CD74AC541M

Data sheet acquired from Harris Semiconductor SCHS285A – Revised November 1999 The CD54/74AC540, -541, and CD54/74ACT540, -541 octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT540 are inverting 3-state buffers having two active-LOW output enables. The CD54/74AC/ACT541 are non-inverting 3-state buffers having two active-LOW output enables. The CD74AC540, -541, and CD74ACT540, -541 are supplied in 20-lead dual-in-line plastic packages (E suffix) and in 20-lead dual-in-line small-outline plastic packages (M suffix). Both package types are operable over the following temperature ranges: Industrial (–40 to +85°C) and Extended Industrial/Military (–55 to +125°C). The CD54AC540, -541, and CD54ACT540, -541, available in chip form (H suffix), are operable over the –55 to +125°C temperature range. L H Z Copyright  1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MAXIMUM RATINGS, Absolute-Maximum Values: DC SUPPLY-VOLTAGE (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 to 6 V DC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA DC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC VCC OR GROUND CURRENT (ICC or IGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA* PACKAGE THERMAL IMPEDANCE, θJA (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to +150°C LEAD TEMPERATURE (DURING SOLDERING): At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°C Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . +300°C * For up to 4 outputs per device: add ±25 mA for each additional output. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD54AC541F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54AC541F3A CD54ACT540F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54ACT540F3A CD54ACT541F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54ACT541F3A CD74AC540M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC540M CD74AC540M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM CD74AC540ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC540M CD74AC541E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74AC541E CD74AC541EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74AC541E CD74AC541M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC541M CD74AC541M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC541M CD74AC541M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC541M CD74AC541M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC541M CD74AC541SM96 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC541SM CD74ACT540E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT540E CD74ACT540M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT540M CD74ACT540M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT540M CD74ACT540M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT540M Addendum-Page 1 AC540M Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Feb-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74ACT540MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT540M CD74ACT541E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT541E CD74ACT541EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT541E CD74ACT541M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541M CD74ACT541M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541M CD74ACT541M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541M CD74ACT541M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541M CD74ACT541MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541M CD74ACT541SM96 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541SM CD74ACT541SM96E4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT541SM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of