ICL3241EIB

ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E ® Data Sheet September 15, 2008 ±15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transmitters/Receivers FN4910.20 Features • ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000) The Intersil ICL32xxE devices are 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Additionally, they provide ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with manual and automatic power-down functions (except for the ICL3232E), reduce the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This family is fully compatible with 3.3V-only systems, mixed 3.3V and 5.0V systems, and 5.0V-only systems. The ICL324XE are 3-driver, 5-receiver devices that provide a complete serial port suitable for laptop or notebook computers. Both devices also include noninverting always-active receivers for “wake-up” capability. The ICL3221E, ICL3223E and ICL3243E, feature an automatic power-down function which powers down the on-chip power-supply and driver circuits. This occurs when an attached peripheral device is shut off or the RS-232 cable is removed, conserving system power automatically without changes to the hardware or operating system. These devices power up again when a valid RS-232 voltage is applied to any receiver input. Table 1 summarizes the features of the devices represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32xxE 3V family. • Drop in Replacements for MAX3221E, MAX3222E, MAX3223E, MAX3232E, MAX3241E, MAX3243E, SP3243E • ICL3221E is a Low Power, Pin Compatible Upgrade for 5V MAX221E • ICL3222E is a Low Power, Pin Compatible Upgrade for 5V MAX242E, and SP312E • ICL3232E is a Low Power Upgrade for HIN232E, ICL232 and Pin Compatible Competitor Devices • RS-232 Compatible with VCC = 2.7V • Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V • Latch-Up Free • On-Chip Voltage Converters Require Only Four External 0.1µF Capacitors • Manual and Automatic Power-down Features • Guaranteed Mouse Driveability (ICL324XE Only) • Receiver Hysteresis For Improved Noise Immunity • Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps • Wide Power Supply Range . . . . . . . Single +3V to +5.5V • Low Supply Current in Power-down State . . . . . . . . . .1µA • Pb-Free Available (RoHS Compliant) Applications • Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones Related Literature • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” TABLE 1. SUMMARY OF FEATURES PART NUMBER NUMBER NUMBER OF Tx OF Rx NUMBER OF MONITOR RECEIVERS (ROUTB) DATA RATE (kbps) RECEIVER ENABLE FUNCTION? READY OUTPUT? AUTOMATIC POWER-DOWN MANUAL FUNCTION? POWER-DOWN? ICL3221E 1 1 0 250 Yes No Yes ICL3222E 2 2 0 250 Yes No Yes No ICL3223E 2 2 0 250 Yes No Yes Yes ICL3232E 2 2 0 250 No No No No ICL3241E 3 5 2 250 Yes No Yes No ICL3243E 3 5 1 250 No No Yes Yes 1 Yes CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000-2005, 2007, 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Ordering Information PART NUMBER PART MARKING TEMP RANGE (°C) PKG. DWG. # PACKAGE ICL3221ECA* ICL 3221ECA 0 to +70 16 Ld SSOP M16.209 ICL3221ECAZ* (Note) ICL32 21ECAZ 0 to +70 16 Ld SSOP (Pb-free) M16.209 ICL3221ECAZA* (Note) ICL32 21ECAZ 0 to +70 16 Ld SSOP (Pb-free) M16.209 ICL3221ECV* 3221 ECV 0 to +70 16 Ld TSSOP M16.173 ICL3221ECVZ* (Note) 3221 ECVZ 0 to +70 16 Ld TSSOP (Pb-free) M16.173 ICL3221EIA* ICL 3221EIA -40 to +85 16 Ld SSOP M16.209 ICL3221EIAZ* (Note) ICL32 21EIAZ -40 to +85 16 Ld SSOP (Pb-free) M16.209 ICL3221EIV* 3221 EIV -40 to +85 16 Ld TSSOP M16.173 ICL3221EIVZ* (Note) 3221 EIVZ -40 to +85 16 Ld TSSOP (Pb-free) M16.173 ICL3222ECA* ICL 3222ECA 0 to +70 20 Ld SSOP M20.209 ICL3222ECAZ* (Note) ICL32 22ECAZ 0 to +70 20 Ld SSOP (Pb-free) M20.209 ICL3222ECP ICL3222ECP 0 to +70 18 Ld PDIP E18.3 ICL3222ECV* ICL 3222ECV 0 to +70 20 Ld TSSOP M20.173 ICL3222ECVZ* (Note) ICL32 22ECVZ 0 to +70 20 Ld TSSOP (Pb-free) M20.173 ICL3222EIA* ICL 3222EIA -40 to +85 20 Ld SSOP M20.209 ICL3222EIAZ* (Note) ICL32 22EIAZ -40 to +85 20 Ld SSOP (Pb-free) M20.209 ICL3222EIB* ICL3222EIB -40 to +85 18 Ld SOIC M18.3 ICL3222EIBZ* (Note) 3222EIBZ -40 to +85 18 Ld SOIC (Pb-free) M18.3 ICL3222EIV* ICL 3222EIV -40 to +85 20 Ld TSSOP M20.173 ICL3222EIVZ* (Note) ICL32 22EIVZ -40 to +85 20 Ld TSSOP (Pb-free) M20.173 ICL3223ECA* ICL 3223ECA 0 to +70 20 Ld SSOP M20.209 ICL3223ECAZ* (Note) ICL32 23ECAZ 0 to +70 20 Ld SSOP (Pb-free) M20.209 ICL3223ECV* ICL 3223ECV 0 to +70 20 Ld TSSOP M20.173 ICL3223ECVZ* (Note) ICL32 23ECVZ 0 to +70 20 Ld TSSOP (Pb-free) M20.173 ICL3223EIA* ICL 3223EIA -40 to +85 20 Ld SSOP M20.209 ICL3223EIAZ* (Note) ICL32 23EIAZ -40 to +85 20 Ld SSOP (Pb-free) M20.209 ICL3223EIV* ICL 3223EIV -40 to +85 20 Ld TSSOP M20.173 ICL3223EIVZ* (Note) ICL32 23EIVZ -40 to +85 20 Ld TSSOP (Pb-free) M20.173 ICL3232ECA* ICL 3232ECA 0 to +70 16 Ld SSOP M16.209 ICL3232ECAZ* (Note) 3232 ECAZ 0 to +70 16 Ld SSOP (Pb-free) M16.209 ICL3232ECB* ICL3232ECB 0 to +70 16 Ld SOIC M16.3 ICL3232ECBZ* (Note) 3232ECBZ 0 to +70 16 Ld SOIC (Pb-free) M16.3 ICL3232ECBN* 3232ECBN 0 to +70 16 Ld SOIC M16.15 ICL3232ECBNZ* (Note) 3232ECBNZ 0 to +70 16 Ld SOIC (Pb-free) M16.15 ICL3232ECV-16* 3232E CV-16 0 to +70 16 Ld TSSOP M16.173 ICL3232ECV-16Z* (Note) 3232E CV-16Z 0 to +70 16 Ld TSSOP (Pb-free) M16.173 ICL3232ECV-20* ICL3232 ECV-20 0 to +70 20 Ld TSSOP M20.173 ICL3232ECV-20Z *(Note) ICL3232 ECV-20Z 0 to +70 20 Ld TSSOP (Pb-free) M20.173 ICL3232EIA* ICL3232 EIA -40 to +85 16 Ld SSOP M16.209 ICL3232EIAZ* (Note) 3232 EIAZ -40 to +85 16 Ld SSOP (Pb-free) M16.209 2 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Ordering Information (Continued) PART NUMBER PART MARKING TEMP RANGE (°C) PKG. DWG. # PACKAGE ICL3232EIB* ICL3232EIB -40 to +85 16 Ld SOIC M16.3 ICL3232EIBZ* (Note) 3232EIBZ -40 to +85 16 Ld SOIC (Pb-free) M16.3 ICL3232EIBNZ* (Note) 3232EIBNZ -40 to +85 16 Ld SOIC (Pb-free) M16.15 ICL3232EIV-16* 3232E IV-16 -40 to +85 16 Ld TSSOP M16.173 ICL3232EIV-16Z* (Note) 3232E IV-16Z -40 to +85 16 Ld TSSOP (Pb-free) M16.173 ICL3232EIV-20* ICL3232 EIV-20 -40 to +85 20 Ld TSSOP M20.173 ICL3232EIV-20Z* (Note) ICL3232 EIV-20Z -40 to +85 20 Ld TSSOP (Pb-free) M20.173 ICL3241ECA* ICL 3241ECA 0 to +70 28 Ld SSOP M28.209 ICL3241ECAZ* (Note) ICL3241 ECAZ 0 to +70 28 Ld SSOP (Pb-free) M28.209 ICL3241ECB* ICL3241ECB 0 to +70 28 Ld SOIC M28.3 ICL3241ECBZ* (Note) ICL3241ECBZ 0 to +70 28 Ld SOIC (Pb-free) M28.3 ICL3241ECV* ICL3241 ECV 0 to +70 28 Ld TSSOP M28.173 ICL3241ECVZ* (Note) ICL3241 ECVZ 0 to +70 28 Ld TSSOP (Pb-free) M28.173 ICL3241EIA* ICL 3241EIA -40 to +85 28 Ld SSOP M28.209 ICL3241EIAZ* (Note) ICL3241 EIAZ -40 to +85 28 Ld SSOP (Pb-free) M28.209 ICL3241EIB* ICL3241EIB -40 to +85 28 Ld SOIC M28.3 ICL3241EIBZ* (Note) ICL3241EIBZ -40 to +85 28 Ld SOIC (Pb-free) M28.3 ICL3241EIV* ICL3241 EIV -40 to +85 28 Ld TSSOP M28.173 ICL3241EIVZ* (Note) ICL3241 EIVZ -40 to +85 28 Ld TSSOP (Pb-free) M28.173 ICL3243ECA* ICL 3243ECA 0 to +70 28 Ld SSOP M28.209 ICL3243ECAZ* (Note) ICL32 43ECAZ 0 to +70 28 Ld SSOP (Pb-free) M28.209 ICL3243ECB* ICL3243ECB 0 to +70 28 Ld SOIC M28.3 ICL3243ECBZ* (Note) ICL3243ECBZ 0 to +70 28 Ld SOIC (Pb-free) M28.3 ICL3243ECV* ICL3243 ECV 0 to +70 28 Ld TSSOP M28.173 ICL3243ECVZA* (Note) ICL3243 ECVZ 0 to +70 28 Ld TSSOP (Pb-free) M28.173 ICL3243ECVZ* (Note) ICL3243 ECVZ 0 to +70 28 Ld TSSOP (Pb-free) M28.173 ICL3243EIA* ICL 3243EIA -40 to +85 28 Ld SSOP M28.209 ICL3243EIAZ* (Note) ICL32 43EIAZ -40 to +85 28 Ld SSOP (Pb-free) M28.209 ICL3243EIV* ICL3243 EIV -40 to +85 28 Ld TSSOP M28.173 ICL3243EIVZ* (Note) ICL3243 EIVZ -40 to +85 28 Ld TSSOP (Pb-free) M28.173 *Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Pinouts ICL3222E (18 LD PDIP, SOIC) TOP VIEW ICL3221E (16 LD SSOP, TSSOP) TOP VIEW 16 FORCEOFF EN 1 EN 1 18 SHDN C1+ 2 15 VCC C1+ 2 17 VCC V+ 3 14 GND V+ 3 16 GND C1- 4 13 T1OUT C1- 4 15 T1OUT C2+ 5 12 FORCEON C2+ 5 14 R1IN C2- 6 11 T1IN C2- 6 13 R1OUT 10 INVALID V- 7 9 R1OUT R1IN 8 V- 7 12 T1IN T2OUT 8 11 T2IN R2IN 9 ICL3222E (20 LD SSOP, TSSOP) TOP VIEW 20 SHDN EN 1 C1+ 2 19 VCC V+ 3 18 GND 10 R2OUT ICL3223E (20 LD SSOP, TSSOP) TOP VIEW EN 1 20 FORCEOFF C1+ 2 19 VCC V+ 3 18 GND C1- 4 17 T1OUT C1- 4 17 T1OUT C2+ 5 16 R1IN C2+ 5 16 R1IN C2- 6 15 R1OUT C2- 6 15 R1OUT 14 NC V- 7 V- 7 14 FORCEON T2OUT 8 13 T1IN T2OUT 8 13 T1IN R2IN 9 12 T2IN R2IN 9 12 T2IN 11 NC R2OUT 10 R2OUT 10 11 INVALID ICL3232E (20 LD TSSOP-20) TOP VIEW ICL3232E (16 LD SOIC, SSOP, TSSOP-16) TOP VIEW C1+ 1 16 VCC NC 1 V+ 2 15 GND C1+ 2 19 VCC V+ 3 18 GND 20 NC C1- 3 14 T1OUT C2+ 4 13 R1IN C1- 4 17 T1OUT C2- 5 12 R1OUT C2+ 5 16 R1IN V- 6 11 T1IN C2- 6 15 R1OUT T2OUT 7 10 T2IN V- 7 14 T1IN T2OUT 8 13 T2IN 9 R2OUT R2IN 8 R2IN 9 NC 10 4 12 R2OUT 11 NC FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Pinouts (Continued) ICL3243E (28 LD SOIC, SSOP, TSSOP) TOP VIEW ICL3241E (28 LD SOIC, SSOP, TSSOP) TOP VIEW C2+ 1 28 C1+ C2+ 1 28 C1+ C2- 2 27 V+ C2- 2 27 V+ V- 3 26 VCC V- 3 26 VCC R1IN 4 25 GND R1IN 4 25 GND R2IN 5 24 C1- R2IN 5 24 C1- R3IN 6 23 EN R3IN 6 23 FORCEON R4IN 7 22 SHDN R4IN 7 22 FORCEOFF R5IN 8 21 R1OUTB R5IN 8 21 INVALID T1OUT 9 20 R2OUTB T1OUT 9 20 R2OUTB T2OUT 10 19 R1OUT T2OUT 10 19 R1OUT T3OUT 11 18 R2OUT T3OUT 11 18 R2OUT T3IN 12 17 R3OUT T3IN 12 17 R3OUT T2IN 13 16 R4OUT T2IN 13 16 R4OUT T1IN 14 15 R5OUT T1IN 14 15 R5OUT Pin Descriptions PIN VCC FUNCTION System power supply input (3.0V to 5.5V). V+ Internally generated positive transmitter supply (+5.5V). V- Internally generated negative transmitter supply (-5.5V). GND Ground connection. C1+ External capacitor (voltage doubler) is connected to this lead. C1- External capacitor (voltage doubler) is connected to this lead. C2+ External capacitor (voltage inverter) is connected to this lead. C2- External capacitor (voltage inverter) is connected to this lead. TIN TTL/CMOS compatible transmitter Inputs. TOUT RIN ROUT ±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs. ±15kV ESD Protected, RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. ROUTB TTL/CMOS level, noninverting, always enabled receiver outputs. INVALID Active low output that indicates if no valid RS-232 levels are present on any receiver input. EN SHDN Active low receiver enable control; doesn’t disable ROUTB outputs. Active low input to shut down transmitters and on-board power supply, to place device in low power mode. FORCEOFF Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (see Table 2). FORCEON Active high input to override automatic power-down circuitry thereby keeping transmitters active (FORCEOFF must be high). 5 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Typical Operating Circuits ICL3221E + + C3 (OPTIONAL CONNECTION, NOTE) +3.3V 0.1µF 15 2 + C1+ 4 C15 + C2+ 6 C2- C1 0.1µF C2 0.1µF T1IN TTL/CMOS LOGIC LEVELS R1OUT VCC 3 V- 7 C4 + 0.1µF T1 11 + C3 0.1µF V+ 13 9 T1OUT 8 R1IN RS-232 LEVELS 5kΩ R1 1 EN 16 VCC FORCEOFF 12 FORCEON GND INVALID 10 TO POWER CONTROL LOGIC 14 NOTE: The negative terminal of C3 can be connected to either VCC or GND ICL3222E C3 (OPTIONAL CONNECTION, NOTE) C1 0.1µF C2 0.1µF T1IN T2IN TTL/CMOS LOGIC LEVELS R1OUT + 0.1µF 2 + 4 5 + 6 + +3.3V 17 C1+ VCC 3 V+ C1C2+ V- C2- 12 11 + C3 0.1µF 7 + T1 15 T2 C4 0.1µF T1OUT 8 T2OUT 14 13 R1IN RS-232 LEVELS 5kΩ R1 9 10 R2OUT R2IN 1 EN 5kΩ R2 SHDN 18 VCC GND 16 NOTE: The negative terminal of C3 can be connected to either VCC or GND 6 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Typical Operating Circuits (Continued) ICL3223E +3.3V + 0.1µF 2 + 4 C1 0.1µF 5 + 6 C2 0.1µF T1IN T2IN TTL/CMOS LOGIC LEVELS R1OUT R2OUT 19 C1+ VCC C1C2+ C2- 3 + C3 0.1µF V- 7 C4 0.1µF + V+ T1 13 17 T2 12 8 15 5kΩ R2 5kΩ 10 1 9 EN FORCEOFF 14 T2OUT 16 R1 INVALID FORCEON T1OUT R1IN RS-232 LEVELS R2IN 20 11 VCC TO POWER CONTROL LOGIC GND 18 ICL3232E C1 0.1µF C2 0.1µF T1IN TTL/CMOS LOGIC LEVELS T2IN R1OUT + 0.1µF 1 + 3 4 + 5 11 10 C1+ + C3 (OPTIONAL CONNECTION, NOTE) +3.3V 16 VCC V+ C1C2+ V- C2T1 2 + C3 0.1µF 6 C4 0.1µF + 14 T2 T1OUT 7 T2OUT 13 12 R1 R1IN RS-232 LEVELS 5kΩ 9 8 R2OUT R2 R2IN 5kΩ GND 15 NOTE: The negative terminal of C3 can be connected to either VCC or GND 7 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Typical Operating Circuits (Continued) ICL3241E +3.3V + C1 0.1µF C2 0.1µF T1IN ICL3243E +3.3V 0.1µF 28 + 24 1 + 2 + C1+ VCC V+ C1C2+ V- C2- T1 14 3 C4 0.1µF + + C2 0.1µF C11 C2+ + 2 C2- C1+ 26 27 VCC + V+ 24 VT1 3 T2OUT RS-232 LEVELS T2IN 11 13 10 T2OUT T3 20 RS-232 LEVELS 11 T3IN R1OUTB C4 0.1µF + T1OUT T2 12 T3OUT 21 C3 0.1µF 9 T1IN 10 T3IN T3OUT 20 R2OUTB R2OUTB 19 4 R1OUT R1 18 17 R1IN R1 TTL/CMOS LOGIC LEVELS R2IN 5kΩ 18 16 R2IN RS-232 LEVELS R4 17 15 R3IN EN 5kΩ R5 R4IN R4 R5IN 5kΩ 15 8 R5OUT R5IN 23 5kΩ R5 FORCEON GND 25 VCC TO POWER CONTROL LOGIC 8 RS-232 LEVELS 7 R4OUT 22 SHDN 5kΩ 16 8 R5OUT 6 R3 R4IN 5kΩ 5kΩ R3OUT 7 R4OUT 5 R2 R3IN 5kΩ R3 5kΩ R2OUT 6 R3OUT 4 R1OUT 5 R2 23 19 R1IN 5kΩ R2OUT VCC 28 C1 0.1µF 14 T1OUT T3 12 + C3 0.1µF 9 T2 13 27 T2IN TTL/CMOS LOGIC LEVELS 0.1µF 26 22 FORCEOFF 21 INVALID GND 25 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Absolute Maximum Ratings Thermal Information VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, FORCEOFF, FORCEON, EN, SHDN . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V ROUT, INVALID. . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical, Note 1) Operating Conditions θJA (°C/W) 18 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . 80 16 Ld Wide SOIC Package . . . . . . . . . . . . . . . . . . . 100 16 Ld Narrow SOIC Package. . . . . . . . . . . . . . . . . . 115 18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 122 16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 145 20 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 140 28 Ld SSOP and TSSOP Packages . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Temperature Range ICL32xxECX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C ICL32xxEIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified. Typicals are at TA = +25°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Note 3) TYP MAX (Note 3) UNITS DC CHARACTERISTICS Supply Current, Automatic Power-down All RIN Open, FORCEON = GND, FORCEOFF = VCC (ICL3221E, ICL3223E, ICL3243E Only) 25 - 1.0 10 µA Supply Current, Power-down FORCEOFF = SHDN = GND (Except ICL3232E) 25 - 1.0 10 µA Supply Current, Automatic Power-down Disabled VCC = 3.0V, ICL3241, All Outputs Unloaded, FORCEON = FORCEOFF = ICL3243 SHDN = VCC VCC = 3.0V, ICL3223 25 - 0.3 1.0 mA 25 - 0.7 3.0 mA 25 - 0.3 1.0 mA VCC = 3.15V, ICL3221, ICL3222, ICL3223, ICL3232 LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low TIN, FORCEON, FORCEOFF, EN, SHDN Full - - 0.8 V Input Logic Threshold High TIN, FORCEON, FORCEOFF, EN, SHDN VCC = 3.3V Full 2.0 - - V VCC = 5.0V Full 2.4 - - V Input Leakage Current TIN, FORCEON, FORCEOFF, EN, SHDN Full - ±0.01 ±1.0 µA Output Leakage Current (Except ICL3232E) FORCEOFF = GND or EN = VCC Full - ±0.05 ±10 µA Output Voltage Low IOUT = 1.6mA Full - - 0.4 V Output Voltage High IOUT = -1.0mA Full VCC - 0.6 VCC - 0.1 - V AUTOMATIC POWER-DOWN (ICL3221E, ICL3223E, ICL3243E Only, FORCEON = GND, FORCEOFF = VCC) Receiver Input Thresholds to Enable Transmitters ICL32xxE Powers Up (see Figure 6) Full -2.7 - 2.7 V Receiver Input Thresholds to Disable Transmitters ICL32xxE Powers Down (see Figure 6) Full -0.3 - 0.3 V INVALID Output Voltage Low IOUT = 1.6mA Full - - 0.4 V INVALID Output Voltage High IOUT = -1.0mA Full VCC - 0.6 - - V 9 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Electrical Specifications Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified. Typicals are at TA = +25°C. (Continued) TEMP (°C) MIN (Note 3) TYP Receiver Threshold to Transmitters Enabled Delay (tWU) 25 - 100 - µs Receiver Positive or Negative Threshold to INVALID High Delay (tINVH) 25 - 1 - µs Receiver Positive or Negative Threshold to INVALID Low Delay (tINVL) 25 - 30 - µs 25 -25 - 25 V 1.2 - V PARAMETER TEST CONDITIONS MAX (Note 3) UNITS RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V 25 0.6 VCC = 5.0V 25 0.8 1.5 - V Input Threshold High VCC = 3.3V 25 - 1.5 2.4 V VCC = 5.0V 25 - 1.8 2.4 V Input Hysteresis 25 - 0.5 - V Input Resistance 25 3 5 7 kΩ TRANSMITTER OUTPUTS Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V Output Resistance VCC = V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω Full - ±35 ±60 mA Full - - ±25 µA T1IN = T2IN = GND, T3IN = VCC, T3OUT Loaded with 3kΩ to GND, T1OUT and T2OUT Loaded with 2.5mA Each Full ±5 - - V Maximum Data Rate RL = 3kΩ, CL = 1000pF, One Transmitter Switching Full 250 500 - kbps Receiver Propagation Delay Receiver Input to Receiver Output, CL = 150pF tPHL 25 - 0.15 - µs tPLH 25 - 0.15 - μs Output Short-Circuit Current VOUT = ±12V, VCC = 0V or 3V to 5.5V, Automatic Power-down or FORCEOFF = SHDN = GND Output Leakage Current MOUSE DRIVEABILITY (ICL324XE Only) Transmitter Output Voltage (see Figure 9) TIMING CHARACTERISTICS Receiver Output Enable Time Normal Operation (Except ICL3232E) 25 - 200 - ns Receiver Output Disable Time Normal Operation (Except ICL3232E) 25 - 200 - ns Transmitter Skew tPHL to tPLH (Note 2) 25 - 100 - ns Receiver Skew tPHL to tPLH 25 - 50 - ns Transition Region Slew Rate CL = 150pF to 2500pF VCC = 3.3V, RL = 3kΩ to 7kΩ, CL = 150pF to 1000pF Measured from 3V to -3V or -3V to 3V 25 4 - 30 V/μs 25 6 - 30 V/μs ESD PERFORMANCE RS-232 Pins (TOUT, RIN) All Other Pins Human Body Model 25 - ±15 - kV IEC61000-4-2 Contact Discharge 25 - ±8 - kV IEC61000-4-2 Air Gap Discharge 25 - ±15 - kV Human Body Model 25 - ±2 - kV NOTES: 2. Transmitter skew is measured at the transmitter zero crossing points. 3. Parts are 100% tested at +25°C. Full temp limits are guaranteed by bench and tester characterization 10 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Detailed Description ICL32xxE interface ICs operate from a single +3V to +5.5V supply, guarantee a 250kbps minimum data rate, require only four small external 0.1µF capacitors, feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: charge pump, transmitters and receivers. Charge-Pump Intersil’s new ICL32xxE family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See “Capacitor Selection” on page 14 and Table 3 on page 14 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings. Transmitters The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. Except for the ICL3232E, all transmitter outputs disable and assume a high impedance state when the device enters the power-down mode (see Table 2). These outputs may be driven to ±12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3kΩ and 1000pF), VCC ≥ 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one transmitter easily operates at 900kbps. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance. Receivers All the ICL32xxE devices contain standard inverting receivers that three-state (except for the ICL3232E) via the EN or FORCEOFF control lines. Additionally, the two ICL324XE products include noninverting (monitor) receivers (denoted by the ROUTB label) that are always active, regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3kW to 7kW input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers’ Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. 11 The ICL3221E, ICL3222E, ICL3223E, ICL3241E inverting receivers disable only when EN is driven high. ICL3243E receivers disable during forced (manual) power-down, but not during automatic power-down (see Table 2). ICL3241E and ICL3243E monitor receivers remain active even during manual power-down and forced receiver disable, making them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral’s protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in Figure 3. VCC RXIN -25V ≤ VRIN ≤ +25V RXOUT 5kΩ GND ≤ VROUT ≤ VCC GND FIGURE 1. INVERTING RECEIVER CONNECTIONS Low Power Operation These 3V devices require a nominal supply current of 0.3mA, even at VCC = 5.5V, during normal operation (not in power-down mode). This is considerably less than the 5mA to 11mA current required by comparable 5V RS-232 devices, allowing users to reduce system power simply by switching to this new family. Pin Compatible Replacements for 5V Devices The ICL3221E, ICL3222E, ICL3232E are pin compatible with existing 5V RS-232 transceivers - See the “Features” section on page 1 for details. This pin compatibility coupled with the low ICC and wide operating supply range, make the ICL32xxE potential lower power, higher performance drop-in replacements for existing 5V applications. As long as the ±5V RS-232 output swings are acceptable, and transmitter input pull-up resistors aren’t required, the IICL32xxE should work in most 5V applications. When replacing a device in an existing 5V application, it is acceptable to terminate C3 to VCC as shown on the “Typical Operating Circuits” on page 6. Nevertheless, terminate C3 to GND if possible, as slightly better performance results from this configuration. Power-down Functionality (Except ICL3232E) The already low current requirement drops significantly when the device enters power-down mode. In power-down, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to VCC, V- collapses to GND), and the transmitter outputs three-state. Inverting receiver outputs may or may not disable in power-down; refer to Table 2 for details. This micro-power mode makes these devices ideal for battery powered and portable applications. FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Software Controlled (Manual) Power-down The ICL3221E, ICL3223E, and ICL3243E utilize a two pin approach where the FORCEON and FORCEOFF inputs determine the IC’s mode. For always enabled operation, FORCEON and FORCEOFF are both strapped high. To switch between active and power-down modes, under logic or software control, only the FORCEOFF input need be driven. The FORCEON state isn’t critical, as FORCEOFF dominates over FORCEON. Nevertheless, if strictly manual control over power-down is desired, the user must strap FORCEON high to disable the automatic power-down circuitry. ICL3243E inverting (standard) receiver outputs also disable when the device is in manual power-down, thereby eliminating the possible current path through a shutdown peripheral’s input protection diode (see Figures 2 and 3). Most devices in the ICL32xxE family provide pins that allow the user to force the IC into the low power, standby state. On the ICL3222E and ICL3241E, the power-down control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into its power-down state. Connect SHDN to VCC if the power-down function isn’t needed. Note that all the receiver outputs remain enabled during shutdown (see Table 2). For the lowest power consumption during power-down, the receivers should also be disabled by driving the EN input high (see next section, and Figures 2 and 3). TABLE 2. POWER-DOWN AND ENABLE LOGIC TRUTH TABLE RS-232 SIGNAL PRESENT AT RECEIVER INPUT? FORCEOFF ROUTB OR SHDN FORCEON EN TRANSMITTER RECEIVER OUTPUTS INVALID INPUT INPUT INPUT OUTPUTS OUTPUTS (NOTE 4) OUTPUT MODE OF OPERATION ICL3222E, ICL3241E N/A L N/A L High-Z Active Active N/A Manual Power-down N/A L N/A H High-Z High-Z Active N/A Manual Power-down with Receiver Disabled N/A H N/A L Active Active Active N/A Normal Operation N/A H N/A H Active High-Z Active N/A Normal Operation withReceiver Disabled ICL3221E, ICL3223E No H H L Active Active N/A L No H H H Active High-Z N/A L Normal Operation (Auto Power-down Disabled) Yes H L L Active Active N/A H Yes H L H Active High-Z N/A H No H L L High-Z Active N/A L No H L H High-Z High-Z N/A L Yes L X L High-Z Active N/A H Manual Power-down Yes L X H High-Z High-Z N/A H Manual Power-down with Receiver Disabled No L X L High-Z Active N/A L Manual Power-down No L X H High-Z High-Z N/A L Manual Power-down with Receiver Disabled No H H N/A Active Active Active L Normal Operation (Auto Power-down Disabled) Yes H L N/A Active Active Active H Normal Operation (Auto Power-down Enabled) No H L N/A High-Z Active Active L Power-down Due to Auto Power-down Logic Yes L X N/A High-Z High-Z Active H Manual Power-down No L X N/A High-Z High-Z Active L Manual Power-down Normal Operation (Auto Power-down Enabled) Power-down Due to Auto Power-down Logic ICL3243E NOTE: 4. Applies only to the ICL3241E and ICL3243E. 12 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E The INVALID output always indicates whether or not a valid RS-232 signal is present at any of the receiver inputs (see Table 2), giving the user an easy way to determine when the interface block should power down. In the case of a disconnected interface cable where all the receiver inputs are floating (but pulled to GND by the internal receiver pull down resistors), the INVALID logic detects the invalid levels and drives the output low. The power management logic then uses this indicator to power down the interface block. Reconnecting the cable restores valid levels at the receiver inputs, INVALID switches high, and the power management logic wakes up the interface block. INVALID can also be used to indicate the DTR or RING INDICATOR signal, as long as the other receiver inputs are floating, or driven to GND (as in the case of a powered down driver). Connecting FORCEOFF and FORCEON together disables the automatic power-down feature, enabling them to function as a manual SHUTDOWN input (see Figure 4). VCC VCC VOUT = VCC Rx POWERED DOWN UART Tx SHDN = GND GND FORCEON INVALID ICL3221E, ICL3223E, ICL3243E I/O UART CPU FIGURE 4. CONNECTIONS FOR MANUAL POWER-DOWN WHEN NO VALID RECEIVER SIGNALS ARE PRESENT With any of the control schemes, the time required to exit power-down, and resume transmission is only 100µs. A mouse, or other application, may need more time to wake up from shutdown. If automatic power-down is being utilized, the RS-232 device will reenter power-down if valid receiver levels aren’t reestablished within 30µs of the ICL32xxE powering up. Figure 5 illustrates a circuit that keeps the ICL32xxE from initiating automatic power-down for 100ms after powering up. This gives the slow-to-wake peripheral circuit time to reestablish valid RS-232 output levels. CURRENT FLOW VCC FORCEOFF PWR MGT LOGIC OLD RS-232 CHIP FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL POWER MANAGEMENT UNIT MASTER POWER-DOWN LINE 0.1µF FORCEOFF VCC FIGURE 5. CIRCUIT TO PREVENT AUTO POWER-DOWN FOR 100ms AFTER FORCED POWERUP ICL324XE Automatic Power-down (ICL3221E, ICL3223E, ICL3243E Only) VCC R2OUTB RX POWERED DOWN UART VOUT = HI-Z R2OUT TX R2IN T1IN T1OUT FORCEOFF = GND OR SHDN = GND, EN = VCC FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN 13 FORCEON ICL3221E, ICL3223E, ICL3243E TRANSITION DETECTOR TO WAKE-UP LOGIC 1MΩ Even greater power savings is available by using the devices which feature an automatic power-down function. When no valid RS-232 voltages (see Figure 6) are sensed on any receiver input for 30µs, the charge pump and transmitters power-down, thereby reducing supply current to 1µA. Invalid receiver levels occur whenever the driving peripheral’s outputs are shut off (powered down) or when the RS-232 interface cable is disconnected. The ICL32xxE powers back up whenever it detects a valid RS-232 voltage level on any receiver input. This automatic power-down feature provides additional system power savings without changes to the existing operating system. FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E VALID RS-232 LEVEL - ICL32xxE IS ACTIVE 2.7V INDETERMINATE - POWER-DOWN MAY OR MAY NOT OCCUR 0.3V INVALID LEVEL - POWER-DOWN OCCURS AFTER 30µs Capacitor Selection -0.3V INDETERMINATE - POWER-DOWN MAY OR MAY NOT OCCUR -2.7V VALID RS-232 LEVEL - ICL32xxE IS ACTIVE FIGURE 6. DEFINITION OF VALID RS-232 RECEIVER LEVELS Automatic power-down operates when the FORCEON input is low, and the FORCEOFF input is high. Tying FORCEON high disables automatic power-down, but manual powerdown is always available via the overriding FORCEOFF input. Table 2 summarizes the automatic power-down functionality. Devices with the automatic power-down feature include an INVALID output signal, which switches low to indicate that invalid levels have persisted on all of the receiver inputs for more than 30µs (see Figure 7). INVALID switches high 1µs after detecting a valid RS-232 level on a receiver input. INVALID operates in all modes (forced or automatic power-down, or forced on), so it is also useful for systems employing manual power-down circuitry. When automatic power-down is utilized, INVALID = 0 indicates that the ICL32xxE is in power-down mode. The time to recover from automatic power-down mode is typically 100µs. INVALID } REGION RECEIVER INPUTS TRANSMITTER OUTPUTS INVALID OUTPUT (standard) receiver outputs placing them in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (VCC = GND) peripheral (see Figure 2). The enable input has no effect on transmitter nor monitor (ROUTB) outputs. VCC PWR UP AUTOPWDN When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-. TABLE 3. REQUIRED CAPACITOR VALUES VCC (V) C1 (µF) C2, C3, C4 (µF) 3.0 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.1 0.47 Power Supply Decoupling In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC. Operation Down to 2.7V tINVH tINVL 0 The charge pumps require 0.1µF capacitors for 3.3V operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1’s value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). V+ ICL32xxE transmitter outputs meet RS-562 levels (±3.7V), at full data rate, with VCC as low as 2.7V. RS-562 levels typically ensure interoperability with RS-232 devices. VCC Transmitter Outputs when Exiting Power-down 0 V- FIGURE 7. AUTOMATIC POWER-DOWN AND INVALID TIMING DIAGRAMS Receiver ENABLE Control (ICL3221E, ICL3222E, ICL3223E, ICL3241E Only) Several devices also feature an EN input to control the receiver outputs. Driving EN high disables all the inverting 14 Figure 8 shows the response of two transmitter outputs when exiting power-down mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kΩ in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V. FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E . . VCC 5V/DIV + 0.1µF FORCEOFF T1 + C1+ VCC C1- ICL32xxE V+ + C3 C1 2V/DIV + V- C2+ C4 + C2 C2TIN T2 TOUT EN TIME (20µs/DIV) FIGURE 8. TRANSMITTER OUTPUTS WHEN EXITING POWER-DOWN VCC Mouse Driveability 1000pF RIN ROUT VCC = +3.3V C1 - C4 = 0.1µF 5K SHDN OR FORCEOFF FIGURE 10. TRANSMITTER LOOPBACK TEST CIRCUIT The ICL3241E and ICL3243E have been specifically designed to power a serial mouse while operating from low voltage supplies. Figure 9 shows the transmitter output voltages under increasing load current. The on-chip switching regulator ensures the transmitters will supply at least ±5V during worst case conditions (15mA for paralleled V+ transmitters, 7.3mA for single V- transmitter). The Automatic Power-down feature does not work with a mouse, so FORCEOFF and FORCEON should be connected to VCC. 5V/DIV T1IN T1OUT TRANSMITTER OUTPUT VOLTAGE (V) 6 5 R1OUT VOUT+ 4 VCC = +3.3V C1 - C4 = 0.1µF 3 VCC = 3.0V 2 1 5µs/DIV T1 0 FIGURE 11. LOOPBACK TEST AT 120kbps VOUT+ -1 T2 -2 ICL3241E, ICL3243E -3 VCC -4 5V/DIV VOUT - T3 VOUT T1IN -5 -6 0 1 2 3 4 5 6 7 8 9 10 LOAD CURRENT PER TRANSMITTER (mA) FIGURE 9. TRANSMITTER OUTPUT VOLTAGE vs LOAD CURRENT (PER TRANSMITTER, i.e., DOUBLE CURRENT AXIS FOR TOTAL VOUT+ CURRENT) T1OUT High Data Rates The ICL32xxE maintain the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 10 details a transmitter loopback test circuit, and Figure 11 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 12 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver. 15 R1OUT VCC = +3.3V C1 - C4 = 0.1µF 2µs/DIV FIGURE 12. LOOPBACK TEST AT 250kbps FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Interconnection with 3V and 5V Logic The ICL32XX directly interface with 5V CMOS and TTL logic families. Nevertheless, with the ICL32XX at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ICL32XX inputs, but ICL32XX outputs do not reach the minimum VIH for these logic families. See Table 4 for more information. TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES SYSTEM POWER-SUPPLY VCC SUPPLY VOLTAGE (V) VOLTAGE (V) 3.3 3.3 5 5 5 3.3 delivers the charge through a 1.5kΩ current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330Ω limiting resistor. The HBM method determines an IC’s ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV. IEC61000-4-2 Testing COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ICL32XX outputs are incompatible with AC, HC, and CD4000 CMOS inputs. ±15kV ESD Protection All pins on ICL32XX devices include ESD protection structures, but the ICL32xxE family incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latch-up mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V. Human Body Model (HBM) Testing As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester Typical Performance Curves The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV contact discharges on the RS-232 pins. VCC = 3.3V, TA = +25°C. 25 VOUT+ 4 20 SLEW RATE (V/μs) TRANSMITTER OUTPUT VOLTAGE (V) 6 2 1 TRANSMITTER AT 250kbps 1 OR 2 TRANSMITTERS AT 30kbps 0 -2 15 -SLEW +SLEW 10 VOUT - -4 -6 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) FIGURE 13. TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE 16 5 0 1000 2000 3000 LOAD CAPACITANCE (pF) 4000 5000 FIGURE 14. SLEW RATE vs LOAD CAPACITANCE FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Typical Performance Curves VCC = 3.3V, TA = +25°C. (Continued) 45 45 ICL3222E, ICL3223E, ICL3232E ICL3221E 40 40 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 250kbps 35 250kbps 30 25 20 120kbps 15 10 20kbps 35 30 25 120kbps 20 15 20kbps 10 5 5 0 0 0 1000 2000 3000 4000 0 5000 1000 2000 3000 5000 FIGURE 16. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA FIGURE 15. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 45 3.5 NO LOAD ALL OUTPUTS STATIC ICL324XE 40 3.0 250kbps ICL3221E, ICL3222E, ICL3223E, ICL3232E 35 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 4000 LOAD CAPACITANCE (pF) LOAD CAPACITANCE (pF) 30 120kbps 25 20 20kbps 15 2.5 2.0 1.5 1.0 ICL324XE 0.5 ICL324XE 10 0 2000 1000 3000 4000 LOAD CAPACITANCE (pF) FIGURE 17. SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA 5000 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V) FIGURE 18. SUPPLY CURRENT vs SUPPLY VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: ICL3221E: 286 ICL3222E: 338 ICL3223E: 357 ICL3232E: 296 ICL324XE: 464 PROCESS: Si Gate CMOS 17 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Dual-In-Line Plastic Packages (PDIP) N E18.3 (JEDEC MS-001-BC ISSUE D) E1 INDEX AREA 1 2 3 18 LEAD DUAL-IN-LINE PLASTIC PACKAGE N/2 INCHES -B- SYMBOL -AD E BASE PLANE -C- SEATING PLANE A2 A L D1 e B1 D1 eA A1 eC B 0.010 (0.25) M C L C A B S C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . MILLIMETERS MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8, 10 C 0.008 0.014 0.204 0.355 - D 0.845 0.880 21.47 D1 0.005 - 0.13 - 5 22.35 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC 6 eB - 0.430 - 10.92 7 L 0.115 0.150 2.93 3.81 4 N 18 18 9 Rev. 2 11/03 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3 may have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 18 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC - 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 α 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 1.27 BSC H N NOTES: MILLIMETERS 16 0° 16 8° 0° 7 8° Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 19 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Thin Shrink Small Outline Plastic Packages (TSSOP) M16.173 N 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA E 0.25(0.010) M 2 INCHES E1 GAUGE PLANE -B1 B M L 0.05(0.002) -A- SYMBOL MIN MAX MIN MAX NOTES A - 0.043 - 1.10 - 0.05 0.15 - A2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - D 0.193 0.201 4.90 5.10 3 E1 0.169 0.177 4.30 4.50 4 A1 3 A D -C- e α e A2 A1 b 0.10(0.004) M 0.25 0.010 SEATING PLANE c 0.10(0.004) C A M B S 0.002 0.246 L 0.020 α 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E. 0.006 0.026 BSC E N NOTES: MILLIMETERS 0.65 BSC 0.256 6.25 0.028 0.50 16 0o - 6.50 0.70 16 8o 0o 6 7 8o Rev. 1 2/02 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 20 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Small Outline Plastic Packages (SSOP) M16.209 (JEDEC MO-150-AC ISSUE B) N 16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- α e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.233 0.255 5.90 6.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 16 0° - 8.20 - 0.95 6 16 8° 0° 7 8° Rev. 3 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 21 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Small Outline Plastic Packages (SOIC) M16.3 (JEDEC MS-013-AA ISSUE C) N 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e α B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 16 0° 16 8° 0° 7 8° Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 22 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Small Outline Plastic Packages (SOIC) M18.3 (JEDEC MS-013-AB ISSUE C) N 18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.4469 0.4625 11.35 11.75 3 E 0.2914 0.2992 7.40 7.60 4 e α B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 18 0° 18 8° 0° 7 8° Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 23 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Thin Shrink Small Outline Plastic Packages (TSSOP) M20.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M 3 L 0.05(0.002) -A- A D -C- α e A2 A1 b 0.10(0.004) M 0.25 0.010 SEATING PLANE c 0.10(0.004) C A M B S SYMBOL MIN MAX MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.252 0.260 6.40 6.60 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC E 0.246 L 0.0177 N NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E. MILLIMETERS α 0.65 BSC 0.256 6.25 0.0295 0.45 20 0o 6.50 0.75 20 8o 0o 6 7 8o Rev. 1 6/98 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 24 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Shrink Small Outline Plastic Packages (SSOP) M20.209 (JEDEC MO-150-AE ISSUE B) N 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E GAUGE PLANE -B1 2 3 0.25 0.010 SEATING PLANE -A- A D -C- α e C 0.10(0.004) C A M MIN MAX B S MAX NOTES A 0.068 0.078 1.73 1.99 0.002 0.008’ 0.05 0.21 A2 0.066 0.070’ 1.68 1.78 B 0.010’ 0.015 0.25 0.38 C 0.004 0.008 0.09 0.20’ D 0.278 0.289 7.07 7.33 3 E 0.205 0.212 5.20’ 5.38 4 0.026 BSC 0.301 0.311 7.65 7.90’ L 0.025 0.037 0.63 0.95 8 deg. 0 deg. N 20 0 deg. 9 0.65 BSC H α NOTES: MILLIMETERS MIN A1 e A2 A1 B 0.25(0.010) M L SYMBOL 6 20 7 8 deg. Rev. 3 11/02 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 25 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Thin Shrink Small Outline Plastic Packages (TSSOP) M28.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M SYMBOL 3 L 0.05(0.002) -A- SEATING PLANE A D -C- α e A2 A1 b 0.10(0.004) M 0.25 0.010 c 0.10(0.004) C A M B S MIN 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AE, Issue E. MILLIMETERS MIN MAX NOTES A - 0.047 - 1.20 - A1 0.002 0.006 0.05 0.15 - A2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - D 0.378 0.386 9.60 9.80 3 E1 0.169 0.177 4.30 4.50 4 e 0.026 BSC 0.65 BSC - E 0.246 0.256 6.25 6.50 - L 0.0177 0.0295 0.45 0.75 6 8o 0o N NOTES: MAX α 28 0o 28 7 8o Rev. 0 6/98 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 26 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) N 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E GAUGE PLANE -B1 2 3 L 0.25 0.010 SEATING PLANE -A- A D -C- α e B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 0.026 BSC H 0.292 L 0.022 N α NOTES: MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 28 0° - 8.20 - 0.95 6 28 8° 0° 7 8° Rev. 2 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 27 FN4910.20 September 15, 2008 ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B C 0.10(0.004) 0.25(0.010) M C A M B S MILLIMETERS MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 0.05 BSC 0.394 h 0.01 0.029 L 0.016 0.050 8o 0o N 0.419 1.27 BSC H α NOTES: MAX A1 e µα MIN 10.00 - 0.25 0.75 5 0.40 1.27 6 28 0o - 10.65 28 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 7 8o Rev. 0 12/93 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 28 FN4910.20 September 15, 2008