CD74AC240M

Data sheet acquired from Harris Semiconductor SCHS287B − Revised January 2004 The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE) and one active-HIGH (2OE) output enable. The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M and M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and the CD74ACT241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline packages (M and M96 suffixes), and 20-lead shrink small-outline packages (SM96 suffix). These package types are operable over the following temperature ranges: Commerical (0 to 705C); Industrial (−40 to +855C); and Extended Industrial/Military (−55 to + 1255C). The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241, and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic packages (F3A suffix) and are operable over the −55 to +1255C temperature range. This data sheet is applicable to the CD54/74AC240, CD54ACT240, and CD54/74ACT241. The CD54/74AC241 were not acquired from Harris Semiconductor. See SCHS244 for information on the CD74ACT240, CD74AC244, and CD74ACT244. Copyright  2004, Texas Instruments Incorporated For TA = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW For TA = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW For TA = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW OPERATING-TEMPERATURE RANGE (TA): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C LEAD TEMPERATURE (DURING SOLDERING): At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C * For up to 4 outputs per device: add ± 25 mA for each additional output. LIMITS CHARACTERISTIC Supply-Voltage Range, VCC*: (For TA = Full Package-Temperature Range) AC Types ACT Types DC Input or Output Voltage, VI, Vo Operating Temperature, TA Input Rise and Fall Slew Rate, dt/dv at 1.5 V to 3 V (AC Types) at 3.6 v to 5.5 V (AC Types) at 4.5 V to 5.5 V (ACT Types) * Unless otherwise specified, all voltages are referenced to ground. CD54 CD74 UNITS MIN. MAX. 1.5 4.5 5.5 5.5 V V 0 V -55 -40 VCC +125 +85 0 0 0 50 20 10 °C ns/V ns/V ns/V PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD54AC240F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54AC240F3A CD54AC244F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54AC244F3A CD54ACT240F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54ACT240F3A CD54ACT241F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54ACT241F3A CD54ACT244F3A ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type -55 to 125 CD54ACT244F3A CD74AC240E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74AC240E CD74AC240EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74AC240E CD74AC240M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC240M CD74AC240M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC240M CD74AC244E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74AC244E CD74AC244M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC244M CD74AC244M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 AC244M CD74ACT240E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT240E CD74ACT240M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT240M CD74ACT240M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT240M CD74ACT240M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT240M CD74ACT241E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT241E CD74ACT241M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT241M Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Feb-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74ACT244E ACTIVE PDIP N 20 20 Pb-Free (RoHS) NIPDAU N / A for Pkg Type -55 to 125 CD74ACT244E CD74ACT244M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT244M CD74ACT244M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -55 to 125 ACT244M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of