S-5741 Series
HIGH-WITHSTAND VOLTAGE
HIGH-SPEED BIPOLAR HALL EFFECT LATCH
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www.ablicinc.com
Rev.1.1_02
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© ABLIC Inc., 2014-2015
This product is intended to use in general electronic devices such as consumer electronics, office
equipment, and communications devices. Before using the product in medical equipment or automobile
equipment including car audio, keyless entry and engine control unit, contact to ABLIC Inc. is
indispensable.
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Caution
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The S-5741 Series, developed by CMOS technology, is a bipolar Hall effect latch with high-withstand voltage, high-speed
detection and high-accuracy magnetic characteristics.
The output voltage changes when the S-5741 Series detects the intensity level of magnetic flux density and a polarity
change. Using the S-5741 Series with a magnet makes it possible to detect the rotation status in various devices.
The S-5741 Series includes an output current limit circuit.
High-density mounting is possible by using the small SOT-23-3 package.
Due to its high-accuracy magnetic characteristics, the S-5741 Series can make operation's dispersion in the system
combined with magnet smaller.
Pole detection:
*1
Detection logic for magnetism :
Bipolar latch
VOUT = "L" at S pole detection
VOUT = "H" at S pole detection
Nch open-drain output
Nch driver built-in pull-up resistor
BOP = 1.8 mT typ.
BOP = 3.0 mT typ.
BOP = 6.0 mT typ.
tCYCLE = 8.0 s typ.
VDD = 3.5 V to 26.0 V
Magnetic sensitivity*1:
MM
EN
Operating cycle:
Power supply voltage range:
Built-in regulator
Built-in output current limit circuit
Operation temperature range:
Lead-free (Sn 100%), halogen-free
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*1
Output form :
FO
Features
Ta = 40C to 85C
Applications
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*1. The option can be selected.
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Home appliance
DC brushless motor
Housing equipment
Industrial equipment
Package
SOT-23-3
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Block Diagrams
Nch open-drain output product
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1.
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VDD
OUT
Regulator
*1
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Chopping
stabilized
amplifier
Output current limit circuit
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VSS
*1. Parasitic diode
FO
Nch driver built-in pull-up resistor product
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2.
R
Figure 1
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VDD
OUT
CO
VSS
MM
EN
Regulator
Chopping
stabilized
amplifier
Output current limit circuit
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*1. Parasitic diode
2
Figure 2
*1
HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Product Name Structure
S-5741
x
B
x
x
-
M3T2
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Product name
U
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1.
Environmental code
U: Lead-free (Sn 100%), halogen-free
Package name (abbreviation) and packing specifications*1
M3T2: SOT-23-3, Tape
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Magnetic sensitivity
0: BOP = 1.8 mT typ.
1: BOP = 3.0 mT typ.
2: BOP = 6.0 mT typ.
R
Detection logic for magnetism
L: VOUT = "L" at S pole detection
H: VOUT = "H" at S pole detection
FO
Pole detection
B: Bipolar latch
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Output form
N: Nch open-drain output
R: Nch driver built-in pull-up resistor
*1. Refer to the tape drawing.
Package
MM
EN
2.
Table 1
Package Name
SOT-23-3
Product name list
Tape
Reel
MP003-C-C-SD
MP003-Z-R-SD
Output Form
Table 2
Pole Detection
S-5741NBL1-M3T2U
Nch open-drain output
Bipolar latch
S-5741NBL2-M3T2U
Nch open-drain output
Bipolar latch
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Product Name
Dimension
MP003-C-P-SD
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3.
Package Drawing Codes
S-5741RBL0-M3T2U
Nch driver built-in pull-up resistor Bipolar latch
S-5741RBL1-M3T2U
Nch driver built-in pull-up resistor Bipolar latch
S-5741RBH1-M3T2U
Nch driver built-in pull-up resistor Bipolar latch
Detection Logic
Magnetic
for Magnetism
Sensitivity (BOP)
VOUT = "L" at S pole
3.0 mT typ.
detection
VOUT = "L" at S pole
6.0 mT typ.
detection
VOUT = "L" at S pole
1.8 mT typ.
detection
VOUT = "L" at S pole
3.0 mT typ.
detection
VOUT = "H" at S pole
3.0 mT typ.
detection
Remark Please contact our sales office for products other than the above.
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Pin Configuration
SOT-23-3
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1.
Table 3
Pin No.
1
2
Symbol
Description
1
VSS
GND pin
2
VDD
Power supply pin
3
OUT
Output pin
3
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Figure 3
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Absolute Maximum Ratings
R
Table 4
Symbol
(Ta = 25C unless otherwise specified)
Absolute Maximum Rating
Unit
VSS 0.3 to VSS 28.0
20
mA
VSS 0.3 to VSS 28.0
V
VSS 0.3 to VDD 0.3
430*1
mW
Topr
40 to 85
C
Tstg
40 to 125
C
FO
Item
Power supply voltage
VDD
Output current
Output voltage
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Top view
IOUT
Nch open-drain output product
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Nch driver built-in pull-up resistor product
Power dissipation
Operation ambient temperature
Storage temperature
VOUT
PD
V
V
MM
EN
*1. When mounted on board
[Mounted board]
(1) Board size:
114.3 mm 76.2 mm t1.6 mm
(2) Board name:
JEDEC STANDARD51-7
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
400
200
0
0
Figure 4
4
Power Dissipation (PD) [mW]
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600
150
100
50
Ambient Temperature (Ta) [C]
Power Dissipation of Package (When Mounted on Board)
HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Electrical Characteristics
Table 5
IDD
Output voltage
VOUT
VD
Leakage current
ILEAK
Operating cycle
tCYCLE
Operating frequency
fCYCLE
Output limit current
IOM
Start up time
tPON
Pull-up resistor
RL
N
12.0
26.0
V
3.0
4.0
mA
1
3.0
4.0
mA
1
0.4
V
2
0.5
V
2
20
mV
2
10
A
3
8.0
s
125
kHz
22
70
mA
3
VOUT = 12.0 V
20
s
4
Nch driver built-in pull-up resistor product
7
10
13
k
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Output drop voltage
3.5
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Current consumption
Nch open-drain output product
Average value
Nch driver built-in pull-up resistor product
Average value, VOUT = "H"
Nch open-drain output product
Output transistor Nch, VOUT = "L", IOUT = 10 mA
Nch driver built-in pull-up resistor product
Output transistor Nch, VOUT = "L", IOUT = 10 mA
Nch driver built-in pull-up resistor product
VOUT = "H", VD = VDD VOUT
Nch open-drain output product
Output transistor Nch, VOUT = "H" = 26.0 V
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VDD
R
Power supply voltage
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Symbol
FO
Item
(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Test
Condition
Min. Typ. Max. Unit
Circuit
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Magnetic Characteristics
Product with BOP = 1.8 mT typ.
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1.
Table 6
Item
Operation point*1
S pole
Release point*2
N pole
*3
Hysteresis width
Condition
BHYS = BOP BRP
Min.
0.3
3.3
Product with BOP = 3.0 mT typ.
Typ.
1.8
1.8
3.6
Max.
3.3
0.3
Unit
mT
mT
mT
Test Circuit
4
4
4
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2.
Symbol
BOP
BRP
BHYS
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(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Table 7
2.
Condition
BHYS = BOP BRP
Min.
1.5
4.5
R
Symbol
BOP
BRP
BHYS
Typ.
3.0
3.0
6.0
Max.
4.5
1.5
FO
Item
Operation point*1
S pole
Release point*2
N pole
Hysteresis width*3
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(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Product with BOP = 6.0 mT typ.
Unit
mT
mT
mT
Test Circuit
4
4
4
Table 8
The unit of magnetic density mT can be converted by using the formula 1 mT = 10 Gauss.
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Remark
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(Ta = 25C, VDD = 12.0 V, VSS = 0 V unless otherwise specified)
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
Test Circuit
Operation point*1
3.0
6.0
9.0
mT
4
S pole
BOP
Release point*2
9.0
6.0
3.0
mT
4
N pole
BRP
*3
Hysteresis width
BHYS = BOP BRP
12.0
mT
4
BHYS
*1. BOP: Operation point
BOP is the value of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux density applied
to the S-5741 Series by the magnet (S pole) is increased (by moving the magnet closer).
VOUT retains the status until a magnetic flux density of the N pole higher than BRP is applied.
*2. BRP: Release point
BRP is the value of magnetic flux density when the output voltage (VOUT) changes after the magnetic flux density applied
to the S-5741 Series by the magnet (N pole) is increased (by moving the magnet closer).
VOUT retains the status until a magnetic flux density of the S pole higher than BOP is applied.
*3. BHYS: Hysteresis width
BHYS is the difference of magnetic flux density between BOP and BRP.
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Test Circuits
A
N
*1
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820
VDD
S-5741
Series OUT
Resistor (R) is unnecessary for the pull-up resistor built-in product.
Figure 5
Test Circuit 1
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*1.
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VSS
S-5741
Series OUT
A
VSS
Test Circuit 2
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Figure 6
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FO
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VDD
VDD
S-5741
Series OUT
A
VSS
CO
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Figure 7 Test Circuit 3
*1.
*1
VDD
R
820
S-5741
Series OUT
VSS
V
Resistor (R) is unnecessary for the pull-up resistor built-in product.
Figure 8
Test Circuit 4
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
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Standard Circuit
*1
VDD
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820
S-5741
Series OUT
CIN
0.1 F
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VSS
NE
*1. Resistor (R) is unnecessary for the pull-up resistor built-in product.
Figure 9
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Caution The above connection diagram and constant will not guarantee successful operation. Perform
thorough evaluation using the actual application to set the constant.
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Operation
Direction of applied magnetic flux
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The S-5741 Series detects the magnetic flux density which is vertical to the marking surface.
Figure 10 shows the direction in which magnetic flux is being applied.
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1.
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N
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Marking surface
Figure 10
Position of Hall sensor
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2.
Figure 11 shows the position of Hall sensor.
The center of this Hall sensor is located in the area indicated by a circle, which is in the center of a package as
described below.
The following also shows the distance (typ. value) between the marking surface and the chip surface of a package.
The center of Hall sensor;
in this 0.3 mm
1
2
3
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Top view
0.7 mm (typ.)
Figure 11
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
3.
Basic operation
3. 1
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The S-5741 Series changes the output voltage (VOUT) according to the level of the magnetic flux density and a polarity
change (N pole or S pole) applied by a magnet.
Definition of the magnetic field is performed every operating cycle indicated in " Electrical Characteristics".
Product with VOUT = "L" at S pole detection
W
When the magnetic flux density of the S pole perpendicular to the marking surface exceeds the operation point
(BOP) after the S pole of a magnet is moved closer to the marking surface of the S-5741 Series, VOUT changes from
"H" to "L". When the N pole of a magnet is moved closer to the marking surface of the S-5741 Series and the
magnetic flux density of the N pole is higher than the release point (BRP), VOUT changes from "L" to "H". In case of
BRP B BOP, VOUT retains the status. Figure 12 shows the relationship between the magnetic flux density and
VOUT.
VOUT
H
FO
R
NE
BHYS
S pole
0
BOP
DE
BRP
D
N pole
L
Magnetic flux density (B)
3. 2
MM
EN
Figure 12
Product with VOUT = "H" at S pole detection
CO
When the magnetic flux density of the S pole perpendicular to the marking surface exceeds BOP after the S pole of a
magnet is moved closer to the marking surface of the S-5741 Series, VOUT changes from "L" to "H". When the
N pole of a magnet is moved closer to the marking surface of the S-5741 Series and the magnetic flux density of the
N pole is higher than BRP, VOUT changes from "H" to "L". In case of BRP B BOP, VOUT retains the status.
Figure 13 shows the relationship between the magnetic flux density and VOUT.
VOUT
BHYS
NO
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H
L
N pole
S pole
BRP
0
BOP
Magnetic flux density (B)
Figure 13
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HIGH-WITHSTAND VOLTAGE HIGH-SPEED BIPOLAR HALL EFFECT LATCH
Rev.1.1_02
S-5741 Series
Precautions
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If the impedance of the power supply is high, the IC may malfunction due to a supply voltage drop caused by feedthrough current. Take care with the pattern wiring to ensure that the impedance of the power supply is low.
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Note that the IC may malfunction if the power supply voltage rapidly changes. When the IC is used under the
environment where the power supply voltage rapidly changes, it is recommended to judge the output voltage of the IC
by reading it multiple times.
Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
Although this IC has a built-in output current limit circuit, it may suffer physical damage such as product deterioration
under the environment where the absolute maximum ratings are exceeded.
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The application conditions for the power supply voltage, the pull-up voltage, and the pull-up resistor should not exceed
the package power dissipation.
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Large stress on this IC may affect on the magnetic characteristics. Avoid large stress which is caused by bend and
distortion during mounting the IC on a board or handle after mounting.
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ABLIC Inc. claims no responsibility for any disputes arising out of or in connection with any infringement by products
including this IC of patents owned by a third party.
11
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2.9±0.2
2
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1
3
+0.1
0.16 -0.06
0.95±0.1
FO
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1.9±0.2
MM
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0.4±0.1
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No. MP003-C-P-SD-1.1
TITLE
SOT233-C-PKG Dimensions
No.
MP003-C-P-SD-1.1
ANGLE
UNIT
mm
ABLIC Inc.
+0.1
4.0±0.1
2.0±0.1
+0.25
4.0±0.1
0.23±0.1
1.4±0.2
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ø1.0 -0
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ø1.5 -0
1
3
MM
EN
2
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FO
R
3.2±0.2
CO
Feed direction
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No. MP003-C-C-SD-2.0
TITLE
SOT233-C-Carrier Tape
No.
MP003-C-C-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
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12.5max.
D
9.2±0.5
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Enlarged drawing in the central part
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ø13±0.2
NO
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No. MP003-Z-R-SD-1.0
SOT233-C-Reel
TITLE
MP003-Z-R-SD-1.0
No.
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
3,000
Disclaimers (Handling Precautions)
All the information described herein (product data, specifications, figures, tables, programs, algorithms and application
circuit examples, etc.) is current as of publishing date of this document and is subject to change without notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
ABLIC Inc. is not responsible for damages caused by the reasons other than the products described herein
(hereinafter "the products") or infringement of third-party intellectual property right and any other right due to the use
of the information described herein.
3.
ABLIC Inc. is not responsible for damages caused by the incorrect information described herein.
4.
Be careful to use the products within their specified ranges. Pay special attention to the absolute maximum ratings,
operation voltage range and electrical characteristics, etc.
ABLIC Inc. is not responsible for damages caused by failures and / or accidents, etc. that occur due to the use of the
products outside their specified ranges.
5.
When using the products, confirm their applications, and the laws and regulations of the region or country where they
are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related
laws, and follow the required procedures.
7.
The products must not be used or provided (exported) for the purposes of the development of weapons of mass
destruction or military use. ABLIC Inc. is not responsible for any provision (export) to those whose purpose is to
develop, manufacture, use or store nuclear, biological or chemical weapons, missiles, or other military use.
8.
The products are not designed to be used as part of any device or equipment that may affect the human body, human
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses. Do
not apply the products to the above listed devices and equipments without prior written permission by ABLIC Inc.
Especially, the products cannot be used for life support devices, devices implanted in the human body and devices
that directly affect human life, etc.
Prior consultation with our sales office is required when considering the above uses.
ABLIC Inc. is not responsible for damages caused by unauthorized or unspecified use of our products.
9.
Semiconductor products may fail or malfunction with some probability.
The user of the products should therefore take responsibility to give thorough consideration to safety design including
redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or
death, fires and social damage, etc. that may ensue from the products' failure or malfunction.
The entire system must be sufficiently evaluated and applied on customer's own responsibility.
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1.
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the
product design by the customer depending on the intended use.
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11. The products do not affect human health under normal use. However, they contain chemical substances and heavy
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be
careful when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.
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13. The information described herein contains copyright information and know-how of ABLIC Inc.
The information described herein does not convey any license under any intellectual property rights or any other
rights belonging to ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any
part of this document described herein for the purpose of disclosing it to a third-party without the express permission
of ABLIC Inc. is strictly prohibited.
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14. For more details on the information described herein, contact our sales office.
2.0-2018.01
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