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MC74HC245ADTEL

MC74HC245ADTEL

  • 厂商:

    ROCHESTER(罗切斯特)

  • 封装:

    TSSOP20

  • 描述:

    IC TXRX NON-INVERT 6V 20TSSOP

  • 数据手册
  • 价格&库存
MC74HC245ADTEL 数据手册
MC74HC245A Octal 3-State Noninverting Bus Transceiver High–Performance Silicon–Gate CMOS The MC74HC245A is identical in pinout to the LS245. The device inputs are compatible with standard CMOS outputs; with pull–up resistors, they are compatible with LSTTL outputs. The HC245A is a 3–state noninverting transceiver that is used for 2–way asynchronous communication between data buses. The device has an active–low Output Enable pin, which is used to place the I/O ports into high–impedance states. The Direction control determines whether data flows from A to B or from B to A. • • • • • • http://onsemi.com MARKING DIAGRAMS MC74HC245AN AWLYYWW 20 Output Drive Capability: 15 LSTTL Loads 1 Outputs Directly Interface to CMOS, NMOS, and TTL PDIP–20 N SUFFIX CASE 783 Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A Moisture Sensitivity: MSL1 for All Packages • • Chip Complexity: 308 FETs or 77 Equivalent Gates HC245A AWLYYWW 20 1 SO–20 DW SUFFIX CASE 751D 20 1 HC245A ALYW TSSOP–20 DT SUFFIX CASE 948E A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week ORDERING INFORMATION Device Package Shipping MC74HC245AN PDIP–20 18 Units/Rail MC74HC245ADW SOIC–20 38 Units/Rail MC74HC245ADWR2 SOIC–20 1000 Tape & Reel MC74HC245ADT TSSOP–20 75 Units/Rail MC74HC245ADTR2 TSSOP–20 2500 Tape & Reel  Semiconductor Components Industries, LLC, 2001 July, 2001 – Rev. 10 1 Publication Order Number: MC74HC245A/D MC74HC245A DIRECTION 1 20 VCC A1 2 19 OUTPUT ENABLE A2 3 18 B1 A3 4 17 B2 A4 5 16 B3 A5 6 15 B4 A6 7 14 B5 A7 8 13 B6 A8 9 12 B7 10 11 B8 GND Figure 1. Pin Assignment FUNCTION TABLE Control Inputs Output Enable Direction L L Data Transmitted from Bus B to Bus A L H Data Transmitted from Bus A to Bus B H X Buses Isolated (High–Impedance State) Operation X = don’t care A1 A2 A3 A DATA PORT A4 A5 A6 A7 A8 DIRECTION OUTPUT ENABLE 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 1 19 PIN 10 = GND PIN 20 = VCC Figure 2. Logic Diagram http://onsemi.com 2 B1 B2 B3 B4 B5 B6 B7 B8 B DATA PORT MC74HC245A MAXIMUM RATINGS (Note 1.) Symbol Parameter Value Unit 0.5 to 7.0 V 0.5 to VCC 0.5 V 0.5 to VCC 0.5 V VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current 20 mA IOK DC Output Diode Current 35 mA IOUT DC Output Sink Current 35 mA ICC DC Supply Current per Supply Pin 75 mA IGND DC Ground Current per Ground Pin 75 mA TSTG Storage Temperature Range 65 to 150 C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction Temperature Under Bias 150 C JA Thermal Resistance PDIP SOIC TSSOP 67 96 128 C/W PD Power Dissipation in Still Air at 85C PDIP SOIC TSSOP 750 500 450 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 3.) Machine Model (Note 4.) Charged Device Model (Note 5.) 2000 200 1000 V ILATCH–UP Latch–Up Performance Above VCC and Below GND at 85C (Note 6.) 300 mA (Note 2.) Level 1 Oxygen Index: 30% to 35% UL 94 V–0 @ 0.125 in Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 20 ounce copper trace with no air flow. 2. IO absolute maximum rating must observed. 3. Tested to EIA/JESD22–A114–A. 4. Tested to EIA/JESD22–A115–A. 5. Tested to JESD22–C101–A. 6. Tested to EIA/JESD78. ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC DC Supply Voltage (Referenced to GND) Vin, Vout DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 3) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V http://onsemi.com 3 Min Max Unit 2.0 6.0 V 0 VCC V –55 +125 C 0 0 0 1000 500 400 ns MC74HC245A ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit VCC V –55 to 25C  85C  125C Unit VIH Minimum High–Level Input Voltage Vout = VCC – 0.1 V |Iout|  20 A 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 V VIL Maximum Low–Level Input Voltage Vout = 0.1 V |Iout|  20 A 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 V VOH Minimum High–Level Output Voltage Vin = VIH |Iout|  20 A 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.2 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.4 0.4 0.4 Symbol Parameter Test Conditions |Iout|  2.4 mA |Iout|  6.0 mA |Iout|  7.8 mA Vin = VIH VOL Maximum Low–Level Output Voltage Vin = VIL |Iout|  20 A |Iout|  2.4 mA |Iout|  6.0 mA |Iout|  7.8 mA Vin = VIL V Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ± 0.1 ± 1.0 ± 1.0 A IOZ Maximum Three–State Leakage Current Output in High–Impedance State Vin = VIL or VIH Vout = VCC or GND 6.0 ± 0.5 ± 5.0 ± 10 A ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0 A 6.0 4.0 40 160 A 7. Information on typical parametric values and high frequency or heavy load considerations can be found in the ON Semiconductor High–Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) VCC V Guaranteed Limit –55 to 25C  85C  125C Unit tPLH, tPHL Maximum Propagation Delay, A to B, B to A (Figures 1 and 3) 2.0 3.0 4.5 6.0 75 55 15 13 95 70 19 16 110 80 22 19 ns tPLZ, tPHZ Maximum Propagation Delay, Direction or Output Enable to A or B (Figures 2 and 4) 2.0 3.0 4.5 6.0 110 90 22 19 140 110 28 24 165 130 33 28 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to A or B (Figures 2 and 4) 2.0 3.0 4.5 6.0 110 90 22 19 140 110 28 24 165 130 33 28 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 3) 2.0 3.0 4.5 6.0 60 23 12 10 75 27 15 13 90 32 18 15 ns Cin Maximum Input Capacitance (Pin 1 or Pin 19) — 10 10 10 pF Cout Maximum Three–State I/O Capacitance (I/O in High–Impedance State) — 15 15 15 pF Symbol Parameter 8. For propagation delays with loads other than 50 pF, and information on typical parametric values, see the ON Semiconductor High–Speed CMOS Data Book (DL129/D). Typical @ 25°C, VCC = 5.0 V 40 CPD Power Dissipation Capacitance (Per Transceiver Channel) (Note 9.) pF 9. Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see the ON Semiconductor High–Speed CMOS Data Book (DL129/D). http://onsemi.com 4 MC74HC245A VCC DIRECTION 50% GND tf tr INPUT A OR B VCC 90% 50% 10% GND tPLH OUTPUT B OR A VCC OUTPUT ENABLE 50% GND 90% 50% 10% A OR B tTLH tTHL Figure 3. Switching Waveform tPHZ 10% VOL 90% VOH 50% HIGH IMPEDANCE Figure 4. Switching Waveform TEST POINT TEST POINT OUTPUT OUTPUT CL * HIGH IMPEDANCE 50% tPZH A OR B DEVICE UNDER TEST tPLZ tPZL tPHL DEVICE UNDER TEST *Includes all probe and jig capacitance 1 kΩ CL * CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 5. Test Circuit Figure 6. Test Circuit http://onsemi.com 5 MC74HC245A A1 2 18 A2 3 17 A3 A5 OUTPUT ENABLE B7 9 11 DIRECTION B6 8 12 A8 B5 7 13 A7 B4 6 14 A6 B3 5 15 A DATA PORT B2 4 16 A4 B1 1 19 Figure 7. Expanded Logic Diagram http://onsemi.com 6 B8 B DATA PORT MC74HC245A PACKAGE DIMENSIONS PDIP–20 N SUFFIX PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M T B M M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0 15  0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0 15 0.51 1.01 SO–20 DW SUFFIX CASE 751D–05 ISSUE F  A 20 X 45  M E h 0.25 1 10 20X B B 0.25 M T A S B S A L H 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE C T http://onsemi.com 7 DIM A A1 B C D E e H h L  MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0 7 MC74HC245A PACKAGE DIMENSIONS TSSOP–20 DT SUFFIX 20 PIN PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S 20 L/2 M T U S V S K K1 11 B L J J1 –U– PIN 1 IDENT ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E –W– C D G H DETAIL E 0.100 (0.004) –T– SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 PLANE ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 8 MC74HC245A/D
MC74HC245ADTEL 价格&库存

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