MC1436, C
High Voltage, Internally
Compensated Operational
Amplifiers
OPERATIONAL AMPLIFIERS
The MC1436, C was designed for use as a summing amplifier, integrator,
or amplifier with operating characteristics as a function of the external
feedback components.
• Output Voltage Swing:
±22 Vpk(min) (VCC = +28 V, VEE = –28 V)
• Fast Slew Rate: 2.0 V/µs Typ
•
•
•
•
•
SEMICONDUCTOR
TECHNICAL DATA
Internally Compensated
Offset Voltage Null Capability
Input Overvoltage Protection
AVOL: 500,000 Typ
Characteristics Independent of Power Supply Voltages:
(±5.0 Vdc to ±36 Vdc)
8
1
P1 SUFFIX
PLASTIC PACKAGE
CASE 626
Figure 1. Differential Amplifier with ±20 V
Common Mode Input Voltage Range
8
1
R2
100 k
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
+28 V
R1
10 k
2
7
–
VA
6
R3
470
MC1436 , C
4
+
VB
PIN CONNECTIONS
VO = 10 (VB –VA)
3
Offset Null
1
8
N.C.
Inv. Input
2
7
VCC
Noninv. Input
3
6
Output
5
Offset Null
–28 V
R4
4.7 k
+
Figure 2. Typical Noninverting X10 Voltage Amplifier
7
VI = 4.4 Vpp
3
VEE
+28 V
4
(Top View)
+
6
VO = 44 Vpp
MC1436 , C
_
2
4
–28 V
9.0 k
1.0 k
RL ≥ 5.0 k
ORDERING INFORMATION
Device
Operating
Temperature Range
MC1436CD,D
MC1436CP1,P1
MOTOROLA ANALOG IC DEVICE DATA
Package
SO–8
TA = 0° to +70°C
Plastic DIP
2–79
MC1436, C
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.)
Symbol
MC1436
MC1436C
Unit
Power Supply Voltage
VCC
VEE
+34
–34
+30
–30
Vdc
Input Differential Voltage Range
VIDR
Note 2
Input Common Mode Voltage Range
Rating
V
VICR
Note 2
V
Output Short Circuit Duration
(VCC = VEE = 28 Vdc, VO = 0)
tSC
5.0
sec
Power Dissipation (Package Limitation)
Derate above TA = +25°C
PD
680
4.6
mW
mW/°C
Operating Ambient Temperature Range
TA
0 to +70
°C
Tstg
–65 to +150
°C
Storage Temperature Range
ELECTRICAL CHARACTERISTICS (VCC = +28 V, VEE = –28 V, TA = 25°C, unless otherwise noted.)
MC1436
Characteristic
Symbol
Input Bias Current
TA = +25°C
TA = Tlow to Thigh (See Note 1)
IIB
Input Offset Current
TA = +25°C
TA = +25°C to Thigh
TA = Tlow to +25°C
IIO
Input Offset Voltage
TA = +25°C
TA = Tlow to Thigh
VIO
MC1436C
Min
Typ
Max
Min
Typ
Max
–
–
15
–
40
55
–
–
25
–
90
–
–
–
–
5.0
–
–
10
14
14
–
–
–
10
–
–
25
–
–
–
–
5.0
–
10
14
–
–
5.0
–
12
–
Unit
nAdc
nAdc
mVdc
Differential Input Impedance (Open loop, f ≤ 5.0 Hz)
Parallel Input Resistance
Parallel Input Capacitance
rp
Cp
–
–
10
2.0
–
–
–
–
10
2.0
–
–
Common Mode Input Impedance (f ≤ 5.0 Hz)
zic
–
250
–
–
250
–
MΩ
VICR
± 22
± 25
–
±18
± 20
–
Vpk
–
50
–
–
50
–
70
110
–
50
90
–
70,000
50,000
–
500,000
–
200,000
–
–
–
50,000
–
–
500,000
–
200,000
–
–
–
–
23
–
–
23
–
fc
–
1.0
–
–
1.0
–
MHz
Phase Margin (Open loop, Unity Gain)
φm
–
50
–
–
50
–
Degrees
Gain Margin
AM
–
18
–
–
18
–
dB
Slew Rate (Unity Gain)
SR
–
2.0
–
–
2.0
–
V/µs
Output Impedance (f ≤ 5.0 Hz)
zO
–
1.0
–
–
1.0
–
kΩ
Short Circuit Output Current
ISC
–
±17
–
–
±19
–
mAdc
Input Common Mode Voltage Range
Equivalent Input Noise Voltage
(AV = 100, RS = 10 kΩ, f = 1.0 kHz, BW = 1.0 Hz)
CMR
Large Signal DC Open Loop Voltage Gain
(VO = ±10 V, RL = 100 kΩ) TA = +25°C
TA = Tlow to Thigh
(VO = ±10 V, RL = 10 kΩ, TA = +25°C)
AVOL
Power Bandwidth (Voltage Follower)
(AV = 1, RL = 5.0 kΩ, THD ≤ 5%, VO = 40 Vpp)
BWp
Unity Gain Crossover Frequency (Open loop)
nV/(Hz)1/2
en
Common Mode Rejection (DC)
MΩ
pF
dB
V/V
kHz
NOTES: 1. Tlow = 0°C for MC1436,C
Thigh = +70°C for MC1436,C
2. Either or both input voltages must not exceed the magnitude of VCC or VEE + 3.0 V.
2–80
MOTOROLA ANALOG IC DEVICE DATA
MC1436, C
ELECTRICAL CHARACTERISTICS (VCC = +28 V, VEE = –28 V, TA = 25°C, unless otherwise noted.)
MC1436
Characteristic
Symbol
MC1436C
Unit
Min
Typ
Max
Min
Typ
Max
± 20
–
± 22
–
–
–
± 20
–
± 22
–
–
–
PSR +
PSR –
–
–
35
35
200
200
–
–
50
50
–
–
Power Supply Current (See Note 2)
ICC
IEE
–
–
2.6
2.6
5.0
5.0
–
–
2.6
2.6
5.0
5.0
mAdc
DC Quiescent Power Consumption (VO = 0)
PC
–
146
280
–
146
280
mW
Output Voltage Range (RL = 5.0 kΩ)
VCC = +28 Vdc, VEE = –28 Vdc
VCC = +36 Vdc, VEE = –36 Vdc
VO
Vpk
µV/V
Power Supply Rejection
VEE = Constant, Rs ≤ 10 kΩ
VCC = Constant, Rs ≤ 10 kΩ
NOTES: 2. VCC = VEE = 5.0 Vdc to 30 Vdc for MC1436
VCC = VEE = 5.0 Vdc to 28 Vdc for MC1436C
Figure 3. Low–Drift Sample and Hold
Figure 4. Power Bandwidth
+28 V
7
2
–
Switch
6
MC1436
3
ei
+
5
1
4
1.0 µF
Polycarbonate
Sample
Command
–28 V
*eo
10 k
*Drift due to bias current
is typically 8.0 mV s
VO, OUTPUT VOLTAGE (V p–p )
70
+28 V
60
7
2
50
6
VO
3
4
40
–28 V
10 k
30
20
10
0
4.0
6.0 8.0 10
20
40
60 80 100
200
400
f, FREQUENCY (kHz)
Figure 5. Peak Output Voltage Swing versus
Power Supply Voltage
Figure 6. Open Loop Frequency Response
140
TA = 25° C
120
, VOLTAGE GAIN (dB)
30
25
20
RL = 5.0 kΩ
15
VOL
10
100
80
60
40
20
A
VO , OUTPUT VOLTAGE SWING (Vpk )
35
5.0
0
0
0
10
20
30
VCC/VEE, POWER SUPPLY VOLTAGE (Vdc)
MOTOROLA ANALOG IC DEVICE DATA
40
–20
1.0
10
100
1.0 k
10 k 100 k
f, FREQUENCY (kHz)
1.0 M
10 M 100 M
2–81
Figure 7. Output Short Circuit Current
versus Temperature
Figure 8. Input Bias Current
versus Temperature
IIB , INPUT BIAS CURRENT (NORMALIZED)
I SC , OUTPUT SHORT CIRCUIT CURRENT (mAdc)
MC1436, C
32
28
24
Source
20
16
Sink
12
8.0
4.0
0
–75
–50
–25
0
25
50
75
TA, AMBIENT TEMPERATURE (°C)
100
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
125
Figure 9. Inverting Feedback Model
zi
Z1
(–)
Z2
Iin
Vin
+
EX
(+)
–
zi
+
–
Ao ( ω ) EX 6
RL
∞
(–)
Z1
+
EX
–
(+)
zi
zi +
zo
6
– Ao ( ω ) EX VO
zo
IO
RL
3
If : R3
R3
125
2
Ơ Z1
zi Z1
V2 3
100
Z2
Ao ( ω )
Z2
VO
=–
Z1
Vi
IO
–25
0
25
50
75
TA, AMBIENT TEMPERATURE (°C)
Figure 10. Noninverting Feedback Model
If : Ao ( ω )
zo
VO
zo
–50
1 +Z2/Z1
zo = zo
2
V1
0
–75
Ii
Z3
zi =
Vin
zo = zo
³
1 +Z2/Z1
Ao (ω )
Ao ( ω ) Z 1
, zi Very High
1 +Z2/Z1
VO
= 1 +Z2/Z1, when AO (ω)
Vi
∞
³∞
Zo 0
Ao (ω)
Figure 11. Audio Amplifier
100 k
1.0 k
+
+
1.0 k
7 51
10 k
MC1536
R1
D1
6
D2
3
D3
+
Vi
10 k
10 µF
2N3716
or Equiv
10 µF
2
–
0.5 µF
Current Drain,
ID 100 mAdc @
R1 = 51 Ω
D1 , D2 , D3 = 1N4001
VCC = +30 Vdc
50 µF
2N3766
of Equiv
RL
0.24
2N3740
or Equiv
4
1.0 k
1.0 k
Common
Heat Sink
10 µF
2N3791
or Equiv
0.24
VO = 48 Vpp
PO = 72 W (rms) @ RL = 4.0 Ω
PO = 36 W (rms) @ RL = 8.0 Ω
0.1 µF
4.7
VEE = –30 Vdc
2–82
MOTOROLA ANALOG IC DEVICE DATA
MC1436, C
Figure 12. Voltage Controlled Current Source or Transconductance Amplifier
with 0 V to 40 V Compliance
R2
100 k
+50 V
R1
100 k
7
2
–
–Vi
6
MC1436,C
IO
I
= 2.0 mA/V
=
Vi RTC
3
+
4
–6.0 V
RTC
510
R3
100 k
R1RTC (R3 +R4)
ZO =
R1 (RTC +R3) – R2 R4
R4
100 k
Figure 13. Representative Schematic Diagram
7
6.0 k
1.5 k
VCC
12 k
1.0 k
1.2 k
28 k
28 k 15 k
2
Input
Input
500
500
1.5 k
1.5 k
200
26
–
4.7 k
+
Output
6
3
22
3.5 k
35 pF
5.0 k
7.7 k
1.0 k 39 k 1.0 k
77 k
1
39 k
7.0 k 7.0 k
500
50
39 k
5
Offset Adjust
Figure 14. Equivalent Circuit
VCC
7
Inverting
2
–
Vi
3
+
Zin
– AV +
in
6
VO
Rout
Noninverting
1
4
10 k
5
Offset Adjust
VEE
MOTOROLA ANALOG IC DEVICE DATA
2–83
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
MOTOROLA ANALOG IC DEVICE DATA
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
DPAK and D2PAK
DEVICES
Typical
User Direction of Feed
12–2
SOT–23 (5 Pin)
DEVICES
SOT–89 (3 Pin)
DEVICES
SOT–89 (5 Pin)
DEVICES
Typical
Typical
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
(continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Adhesive Tape
Flat Side
Adhesive Tape
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Flat side of transistor and adhesive tape visible.
Rounded side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
Flat Side
Carrier
Strip
Rounded side of transistor and
adhesive tape visible.
Label
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Feed
Rounded Side
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Label
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
T
T2
F1
F2
P2
P1
MOTOROLA ANALOG IC DEVICE DATA
P2
D
P
12–3
Tape and Reel Information Table
Tape
p Width
(mm)
Devices(1)
per Reel
Reel Size
(inch)
Device
Suffix
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
TO–226AA (TO–92)(2)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
2,500
13
RK
D2PAK
24
800
13
R4
SOT–23 (5 Pin)
8
3,000
7
TR
SOT–89 (3/5 Pin)
12
1,000
7
T1
Package
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Case 846A
–
2500/reel
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
Case 369A
–
2500/reel
Case 936
–
800/reel
–
3000/reel
–
1000/reel
–
1000/reel
PLCC
SOIC
Micro–8
TO–92
DPAK
D2PAK
SOT–23 (5 Pin)
Case 1212
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
MOTOROLA ANALOG IC DEVICE DATA
12–5
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
PD(TA) =
TJ(max) – TA
RθJA(Typ)
where:
PD(TA) = Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
TJ(max) = Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
See individual data sheets for TJ(max)
information.
TA = Maximum desired operating Ambient
Temperature
RθJA(Typ) = Typical Thermal Resistance Junction-toAmbient
MOTOROLA ANALOG IC DEVICE DATA
13–1
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
B
R
P
1
2
L
F
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
K
3
D
X X
G
J
H
V
C
SECTION X–X
1
N
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500
–––
0.250
–––
0.080
0.105
–––
0.100
0.115
–––
0.135
–––
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70
–––
6.35
–––
2.04
2.66
–––
2.54
2.93
–––
3.43
–––
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
–T–
F
–B–
4
SEATING
PLANE
C
T
S
4
Q
A
U
1 2 3
H
–Y–
1
2
3
K
R
L
J
G
D 3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
INCHES
MIN
MAX
0.560
0.625
0.380
0.420
0.140
0.190
0.020
0.045
0.139
0.155
0.100 BSC
–––
0.280
0.012
0.045
0.500
0.580
0.045
0.070
0.200 BSC
0.100
0.135
0.080
0.115
0.020
0.055
0.235
0.255
0.000
0.050
MILLIMETERS
MIN
MAX
14.23
15.87
9.66
10.66
3.56
4.82
0.51
1.14
3.53
3.93
2.54 BSC
–––
7.11
0.31
1.14
12.70
14.73
1.15
1.77
5.08 BSC
2.54
3.42
2.04
2.92
0.51
1.39
5.97
6.47
0.00
1.27
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
–T–
B
–P–
Q
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
OPTIONAL
CHAMFER
A
U
F
L
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
K
1
5
G
5X
S
D
0.014 (0.356)
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
M
T P
M
OPTIONAL
CHAMFER
E
A
U
L
S
W
V
F
1
5
5X
G
5X
0.24 (0.610)
M
J
T
H
D
0.10 (0.254)
M
T P
N
M
–T–
T SUFFIX
CASE 314C–01
Plastic Package
ISSUE A
–Q–
B
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
14.478 14.859
1.702 BSC
0.381
0.635
18.542 18.923
8.128
9.271
3.556
3.886
5.334
6.604
11.888 12.827
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
B
–P–
Q
K
J
5X
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.570
0.585
0.067 BSC
0.015
0.025
0.730
0.745
0.320
0.365
0.140
0.153
0.210
0.260
0.468
0.505
–T–
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
J
K
L
N
Q
S
U
V
W
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.850
0.935
0.067 BSC
0.166 BSC
0.015
0.025
0.900
1.100
0.320
0.365
0.320 BSC
0.140
0.153
–––
0.620
0.468
0.505
–––
0.735
0.090
0.110
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
21.590 23.749
1.702 BSC
4.216 BSC
0.381
0.635
22.860 27.940
8.128
9.271
8.128 BSC
3.556
3.886
––– 15.748
11.888 12.827
––– 18.669
2.286
2.794
SEATING
PLANE
C
E
A
1 2 3 4 5
L
1
DIM
A
B
C
D
E
G
J
K
L
Q
K
5
G
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
INCHES
MIN
MAX
0.610
0.625
0.380
0.420
0.160
0.190
0.020
0.040
0.035
0.055
0.067 BSC
0.015
0.025
0.500
–––
0.355
0.370
0.139
0.147
MILLIMETERS
MIN
MAX
15.59
15.88
9.65
10.67
4.06
4.83
0.51
1.02
0.89
1.40
1.702 BSC
0.38
0.64
12.70
–––
9.02
9.40
3.53
3.73
5 PL
0.356 (0.014) M T Q
MOTOROLA ANALOG IC DEVICE DATA
M
J
13–3
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
–T–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
C
–Q–
B
E
U
A
L
DIM
A
B
C
D
E
G
H
J
K
L
Q
U
S
1 2 3 4 5
K
S
12
3
45
J
G
D
H
5 PL
0.356 (0.014)
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
ISSUE K
M
T Q
C
E
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
4
A
1
2
3
S
1
–T–
2
K
SEATING
PLANE
3
J
F
H
D
G
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
ISSUE Y
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
C
B
E
R
4
Z
A
S
1
3
2
3
U
K
F
J
L
H
D
G
13–4
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.46
1.27
2.28
0.77
1.27
T
M
4
1
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.090 BSC
0.034
0.040
0.018
0.023
0.350
0.380
0.175
0.215
0.050
0.090
0.030
0.050
3 PL
–T–
V
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
1.702 BSC
2.210
2.845
0.381
0.635
25.908 27.051
8.128
9.271
3.556
3.886
2.667
2.972
13.792 14.783
M
B
V
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.067 BSC
0.087
0.112
0.015
0.025
1.020
1.065
0.320
0.365
0.140
0.153
0.105
0.117
0.543
0.582
2 PL
0.13 (0.005)
M
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
–––
0.030
0.050
0.138
–––
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
–––
0.77
1.27
3.51
–––
T
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
1
4
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
–A–
NOTE 2
L
8
C
1
J
–T–
N
SEATING
PLANE
D
M
K
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
G
H
0.13 (0.005)
M
T A
B
M
M
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
14
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
1
C
J
N
H
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
G
D
SEATING
PLANE
K
M
9
1
8
B
F
C
16
L
S
1
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA ANALOG IC DEVICE DATA
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
13–5
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
16
9
1
8
–B–
L
NOTE 5
16
C
1
–T–
M
N
SEATING
PLANE
K
E
F
J
G
D 16 PL
0.13 (0.005)
16 PL
0.13 (0.005)
M
T A
M
T B
MILLIMETERS
MIN
MAX
18.80
21.34
6.10
6.60
3.69
4.69
0.38
0.53
1.27 BSC
1.02
1.78
2.54 BSC
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNER OPTIONAL.
R
16
9
1
8
–B–
M
P
L
F
16
J
1
C
–T–
SEATING
PLANE
S
K
H
G
D 13 PL
0.25 (0.010)
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
M
T B
A
S
L
B
1
12
J
H
F
C
N
1
K
G
D
SEATING
PLANE
INCHES
MIN
MAX
0.740
0.760
0.245
0.260
0.145
0.175
0.015
0.021
0.050
0.070
0.100 BSC
0.050 BSC
0.008
0.015
0.120
0.140
0.295
0.305
0_
10 _
0.200 BSC
0.300 BSC
0.015
0.035
MILLIMETERS
MIN
MAX
18.80
19.30
6.23
6.60
3.69
4.44
0.39
0.53
1.27
1.77
2.54 BSC
1.27 BSC
0.21
0.38
3.05
3.55
7.50
7.74
0_
10 _
5.08 BSC
7.62 BSC
0.39
0.88
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
13
Q
DIM
A
B
C
D
F
G
H
J
K
L
M
P
R
S
S
A
24
13–6
INCHES
MIN
MAX
0.740
0.840
0.240
0.260
0.145
0.185
0.015
0.021
0.050 BSC
0.040
0.70
0.100 BSC
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.040
–A–
P SUFFIX
CASE 648E–01
Plastic Package
(DIP–16)
ISSUE O
24
DIM
A
B
C
D
E
F
G
J
K
L
M
N
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q
MILLIMETERS
MIN
MAX
31.50
32.13
13.21
13.72
4.70
5.21
0.38
0.51
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99
15.49
–––
10
0.51
1.02
0.13
0.38
0.51
0.76
INCHES
MIN
MAX
1.240
1.265
0.520
0.540
0.185
0.205
0.015
0.020
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.012
0.115
0.135
0.590
0.610
–––
10 _
0.020
0.040
0.005
0.015
0.020
0.030
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
18
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
10
B
1
9
A
L
C
18
DIM
A
B
C
D
F
G
H
J
K
L
M
N
1
K
N
F
H
D
G
J
M
SEATING
PLANE
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
1
28
DIM
A
B
C
D
F
G
H
J
K
L
M
N
15
B
14
1
L
C
A
N
G
F
D
M
K
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
40
21
B
1
20
L
A
C
N
J
F
MOTOROLA ANALOG IC DEVICE DATA
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
SEATING
PLANE
40
G
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
J
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
H
INCHES
MIN
MAX
0.875
0.915
0.240
0.260
0.140
0.180
0.014
0.022
0.050
0.070
0.100 BSC
0.040
0.060
0.008
0.012
0.115
0.135
0.300 BSC
0_
15 _
0.020
0.040
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
28
H
MILLIMETERS
MIN
MAX
22.22
23.24
6.10
6.60
3.56
4.57
0.36
0.56
1.27
1.78
2.54 BSC
1.02
1.52
0.20
0.30
2.92
3.43
7.62 BSC
0_
15_
0.51
1.02
D
K
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
M
SEATING
PLANE
13–7
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
ISSUE D
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
24
1
–A–
24
13
1
12
–B–
L
C
–T–
NOTE 1
K
SEATING
PLANE
N
E
G
M
J
F
D
0.25 (0.010)
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
24 PL
0.25 (0.010)
24 PL
T A
M
M
INCHES
MIN
MAX
1.230
1.265
0.250
0.270
0.145
0.175
0.015
0.020
0.050 BSC
0.040
0.060
0.100 BSC
0.007
0.012
0.110
0.140
0.300 BSC
0_
15_
0.020
0.040
DIM
A
B
C
D
E
F
G
J
K
L
M
N
T B
M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
–A–
20
11
1
10
B
DIM
A
B
C
D
E
F
G
J
K
L
M
N
L
C
20
1
–T–
K
SEATING
PLANE
J
F
M
T A
C
0.25
H
M
B
M
1
4
8
B
1
h
e
q
SEATING
PLANE
0.10
A1
B
0.25
13–8
X 45 _
A
C
M
C B
S
A
S
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
5
E
T B
M
M
D
8
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
20 PL
0.25 (0.010)
A
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
20 PL
0.25 (0.010)
D
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
M
N
E
G
MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
L
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751A-03
Plastic Package
(SO-14)
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
M
B
M
14
1
R X 45 _
G
F
C
–T–
0.25 (0.010)
M
J
M
K
D 14 PL
SEATING
PLANE
T B
A
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
16
1
K
R
F
X 45 _
C
SEATING
PLANE
D
J
M
16 PL
0.25 (0.010)
DW, FP SUFFIX
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
–A–
D SUFFIX
CASE 751B-05
Plastic Package
(SO-16)
ISSUE J
–T–
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
T B
M
A
S
S
–A–
20
10X
P
0.010 (0.25)
1
M
B
M
10
20X
J
D
0.010 (0.25)
M
T A
B
S
S
20
F
1
R
C
–T–
18X
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
G
MOTOROLA ANALOG IC DEVICE DATA
K
SEATING
PLANE
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
11
–B–
DIM
A
B
C
D
F
G
J
K
M
P
R
X 45 _
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
13–9
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
13
–B–
12X
P
0.010 (0.25)
1
M
B
M
12
24X
24
D
J
0.010 (0.25)
1
T A
M
B
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R
X 45 _
C
–T–
M
SEATING
PLANE
DW SUFFIX
CASE 751F-04
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
K
G
22X
1
–A–
15
14X
–B–
1
P
0.010 (0.25)
M
B
M
14
M
28X
D
R
0.010 (0.25)
M
T A
B
S
S
X 45 _
C
26X
–T–
G
F
SEATING
PLANE
K
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–B–
8X
P
0.010 (0.25)
M
B
M
8
16X
MILLIMETERS
MIN
MAX
17.80
18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.01
10.55
0.25
0.75
J
D
16
1
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
14X
13–10
G
INCHES
MIN
MAX
0.701
0.711
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
9
1
DIM
A
B
C
D
F
G
J
K
M
P
R
J
–A–
16
INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
28
28
MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.05
10.55
0.25
0.75
K
SEATING
PLANE
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751K–01
Plastic Package
(SO–16)
ISSUE O
16
1
16
S
–A–
–B–
0.25 (0.010)
M
B
9
P
1
M_
F
DIM
A
B
C
D
F
G
J
K
M
P
R
8
G
R X 45 _
C
–T–
K
J
0.25 (0.010)
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
ISSUE O
SEATING
PLANE
14 X D
M
T A
B
S
S
–A–
9
–B–
1
0.010 (0.25)
P
M
B
M
8
16
13X
1
J
D
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
S
K
9X
MOTOROLA ANALOG IC DEVICE DATA
SEATING
PLANE
M
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.368
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
T
16
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
S
T
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
2.54 BSC
3.81 BSC
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
0.100 BSC
0.150 BSC
G
13–11
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
0.25 (0.010)
T A
M
1
M
–A–
–C–
U
V
M
X
S
W
E
Y
R
B
9
1
–T–
N
SEATING
PLANE
K
D
M
T C
9 PL
0.25 (0.010)
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
ISSUE C
0.25 (0.010)
J
H
G
F
M
T A
M
Y BRK
–N–
0.007 (0.180)M T L–M S N
S
0.007 (0.180)M T L–M S N
U
S
D
–L–
Z
–M–
W
20
D
1
V
G1
X
0.010 (0.250)S T L–M S N
S
VIEW D–D
A
0.007 (0.180)M T L–M S N
S
R
0.007 (0.180)M T L–M S N
S
Z
H
C
0.007 (0.180)M T L–M S N
S
E
G
0.004 (0.100)
J –T– SEATING
PLANE
VIEW S
G1
0.010 (0.250)S T L–M S N
13–12
K1
K
F
S
VIEW S
0.007 (0.180)M T L–M S N
MILLIMETERS
MIN
MAX
22.40
23.00
6.40
6.60
3.45
3.65
0.40
0.55
9.35
9.60
1.40
1.60
2.54 BSC
1.51
1.71
0.360
0.400
3.95
4.20
30 _BSC
2.50
2.70
3.15
3.45
13.60
13.90
1.65
1.95
22.00
22.20
0.55
0.75
2.89 BSC
0.65
0.75
2.70
2.80
INCHES
MIN
MAX
0.873
0.897
0.252
0.260
0.135
1.143
0.015
0.021
0.368
0.377
0.055
0.062
0.100 BSC
0.059
0.067
0.014
0.015
0.155
0.165
30_BSC
0.099
0.106
0.124
0.135
0.535
0.547
0.064
0.076
0.866
0.874
0.021
0.029
0.113 BSC
0.025
0.029
0.106
0.110
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
1
B
M
DIM
A
B
C
D
E
F
G
H
J
K
M
N
Q
R
S
U
V
W
X
Y
S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
0.007 (0.180)
B
T L–M
M
N
S
T L–M
S
S
Y BRK
–N–
0.007 (0.180)
U
M
N
S
D
Z
–M–
–L–
W
28
D
X
G1
0.010 (0.250)
T L–M
S
N
S
S
V
1
VIEW D–D
A
0.007 (0.180)
R
0.007 (0.180)
M
T L–M
S
N
S
C
M
T L–M
S
N
0.007 (0.180)
H
Z
M
T L–M
N
S
S
S
K1
E
0.004 (0.100)
G
J
S
K
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250)
–T–
T L–M
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MOTOROLA ANALOG IC DEVICE DATA
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.410
0.430
0.040
–––
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
10.42
10.92
1.02
–––
13–13
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
ISSUE C
0.007(0.180) M T
B
L–M
0.007(0.180) M T
U
N
S
L–M
S
S
N
S
1
–N–
Y
D
BRK
Z
–M–
–L–
G1
0.010 (0.25)
X
VIEW D–D
V
44
W
1
D
0.007(0.180) M T
L–M
S
N
S
R
0.007(0.180) M T
L–M
S
N
S
T
0.007(0.180) M T
H
A
S
L–M
S
L–M
S
N
S
N
N
S
S
K1
Z
K
J
C
F
E
0.007(0.180) M T
0.004 (0.10)
–T– SEATING
G
0.010 (0.25)
S
T
L–M
S
N
NOTES:
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
VIEW S
S
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
11
K
–B–
1
1
10
S
10 PL
0.13 (0.005)
M
B
M
N
C
E
MILLIMETERS
MIN
MAX
17.40
17.65
17.40
17.65
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
16.51
16.66
16.51
16.66
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
15.50
16.00
1.02
–––
J
G
20
INCHES
MIN
MAX
0.685
0.695
0.685
0.695
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.650
0.656
0.650
0.656
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.610
0.630
0.040
–––
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–F–
20
S
VIEW S
PLANE
G1
L–M
D 20 PL
0.13 (0.005) M T B
0.10 (0.004)
L
S
–T–
A
S
SEATING
PLANE
M
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
S
MILLIMETERS
MIN
MAX
12.35
12.80
5.10
5.45
1.95
2.05
0.35
0.50
–––
0.81
12.40*
1.15
1.39
0.59
0.81
0.18
0.27
1.10
1.50
0.05
0.20
0_
10 _
0.50
0.85
7.40
8.20
INCHES
MIN
MAX
0.486
0.504
0.201
0.215
0.077
0.081
0.014
0.020
–––
0.032
0.488*
0.045
0.055
0.023
0.032
0.007
0.011
0.043
0.059
0.001
0.008
0_
10 _
0.020
0.033
0.291
0.323
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
15
SEATING
PLANE
–T–
C
E
M
–Q–
B
DIM
A
B
C
D
E
G
H
J
K
L
M
R
S
U
V
Y
–P–
U
Y
K
V
A
R
S
H
PIN 15
PIN 1
L
G
15X
D
15X
0.010 (0.254)
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
T P Q
M
S
J
0.024 (0.610)
M
T
15
SEATING
PLANE
–T–
C
B
E
–P–
U
DIM
A
B
C
D
E
F
G
H
J
K
Q
R
U
Y
A
R
K
PIN 1
Y
PIN 15
G
7X
15X
MILLIMETERS
MIN
MAX
17.374 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
1.270 BSC
4.293 BSC
0.458
0.609
17.780 18.034
5.080 BSC
3.760
3.835
10.567 10.820
3.988
4.242
2.667
2.921
22.047 REF
15.875 16.231
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
Q
–L–
INCHES
MIN
MAX
0.684
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.050 BSC
0.169 BSC
0.018
0.024
0.700
0.710
0.200 BSC
0.148
0.151
0.416
0.426
0.157
0.167
0.105
0.115
0.868 REF
0.625
0.639
H
F
D
0.010 (0.254)
15X
M
T P L
MOTOROLA ANALOG IC DEVICE DATA
S
J
0.024 (0.610)
M
INCHES
MIN
MAX
0.681
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.016
0.023
0.050 BSC
0.110 BSC
0.018
0.024
1.078
1.086
0.148
0.151
0.416
0.426
0.110 BSC
0.503 REF
MILLIMETERS
MIN
MAX
17.298 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
0.407
0.584
1.270 BSC
2.794 BSC
0.458
0.609
27.382 27.584
3.760
3.835
10.567 10.820
2.794 BSC
12.776 REF
T
13–15
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
ISSUE O
1
L
–T–, –U–, –Z–
–Z–
44
34
11
T–U
G
AE
DETAIL AA
M
V
S
AE
PLATING
F
BASE METAL
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
J
23
12
0.20 (0.008)
DETAIL AA
0.05 (0.002) Z
AC Z
S
T–U
0.20 (0.008)
M
B
L
S
–U–
AB Z
–T–
S
33
1
22
N
D
0.20 (0.008)
A
0.20 (0.008)
AB T–U
M
S
Z
S
S
Z
S
M
AC T–U
S
Z
S
SECTION AE–AE
0.05 (0.002) T–U
S
0.20 (0.008)
M
AC T–U
M
C
–AB–
E
0.10 (0.004)
–AC–
H
Y
R
K
W
X
VIEW AD
13–16
DETAIL AD
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.300
0.450
E
1.350
1.450
F
0.300
0.400
G
0.800 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
L
8.000 BSC
M
12_REF
N
0.090
0.160
Q
1_
5_
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
W
0.200 REF
X
1.000 REF
Y
12_REF
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.315 BSC
12_REF
0.004
0.006
1_
5_
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12_REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
ISSUE A
44
1
S
0.20 (0.008)
M
–L–, –M–, –N–
T L–M
S
N
S
H L–M
S
N
S
A
0.20 (0.008)
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
44
G
J1
34
VIEW Y
33
1
G
11
40X
S
T L–M
M
J
0.20 (0.008)
VIEW Y
BASE METAL
B1
D
M
T L–M
S
N
S
SECTION J1–J1
44 PL
22
–N–
M
VIEW P
C E
–H–
W
Y
q1
R
DATUM
PLANE
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
0.20 (0.008)
23
12
F
PLATING
V
S
0.20 (0.008)
M
B
–M–
0.05 (0.002) N
–L–
H L–M
N
N
S
S
3 PL
–H–
R
K
A1
C1
VIEW P
MOTOROLA ANALOG IC DEVICE DATA
R1
R2
q2
DATUM
PLANE
0.01 (0.004)
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
DIM
A
B
C
D
E
F
G
J
K
M
S
V
W
Y
A1
B1
C1
R1
R2
q1
q2
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
9.90
10.10
0.390
0.398
9.90
10.10
0.390
0.398
2.00
2.21
0.079
0.087
0.30
0.45 0.0118 0.0177
2.00
2.10
0.079
0.083
0.30
0.40
0.012
0.016
0.80 BSC
0.031 BSC
0.13
0.23
0.005
0.009
0.65
0.95
0.026
0.037
5_
10 _
5_
10_
12.95
13.45
0.510
0.530
12.95
13.45
0.510
0.530
0.000
0.210
0.000
0.008
5_
10 _
5_
10 _
0.450 REF
0.018 REF
0.130
0.005
0.170
0.007
1.600 REF
0.063 REF
0.130
0.300
0.005
0.012
0.130
0.300
0.005
0.012
5_
10 _
5_
10 _
0_
7_
0_
7_
13–17
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
S
S
T–U
48
T–U
1
–T–, –U–, –Z–
–U–
DETAIL AA
S
S
AC Z
M
G
DETAIL AA
33
S
16
AE
V
0.20 (0.008)
–T–
AE
0.20 (0.008) M
0.050 (0.002)
B
Z
L
AB Z
P
32
Z
17
S
S
Z
S
F
M
C
SECTION AE–AE
–AB–
Y
D
J
E
H
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
N
S
Z
AC T–U
S
AC T–U
M
S
M
0.20 (0.008)
BASE
METAL
0.20 (0.008)
A
0.20 (0.008) M AB T–U
0.050 (0.002) T–U
0.10 (0.004)
–AC–
DETAIL AD
Q
R
K
W
X
DETAIL AD
13–18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
7.500 BSC
L
M
12° REF
N
0.090
0.160
0.250 BSC
P
Q
1°
5°
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
0.200 REF
W
1.000 REF
X
12° REF
Y
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.295 BSC
12° REF
0.004
0.006
0.010 BSC
5°
1°
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12° REF
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
ISSUE C
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–A–
–B–
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
–T–
M
T B
S
A
S
SEATING
PLANE
0.038 (0.0015)
C
H
MOTOROLA ANALOG IC DEVICE DATA
J
DIM
A
B
C
D
G
H
J
K
L
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
–––
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
–––
0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
L
13–19
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
ISSUE C
1
52
L
39
27
S
D
S
V
B
–A–, –B–, –D–
0.20 (0.008)
0.20 (0.008)
M
L
B
M
C A–B
S
S
B
H A–B
–B–
–A–
0.05 (0.002) A–B
DETAIL A
D
26
40
DETAIL A
14
52
1
13
–D–
B
0.20 (0.008) M H A–B
F
S
D
S
S
D
S
0.05 (0.002) A–B
J
V
0.20 (0.008)
M
C A–B
N
BASE METAL
M_
C
D
DETAIL C
0.02 (0.008)
E
–H–
M
C A–B
S
D
S
SECTION B–B
DATUM
PLANE
0.10 (0.004)
H
M_
G
U_
R
Q_
K
T
W
X
DETAIL C
13–20
–C–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN
MAX
9.90
10.10
9.90
10.10
2.10
2.45
0.22
0.38
2.00
2.10
0.22
0.33
0.65 BSC
–––
0.25
0.13
0.23
0.65
0.95
7.80 REF
5_
10_
0.13
0.17
0_
7_
0.13
0.30
12.95
13.45
0.13
–––
0_
–––
12.95
13.45
0.35
0.45
1.6 REF
INCHES
MIN
MAX
0.390
0.398
0.390
0.398
0.083
0.096
0.009
0.015
0.079
0.083
0.009
0.013
0.026 BSC
–––
0.010
0.005
0.009
0.026
0.037
0.307 REF
5_
10 _
0.005
0.007
0_
7_
0.005
0.012
0.510
0.530
0.005
–––
0_
–––
0.510
0.530
0.014
0.018
0.063 REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
52
1
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
52
40
1
CL
39
3X VIEW
–X–
X=L, M, N
AB
Y
–L–
AB
–M–
B
B1
VIEW Y
V
V1
27
14
26
J
–N–
A1
S1
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
BASE METAL
F
PLATING
13
G
0.13 (0.005)
M
D
T L–M
U
S
N
S
A
SECTION AB–AB
S
ROTATED 90_ CLOCKWISE
4X
C
θ2
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
4X
θ3
VIEW AA
0.05 (0.002)
S
W
θ1
2XR
R1
0.25 (0.010)
C2
θ
GAGE PLANE
K
C1
E
Z
VIEW AA
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
θ1
θ2
θ3
MILLIMETERS
MIN
MAX
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
–––
1.70
0.05
0.20
1.30
1.50
0.20
0.40
0.75
0.45
0.22
0.35
0.65 BSC
0.07
0.20
0.50 REF
0.08
0.20
12.00 BSC
6.00 BSC
0.09
0.16
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
INCHES
MIN
MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
–––
0.067
0.002
0.008
0.051
0.059
0.008
0.016
0.018
0.030
0.009
0.014
0.026 BSC
0.003
0.008
0.020 REF
0.003
0.008
0.472 BSC
0.236 BSC
0.004
0.006
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
13–21
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
–A–
42
22
–B–
1
21
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
H
C
–T–
SEATING
PLANE
N
G
F
D 42 PL
K
0.25 (0.010)
M
T A
M
J 42 PL
0.25 (0.010)
S
M
T B
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
56
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
29
–B–
1
28
L
H
C
–T–
K
SEATING
PLANE
G
F
D 56 PL
0.25 (0.010)
13–22
E
M
T A
S
N
J
M
56 PL
0.25 (0.010)
M
T B
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.035 BSC
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
0.89 BSC
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
ISSUE A
1
L
S
D
S
H A–B
V
P
B
M
S
D
S
0.20 (0.008)
B
B
0.20 (0.008)
L
M
–B–
–A–
0.05 (0.002) A–B
16
C A–B
17
24
25
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
0.20 (0.008)
C A–B
M
D
S
S
0.05 (0.002) A–B
N
J
S
0.20 (0.008)
M
H A–B
D
S
S
D
0.20 (0.008)
M
M
C A–B
D
S
S
DETAIL C
SECTION B–B
VIEW ROTATED 90 _CLOCKWISE
C E
–H–
–C–
SEATING
PLANE
H
M
G
DATUM
PLANE
0.01 (0.004)
U
T
R
–H–
DATUM
PLANE
K
X
DETAIL C
MOTOROLA ANALOG IC DEVICE DATA
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
X
MILLIMETERS
MIN
MAX
6.95
7.10
6.95
7.10
1.40
1.60
0.273
0.373
1.30
1.50
0.273
–––
0.80 BSC
–––
0.20
0.119
0.197
0.33
0.57
5.6 REF
6_
8_
0.119
0.135
0.40 BSC
5_
10_
0.15
0.25
8.85
9.15
0.15
0.25
5_
11_
8.85
9.15
1.00 REF
INCHES
MIN
MAX
0.274
0.280
0.274
0.280
0.055
0.063
0.010
0.015
0.051
0.059
0.010
–––
0.031 BSC
–––
0.008
0.005
0.008
0.013
0.022
0.220 REF
6_
8_
0.005
0.005
0.016 BSC
5_
10_
0.006
0.010
0.348
0.360
0.006
0.010
5_
11_
0.348
0.360
0.039 REF
13–23
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
23
C
E
B
–N–
L
U
K
Y
P
F
V
M
S
H
A
R
W
–T–
23X
PIN 1
0.024 (0.610)
PIN 23
G
23X
D
0.010 (0.254)
13–24
M
T Q
J
SEATING
PLANE
S
N
M
T
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
W
Y
INCHES
MIN
MAX
0.684
0.694
1.183
1.193
0.175
0.179
0.026
0.031
0.058
0.062
0.165
0.175
0.050 BSC
0.169 BSC
0.014
0.020
0.625
0.639
0.770
0.790
0.148
0.152
0.148
0.152
0.390 BSC
0.416
0.424
0.157
0.167
0.105
0.115
0.868 REF
0.200 BSC
0.700
0.710
MILLIMETERS
MIN
MAX
17.374 17.627
30.048 30.302
4.445
4.547
0.660
0.787
1.473
1.574
4.191
4.445
1.270 BSC
4.293 BSC
0.356
0.508
15.875 16.231
19.558 20.066
3.760
3.861
3.760
3.861
9.906 BSC
10.566 10.770
3.988
4.242
2.667
2.921
22.047 REF
5.080 BSC
17.780 18.034
S
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U Z
9
DETAIL Y
A
A1
48
37
AE
1
AE
36
–T–
–U–
B
V
B1
12
25
13
V1
–T–, –U–, –Z–
DETAIL Y
24
–Z–
S1
M_
TOP & BOTTOM
S
R
4X
0.200 (0.008) AC T–U Z
GAUGE PLANE
0.250 (0.010)
C
E
0.080 (0.003) AC
G
–AB–
W
H
Q_
–AC–
AD
K
DETAIL AD
X
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
BASE METAL
N
J
F
D
0.080 (0.003)
M
AC T–U
S
Z
S
SECTION AE–AE
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BASIC
0.050
0.150
0.090
0.200
0.500
0.700
12 _REF
0.090
0.160
0.250 BASIC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BASIC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BASIC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
13–25
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
3
TERMINAL 4
K
U
A
S
B
V
H
F
1
2
3
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
J
D
G
0.010 (0.254)
M
T
–T–
OPTIONAL
CHAMFER
E
C
M
L
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D2PAK)
ISSUE A
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
5
TERMINAL 6
U
A
V
S
K
B
H
1 2 3 4 5
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
D
0.010 (0.254)
M
T
G
–T–
OPTIONAL
CHAMFER
E
C
M
N
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691 14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
L
P
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
1
20X
0.15 (0.006) T U
M
20
L/2
2X
K REF
0.10 (0.004)
S
T U
V
S
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
L
PIN 1
IDENT
0.25 (0.010)
N
10
1
0.15 (0.006) T U
SECTION N–N
–U–
M
S
A
–V–
N
F
DETAIL E
C
G
D
–W–
H
0.100 (0.004)
–T– SEATING
DTB SUFFIX
16
CASE 948F–01
Plastic Package
(TSSOP–16, TSSOP–16L)
ISSUE O
1
16X K REF
0.10 (0.004)
M
T U
S
V
S
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
S
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
S
M
A
–V–
N
F
DETAIL E
C
0.10 (0.004)
–T– SEATING
PLANE
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
H
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
N
0.25 (0.010)
0.15 (0.006) T U
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
DETAIL E
PLANE
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
G
DETAIL E
MOTOROLA ANALOG IC DEVICE DATA
13–27
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
13–28
D
G
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
2X
24
L/2
B
–U–
L
PIN 1
IDENT.
12
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
13
S
A
–V–
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
H
MILLIMETERS
MIN
MAX
7.70
7.90
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.303
0.311
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
DETAIL E
N
0.25 (0.010)
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
M
K1
J1
N
F
SECTION N–N
J
MOTOROLA ANALOG IC DEVICE DATA
DETAIL E
13–29
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
ISSUE O
8
1
0.15 (0.006) T U
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
K REF
8x
0.10 (0.004)
S
M
T U
V
S
S
K
2X
L/2
ÉÉ
ÇÇÇ
ÇÇÇ
ÉÉ
K1
8
5
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
M
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
SEE DETAIL E
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
ISSUE O
INCHES
MIN
MAX
0.114
0.122
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
1
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
MILLIMETERS
MIN
MAX
2.90
3.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
20
20
13–30
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.81
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.032
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
20
DETAIL Y
16
15
1
–T–
–U–
V
B1
V1
11
5
6
10
–Z–
S1
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.650 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
J
–AB–
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.026 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
–AC–
N
F
D
0.080 (0.003) AC
0.080 (0.003)
M_
S
AC T–U
S
Z
S
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C E
AE
W
H
K
X
DETAIL AD
MOTOROLA ANALOG IC DEVICE DATA
Q_
AE
GAUGE
PLANE
0.250 (0.010)
G
DETAIL Y
13–31
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
24
–T–
DETAIL Y
19
18
1
–U–
V
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
V1
13
6
B1
12
7
–Z–
S1
S
4X
0.200 (0.008) AB T–U Z
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M_
TOP & BOTTOM
R
C E
J
W
H
K
X
Q_
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
P
G
DETAIL Y
N
F
GAUGE
PLANE
D
0.250 (0.010)
0.080 (0.003)
S
AC T–U
S
Z
S
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
ISSUE O
1
A
B
D
5
E
A2
0.05 S
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
A1
4
1
2
L
3
E1
L1
B
C
5X
0.10
C B
M
A
S
C
S
e
e1
H SUFFIX
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
DIM
A1
A2
B
C
D
E
E1
e
e1
L
L1
MILLIMETERS
MIN
MAX
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.80
3.00
2.50
3.10
1.50
1.80
0.95 BSC
1.90 BSC
0.20
–––
0.45
0.75
1
A
D
A2
C
B
D1
E1
E
L1
B
0.10
B1
e
M
C B
S
A
S
2X
0.10
M
C B
S
A
S
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
DIM
A2
B
B1
C
D
D1
E
E1
e
e1
L1
MILLIMETERS
MIN
MAX
1.40
1.60
0.37
0.57
0.32
0.52
0.30
0.50
4.40
4.60
1.50
1.70
–––
4.25
2.40
2.60
1.50 BSC
3.00 BSC
0.80
–––
e1
MOTOROLA ANALOG IC DEVICE DATA
13–33
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