot Temperature (°C)
Power Derating
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
E-mail:China@VBsemi TEL:86-755-83251052
5
AO6800
www.VBsemi.tw
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.05
PDM
0.1
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 150 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
E-mail:China@VBsemi TEL:86-755-83251052
6
AO6800
www.VBsemi.tw
TSOP: 5/6−LEAD
JEDEC Part Number: MO-193C
e1
e1
5
4
6
E1
1
2
5
4
E
E1
1
3
2
3
-B-
e
b
E
-B-
e
0.15 M C B A
5-LEAD TSOP
b
0.15 M C B A
6-LEAD TSOP
4x 1
-A-
D
0.17 Ref
c
R
R
A2 A
L2
Gauge Plane
Seating Plane
Seating Plane
0.08
C
L
A1
-C-
(L1)
4x 1
MILLIMETERS
Dim
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
L2
R
Min
Nom
Max
Min
Nom
Max
0.91
-
1.10
0.036
-
0.043
0.01
-
0.10
0.0004
-
0.004
0.90
-
1.00
0.035
0.038
0.039
0.30
0.32
0.45
0.012
0.013
0.018
0.10
0.15
0.20
0.004
0.006
0.008
2.95
3.05
3.10
0.116
0.120
0.122
2.70
2.85
2.98
0.106
0.112
0.117
1.55
1.65
1.70
0.061
0.065
0.067
0.95 BSC
0.0374 BSC
1.80
1.90
2.00
0.071
0.075
0.079
0.32
-
0.50
0.012
-
0.020
0.60 Ref
0.024 Ref
0.25 BSC
0.010 BSC
0.10
-
-
0.004
-
-
0
4
8
0
4
8
7 Nom
1
ECN: C-06593-Rev. I, 18-Dec-06
DWG: 5540
E-mail:China@VBsemi TEL:86-755-83251052
INCHES
7 Nom
7
AO6800
www.VBsemi.tw
RECOMMENDED MINIMUM PADS FOR TSOP-6
0.099
0.039
0.020
0.019
(1.001)
(0.508)
(0.493)
0.064
(1.626)
0.028
(0.699)
(3.023)
0.119
(2.510)
Recommended Minimum Pads
Dimensions in Inches/(mm)
E-mail:China@VBsemi TEL:86-755-83251052
8
AO6800
www.VBsemi.tw
Disclaimer
All products due to improve reliability, function or design or for other reasons, product specifications and
data are subject to change without notice.
Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their
representatives ( collectively, the "Taiwan VBsemi"), assumes no responsibility for any errors, inaccuracies or
incomplete data contained in the table or any other any disclosure of any information related to
the product.(www.VBsemi.tw)
Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of
any goods or continuous production. To the maximum extent permitted by applicable law on Taiwan VBsemi
relinquished: ( 1) any application and all liability arising out of or use of any products; ( 2) any and all liability,
including but not limited to special, consequential damages or incidental ; ( 3) any and all implied warranties,
including a particular purpose, non-infringement and merchantability guarantee.
Statement on certain types of applications are based on knowledge of the product is often used in a typical
application of the general product VBsemi Taiwan demand that the Taiwan VBsemi of. Statement on whether the
product is suitable for a particular application is non-binding. It is the customer's responsibility to verify specific
product features in the products described in the specification is appropriate for use in a particular application.
Parameter data sheets and technical specifications can be provided may vary depending on the application and
performance over time. All operating parameters, including typical parameters must be made by customer's
technical experts validated for each customer application. Product specifications do not expand or modify Taiwan
VBsemi purchasing terms and conditions, including but not limited to warranty herein.
Unless expressly stated in writing, Taiwan VBsemi products are not intended for use in medical, life saving,
or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal
injury or death, use or sale of products used in Taiwan VBsemi such applications using client did not express their
own risk. Contact your authorized Taiwan VBsemi people who are related to product design applications and
other terms and conditions in writing.
The information provided in this document and the company's products without a license, express or implied,
by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product
names and trademarks referred to herein are trademarks of their respective representatives will be all.
Material Category Policy
Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be
R oHS compliant and meets the definition of restrictions under Directive of the European Parliament
2011/65 / EU, 2011 Nian. 6. 8 R i Yue restrict the use of certain hazardous substances in electrical and
electronic equipment (EEE) - modification, unless otherwise specified as inconsistent.(www.VBsemi.tw)
Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive
2011/65 /.
Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as
halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese
VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products
conform to confirm compliance with IEC 61249-2-21 standard level JS709A.
E-mail:China@VBsemi TEL:86-755-83251052
9